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    Finger metal oxide metal capacitor structures
    2.
    发明授权
    Finger metal oxide metal capacitor structures 有权
    手指金属氧化物金属电容器结构

    公开(公告)号：US08963286B2

    公开(公告)日：2015-02-24

    申请号：US13465605

    申请日：2012-05-07

    申请人： Hung Sheng Lin ,  Shingo Hatanaka ,  Shafiq M. Jamal

    发明人： Hung Sheng Lin ,  Shingo Hatanaka ,  Shafiq M. Jamal

    IPC分类号： H01L21/02 ,  H01L23/522 ,  H01L49/02

    CPC分类号： H01L23/5223 ,  H01L23/5225 ,  H01L23/5226 ,  H01L28/82 ,  H01L28/86 ,  H01L28/90 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A finger metal oxide metal (MOM) capacitor includes an outer conducting structure defined in a plurality of metal layers and a plurality of via layers of an integrated circuit. First and second side portions include a plurality of first and second finger sections extending in the plurality of metal layers and first and second hole vias connecting the first and second finger sections, respectively. A middle portion connects the first and second side portions. An inner conducting structure is defined in the plurality of metal layers and the plurality of via layers of the integrated circuit. A plurality of “T”-shaped sections are defined in the plurality of metal layers and third hole vias connecting the plurality of “T”-shaped sections. Middle portions of the plurality of “T”-shaped sections extend towards the middle portion and between the first side portion and the second side portion of the outer conducting structure.

    摘要翻译： 手指金属氧化物金属（MOM）电容器包括限定在多个金属层中的外部导电结构和集成电路的多个通孔层。 第一和第二侧部分包括在多个金属层中延伸的多个第一和第二指状部分以及分别连接第一和第二指状部分的第一和第二通孔。 中间部分连接第一和第二侧部。 内部导电结构限定在集成电路的多个金属层和多个通孔层中。 在连接多个“T”形部分的多个金属层和第三孔通孔中限定了多个“T”形部分。 多个“T”形部分的中部朝着外部导电结构的中间部分和第一侧部分和第二侧部分之间延伸。

    Systems and methods for providing an analog-to-digital converter that uses reduced power and supply voltage
    3.
    发明授权
    Systems and methods for providing an analog-to-digital converter that uses reduced power and supply voltage 有权
    用于提供使用降低的功率和电源电压的模数转换器的系统和方法

    公开(公告)号：US08730082B1

    公开(公告)日：2014-05-20

    申请号：US13196262

    申请日：2011-08-02

    申请人： Hung Sheng Lin ,  Ovidiu Carnu ,  Shingo Hatanaka

    发明人： Hung Sheng Lin ,  Ovidiu Carnu ,  Shingo Hatanaka

    IPC分类号： H03M1/12

    CPC分类号： H03M1/002 ,  H03M1/0695 ,  H03M1/442

    摘要： Methods and systems are described for providing an analog-to-digital converter that uses reduced power and supply voltage. In one embodiment, an analog-to-digital converter comprises a sample phase configured to sample an analog signal with at least three capacitors, wherein at least two of the three capacitors have unequal capacitance to cause the analog-to-digital converter to have a feedback factor that is greater than 1/3. The analog-to-digital converter also includes a feedback phase configured to produce a digital output signal based at least in part on the sampled analog signal, wherein the analog-to-digital converter is configured to operate with a supply voltage equal to about one half of an input signal voltage range of the analog signal.

    摘要翻译： 描述了用于提供使用降低的功率和电源电压的模拟 - 数字转换器的方法和系统。 在一个实施例中，模数转换器包括被配置为用至少三个电容器对模拟信号进行采样的采样相位，其中三个电容器中的至少两个具有不相等的电容，以使模数转换器具有 反馈因子大于1/3。 模数转换器还包括被配置为至少部分地基于采样的模拟信号产生数字输出信号的反馈相位，其中模数转换器被配置为以等于大约一的电源电压 模拟信号的输入信号电压范围的一半。

    Frame timing acquisition method and system for cordless TDMA systems
    4.
    发明授权
    Frame timing acquisition method and system for cordless TDMA systems 失效
    无线TDMA系统的帧定时采集方法和系统

    公开(公告)号：US5570370A

    公开(公告)日：1996-10-29

    申请号：US430601

    申请日：1995-04-28

    申请人： Hung-Sheng Lin

    发明人： Hung-Sheng Lin

    IPC分类号： H04B7/26 ,  H04J3/06 ,  H04L7/04

    CPC分类号： H04J3/0605 ,  H04B7/2643 ,  H04L7/048

    摘要： A frame timing acquisition system and method are provided including a correlator for comparing a first fixed length subsequence of bits of a received bitstream to a predetermined sync word. A CRC check circuit is provided for, in response to the correlator determining that the first fixed length subsequence of bits matches the predetermined sync word, if a third fixed length subsequence of bits of the bitstream is a cyclical redundancy code parity word formed from a second fixed length subsequence of bits of the bitstream. A decision circuit is also provided for identifying boundaries of a frame of the received bitstream in response to the CRC check circuit determining that the third fixed length subsequence of bits is a cyclical redundancy check parity word of the second fixed length subsequence of bits. According to the inventive method and system, a sync word need be identified in only a single slot of the frame in order to acquire the frame timing.

    摘要翻译： 提供了一种帧定时获取系统和方法，包括用于将接收的比特流的比特的第一固定长度子序列与预定同步字进行比较的相关器。 提供CRC校验电路，用于响应于相关器确定位的第一固定长度子序列与预定同步字匹配，如果比特流的比特的比特的第三固定长度子序列是由第二个比特形成的循环冗余码奇偶校验字 比特流的比特的固定长度子序列。 还提供了一种判定电路，用于响应于CRC校验电路确定位的第三固定长度子序列是第二固定长度子序列的循环冗余校验奇偶校验字，来识别接收到的比特流的帧的边界。 根据本发明的方法和系统，需要在帧的单个时隙中识别同步字以获取帧定时。

    Heat conductive plate structure
    5.
    发明授权
    Heat conductive plate structure 有权
    导热板结构

    公开(公告)号：US08030759B2

    公开(公告)日：2011-10-04

    申请号：US12425850

    申请日：2009-04-17

    申请人： Yu-Wei Wang ,  Hung-Sheng Lin

    发明人： Yu-Wei Wang ,  Hung-Sheng Lin

    IPC分类号： H01L23/10

    CPC分类号： H01L23/3677 ,  H01L23/142 ,  H01L2924/0002 ,  H01L2924/09701 ,  Y10T29/4935 ,  H01L2924/00

    摘要： A heat conductive plate structure includes a base metal plate having a seating portion; a coupling layer disposed above the base metal plate around the seating portion; an electric conduction layer disposed above the coupling layer around the seating portion to define a clearance therebetween; a coupling film disposed above the electric conduction layer and the seating portion to define an inner clearance in communication with the clearance of the electric conduction layer and an outer clearance surrounding the inner clearance; a non-weldable material for inserting into the inner clearance and the outer clearance in the coupling film; a heat conduction member disposed on a central portion of the coupling film; an electric conduction member disposed above the coupling film to surround the heat conduction member from an exterior thereof; and a high power element mounted above so as to be in direct contact with the heat conduction member and the electric conduction member simultaneously.

    摘要翻译： 导热板结构包括具有底座部分的基底金属板; 耦合层，设置在所述基座金属板的周围所述座部部分的上方; 导电层，其设置在所述连接层的围绕所述座部的上方，以限定其间的间隙; 设置在所述导电层上方的耦合膜和所述座部，以限定与所述导电层的间隙连通的内部间隙和围绕所述内部间隙的外部间隙; 用于插入联接膜中的内部间隙和外部间隙中的不可焊接材料; 设置在所述耦合膜的中心部分上的导热构件; 导电构件，设置在所述耦合膜的上方，以从其外部包围所述导热构件; 以及安装在上方以与导热构件和导电构件直接接触的高功率元件。

    Threshold driven dynamic comparator
    6.
    发明授权
    Threshold driven dynamic comparator 有权
    门限驱动动态比较器

    公开(公告)号：US08212706B1

    公开(公告)日：2012-07-03

    申请号：US12822443

    申请日：2010-06-24

    申请人： Hung Sheng Lin ,  Shafiq Jamal ,  Shingo Hatanaka ,  Xiaoyue Wang

    发明人： Hung Sheng Lin ,  Shafiq Jamal ,  Shingo Hatanaka ,  Xiaoyue Wang

    IPC分类号： H03M1/34

    CPC分类号： H03M1/42

    摘要： In one embodiment, a method receives an analog input voltage. The method also receives a threshold from a plurality of thresholds. A comparator performs a comparison of the input voltage with the received threshold and outputs an output value based on the comparison of the analog input voltage with the received threshold. The output value is for converting the analog input voltage to a digital value. The method determines if the threshold should be adjusted based on the comparison and adjusts the threshold when it is determined the threshold should be adjusted.

    摘要翻译： 在一个实施例中，一种方法接收模拟输入电压。 该方法还从多个阈值接收阈值。 比较器执行输入电压与接收到的阈值的比较，并且基于模拟输入电压与接收到的阈值的比较来输出输出值。 输出值用于将模拟输入电压转换为数字值。 该方法确定是否应根据比较调整阈值，并在确定阈值应调整时调整阈值。

    Systems and methods for providing an analog-to-digital converter that uses reduced power and supply voltage
    7.
    发明授权
    Systems and methods for providing an analog-to-digital converter that uses reduced power and supply voltage 有权
    用于提供使用降低的功率和电源电压的模数转换器的系统和方法

    公开(公告)号：US07994961B1

    公开(公告)日：2011-08-09

    申请号：US12480977

    申请日：2009-06-09

    申请人： Hung Sheng Lin ,  Ovidiu Carnu ,  Shingo Hatanaka

    发明人： Hung Sheng Lin ,  Ovidiu Carnu ,  Shingo Hatanaka

    IPC分类号： H03M1/12

    CPC分类号： H03M1/002 ,  H03M1/0695 ,  H03M1/442

    摘要： Methods and systems are described for providing an analog-to-digital converter that uses reduced power and supply voltage. The analog-to-digital converter includes a sample phase configured to sample an incoming analog signal having an input signal range and compare the incoming analog signal to a reference voltage. The analog-to-digital converter also includes a feedback phase wherein the feedback phase receives sampled signal data corresponding to the incoming analog signal from the sample phase and is configured to produce an output signal comprising an output signal range, wherein the output signal range is equal to one half of the input signal range, and wherein the analog-to-digital converter has a feedback factor that is substantially greater than ⅓.

    摘要翻译： 描述了用于提供使用降低的功率和电源电压的模拟 - 数字转换器的方法和系统。 模数转换器包括被配置为对具有输入信号范围的输入模拟信号进行采样并将输入模拟信号与参考电压进行比较的采样相位。 模数转换器还包括反馈阶段，其中反馈相位接收对应于来自采样相位的输入模拟信号的采样信号数据，并被配置为产生包括输出信号范围的输出信号，其中输出信号范围为 等于输入信号范围的一半，并且其中模数转换器具有基本上大于1/3的反馈因数。

    HEAT CONDUCTIVE PLATE STRUCTURE
    8.
    发明申请
    HEAT CONDUCTIVE PLATE STRUCTURE 有权
    热传导板结构

    公开(公告)号：US20100025030A1

    公开(公告)日：2010-02-04

    申请号：US12425850

    申请日：2009-04-17

    申请人： YU-WEI WANG ,  HUNG-SHENG LIN

    发明人： YU-WEI WANG ,  HUNG-SHENG LIN

    IPC分类号： F28F7/00 ,  B21D53/04

    CPC分类号： H01L23/3677 ,  H01L23/142 ,  H01L2924/0002 ,  H01L2924/09701 ,  Y10T29/4935 ,  H01L2924/00

    摘要： A heat conductive plate structure includes a base metal plate having a seating portion; a coupling layer disposed above the base metal plate around the seating portion; an electric conduction layer disposed above the coupling layer around the seating portion to define a clearance therebetween; a coupling film disposed above the electric conduction layer and the seating portion to define an inner clearance in communication with the clearance of the electric conduction layer and an outer clearance surrounding the inner clearance; a non-weldable material for inserting into the inner clearance and the outer clearance in the coupling film; a heat conduction member disposed on a central portion of the coupling film; an electric conduction member disposed above the coupling film to surround the heat conduction member from an exterior thereof; and a high power element mounted above so as to be in direct contact with the heat conduction member and the electric conduction member simultaneously.

    摘要翻译： 导热板结构包括具有底座部分的基底金属板; 耦合层，设置在所述基座金属板的周围所述座部部分的上方; 导电层，其设置在所述连接层的围绕所述座部的上方，以限定其间的间隙; 设置在所述导电层上方的耦合膜和所述座部，以限定与所述导电层的间隙连通的内部间隙和围绕所述内部间隙的外部间隙; 用于插入联接膜中的内部间隙和外部间隙中的不可焊接材料; 设置在所述耦合膜的中心部分上的导热构件; 导电构件，设置在所述耦合膜的上方，以从其外部包围所述导热构件; 以及安装在上方以与导热构件和导电构件直接接触的高功率元件。

    Low power current-voltage mixed ADC architecture
    9.
    发明授权
    Low power current-voltage mixed ADC architecture 有权
    低功耗电流 - 电压混合ADC架构

    公开(公告)号：US08436760B1

    公开(公告)日：2013-05-07

    申请号：US12882496

    申请日：2010-09-15

    申请人： Shingo Hatanaka ,  Shafiq M. Jamal ,  Hung Sheng Lin ,  Ovidiu Carnu

    发明人： Shingo Hatanaka ,  Shafiq M. Jamal ,  Hung Sheng Lin ,  Ovidiu Carnu

    IPC分类号： H03M1/38

    CPC分类号： H03M1/34 ,  H03M1/38

    摘要： The present disclosure includes systems and techniques relating to low power current-voltage mixed ADC architecture. In some implementations, an apparatus includes sample and hold circuitry, at least one ADC module configured to generate a first digital output based on a first analog input provided to the sample and hold circuitry, and current generation circuitry configured to modulate an analog output of the sample and hold circuitry to generate a residue output corresponding to the first analog input absent at least a portion corresponding to the first digital output, and to provide the residue output as a second analog input to further circuitry to generate a second digital output.

    摘要翻译： 本公开包括与低功率电流 - 电压混合ADC架构相关的系统和技术。 在一些实现中，装置包括采样和保持电路，至少一个ADC模块被配置为基于提供给采样和保持电路的第一模拟输入产生第一数字输出，以及当前产生电路，其被配置为调制模拟输出 采样和保持电路以产生对应于第一模拟输入的残余输出，而不存在对应于第一数字输出的至少一部分，并且将剩余输出作为第二模拟输入提供给另外的电路以产生第二数字输出。

    FINGER METAL OXIDE METAL CAPACITOR STRUCTURES
    10.
    发明申请
    FINGER METAL OXIDE METAL CAPACITOR STRUCTURES 有权
    指状金属氧化物金属电容器结构

    公开(公告)号：US20120286393A1

    公开(公告)日：2012-11-15

    申请号：US13465605

    申请日：2012-05-07

    申请人： Hung Sheng Lin ,  Shingo Hatanaka ,  Shafiq M. Jamal

    发明人： Hung Sheng Lin ,  Shingo Hatanaka ,  Shafiq M. Jamal

    IPC分类号： H01L29/92

    CPC分类号： H01L23/5223 ,  H01L23/5225 ,  H01L23/5226 ,  H01L28/82 ,  H01L28/86 ,  H01L28/90 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A finger metal oxide metal (MOM) capacitor includes an outer conducting structure defined in a plurality of metal layers and a plurality of via layers of an integrated circuit. First and second side portions include a plurality of first and second finger sections extending in the plurality of metal layers and first and second hole vias connecting the first and second finger sections, respectively. A middle portion connects the first and second side portions. An inner conducting structure is defined in the plurality of metal layers and the plurality of via layers of the integrated circuit. A plurality of “T”-shaped sections are defined in the plurality of metal layers and third hole vias connecting the plurality of “T”-shaped sections. Middle portions of the plurality of “T”-shaped sections extend towards the middle portion and between the first side portion and the second side portion of the outer conducting structure.

    摘要翻译： 手指金属氧化物金属（MOM）电容器包括限定在多个金属层中的外部导电结构和集成电路的多个通孔层。 第一和第二侧部分包括在多个金属层中延伸的多个第一和第二指状部分以及分别连接第一和第二指状部分的第一和第二通孔。 中间部分连接第一和第二侧部。 内部导电结构限定在集成电路的多个金属层和多个通孔层中。 在连接多个T形部分的多个金属层和第三孔通孔中限定多个T形部分。 多个T形部分的中部朝着外部导电结构的中间部分和第一侧部分和第二侧部分之间延伸。