-
公开(公告)号：US07857010B1
公开(公告)日：2010-12-28
申请号：US11615599
申请日：2006-12-22
申请人： Howard L. Davidson
发明人： Howard L. Davidson
IPC分类号： F16L11/00
CPC分类号： F16L11/12 , F16L2011/047 , Y10S138/10
摘要： A low permeability hose system for providing an impermeable length of tube to transfer fluids that is flexible. The low permeability hose system generally includes a hose defining a fluid passage and an impermeable layer attached to the exterior surface of the hose. The impermeable layer is comprised of an aluminum coated heat sealable film that is impermeable to both liquids and gases. A protective layer may be attached to the impermeable layer to protect the impermeable layer from damage.
摘要翻译： 一种低渗透性软管系统，用于提供不透水长度的管以传输柔性的流体。 低渗透性软管系统通常包括限定流体通道的软管和附接到软管的外表面的不可渗透层。 不透水层由不透液体和气体的铝涂层可热封膜组成。 保护层可以附接到不渗透层以保护不渗透层免受损坏。
-
公开(公告)号：US06502419B2
公开(公告)日：2003-01-07
申请号：US09834080
申请日：2001-04-12
IPC分类号： F25B3300
CPC分类号： B82Y30/00 , F04B35/00 , F04B37/02 , F25B17/08 , F25B35/04 , Y10S977/734 , Y10S977/742 , Y10S977/842
摘要： A electro-desorption compression system according to the present invention comprises an enclosure which includes first and second spaced-apart electrical conductors, a sorbent which is positioned in the enclosure between the first and second conductors, a sorbate which is capable of combining with the sorbent in an adsorption reaction to form a sorbate/sorbent compound, a power supply which is connected to the first and second conductors and which generates an electrical current that is conducted through the sorbate/sorbent compound to desorb the sorbate from the sorbent in a desorption reaction, and a pressure chamber which is connected to the enclosure and which receives the sorbate from the enclosure during the desorption reaction and releases the sorbate into the enclosure during the adsorption reaction. The adsorption and desorption reactions are repeated to cycle the sorbate between a relatively low pressure state during the adsorption reaction and a relatively high pressure state during the desorption reaction. Furthermore, the desorption reaction is substantially non-thermal.
-
3.发明授权公开(公告)号：US06279337B1
公开(公告)日：2001-08-28
申请号：US09693344
申请日：2000-10-19
IPC分类号： F25D2312
CPC分类号： H05K7/20354 , F25B17/08 , F25B35/04 , F25B39/026 , F25B49/046 , F25B2333/005 , F25D23/12 , H01L23/427 , H01L2924/0002 , H01L2924/3011 , H05B6/701 , H05B6/802 , H05B6/808 , H05K7/20309 , H05K7/20363 , H05K7/20536 , H01L2924/00
摘要： To cool heat-emitting electronic components, a compact, non-moving-parts compressor, an evaporator in juxtaposition to the electronic components and a condenser are mounted as a unit, preferably within a vacuum can. A heat exchanger is mounted external to the can but in proximity to the condenser. The foregoing comprise a unit which may be detachably connected to a host pump and heat exchanger. The unit may be removed from the system of which it is a part for upgrade and maintenance. All its components are thermally isolated from the ambient atmosphere to prevent water vapor condensation corrosion.
摘要翻译： 为了冷却发热电子部件，紧凑的非移动部件压缩机，与电子部件和冷凝器并置的蒸发器作为一个单元安装，优选地安装在真空罐内。 热交换器安装在罐外部但在冷凝器附近。 前述内容包括可拆卸地连接到主机泵和热交换器的单元。 该单元可以从其作为升级和维护的一部分的系统中移除。 其所有部件均与环境大气隔热，防止水汽凝结。
-
公开(公告)号：US6166438A
公开(公告)日：2000-12-26
申请号：US816397
申请日：1997-02-26
申请人： Howard L. Davidson
发明人： Howard L. Davidson
IPC分类号： H01L21/58 , H01L21/68 , H01L21/98 , H01L23/48 , H01L25/065 , H01L23/485
CPC分类号： H01L21/6835 , H01L23/481 , H01L24/26 , H01L24/83 , H01L25/0657 , H01L25/50 , H01L2221/6835 , H01L2221/68359 , H01L2221/68363 , H01L2224/8319 , H01L2224/8385 , H01L2225/06513 , H01L2225/06541 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01033 , H01L2924/01049 , H01L2924/01072 , H01L2924/01074 , H01L2924/01075 , H01L2924/01079 , H01L2924/0132 , H01L2924/04941 , H01L2924/07802 , H01L2924/10329 , H01L2924/12042 , H01L2924/1305 , H01L2924/14 , H01L2924/19041 , H01L2924/19043 , H01L2924/30105 , Y10S438/975 , Y10S438/977 , H01L2924/01031 , H01L2924/00
摘要： An integrated circuit and associated method for reducing total signal propagation delay as well as power consumption and thermal dissipation. The integrated circuit comprises a plurality of active layers coupled together in close proximity. In order to produce the integrated circuit, at least two active layers are removed from their respective substrate after integrated circuit processing. Some of the methods that may be used include Silicon on Insulator ("SOI") and epitaxial etch stop ("EES") processes. After removal of the active layers, at least one via is implemented on a bottom surface of each active layer in order to establish a mechanical and electrical connection between the via and its associated metal interconnects. Thereafter, the active layers are coupled together by ultrasonic welding or through nitride lamination using Titanium Nitride for conductive regions and Silicon Nitride for insulative regions.
摘要翻译： 一种用于减少总信号传播延迟以及功耗和散热的集成电路和相关方法。 集成电路包括紧密接合在一起的多个有源层。 为了制造集成电路，在集成电路处理之后，从它们各自的衬底移除至少两个有源层。 可以使用的一些方法包括硅绝缘体（“SOI”）和外延蚀刻停止（“EES”）工艺。 在移除有源层之后，在每个有源层的底表面上实施至少一个通孔，以便在通孔及其相关联的金属互连之间建立机械和电连接。 此后，通过超声波焊接或通过用于导电区域的氮化钛和用于绝缘区域的氮化硅的氮化物层叠将有源层耦合在一起。
-
公开(公告)号：US5822108A
公开(公告)日：1998-10-13
申请号：US879507
申请日：1997-06-20
申请人： Howard L. Davidson
发明人： Howard L. Davidson
摘要： An integrated digital light modulator. In one embodiment, a light beam is split into a set of binary weighted beams which are then individually switched on or off by an optical switch. The weighted beams which are conveyed by the optical switches are then recombined to produce a modulated beam. In this manner, a fast inexpensive integrated digital light modulator may be advantageously obtained. Broadly speaking, the present invention contemplates a digital optical power modulator that comprises a binary power divider and an optical modulator. The binary power divider is configured to receive an input light beam and split it into a set of weighted beams. The optical powers of the weighted beams are related in that the ratio of the optical powers of any two weighted beams is substantially an integer power of two. The optical modulator receives the set of weighted beams from the binary power divider and receives a digital signal. The optical modulator is configured to convey weighted beams that correspond to asserted bits in the digital signal. The present invention may further include an optical combiner coupled to receive the weighted beams from the optical modulator and configured to combine the weighted beams to produce a modulated beam having a discrete optical power. A lookup table may be included to convert a desired digital power value into the digital signal provided to the optical modulator.
摘要翻译： 集成数字光调制器。 在一个实施例中，光束被分割成一组二进制加权光束，然后通过光学开关单独地接通或关闭光束。 然后将由光开关传送的加权光束重新组合以产生调制光束。 以这种方式，可以有利地获得快速廉价的集成数字光调制器。 广义而言，本发明考虑了一种包括二进制功率分配器和光调制器的数字光功率调制器。 二进制功率分配器被配置为接收输入光束并将其分成一组加权波束。 加权光束的光功率的关联在于，任何两个加权光束的光功率的比率基本上是2的整数倍。 光调制器从二进制功率分配器接收一组加权波束并接收数字信号。 光调制器被配置为传送对应于数字信号中的断言位的加权波束。 本发明还可以包括光学组合器，其被耦合以从光学调制器接收加权光束并且被配置为组合加权光束以产生具有分立光焦度的调制光束。 可以包括查找表以将期望的数字功率值转换为提供给光学调制器的数字信号。
-
6.发明授权Composite material having high thermal conductivity and process for fabricating same 失效具有高导热性的复合材料及其制造方法
公开(公告)号：US5783316A
公开(公告)日：1998-07-21
申请号：US703914
申请日：1996-08-22
CPC分类号： C22C26/00 , Y10T428/12479 , Y10T428/12493 , Y10T428/12625 , Y10T428/12806 , Y10T428/1284 , Y10T428/12847 , Y10T428/12882 , Y10T428/12903 , Y10T428/24975 , Y10T428/249967 , Y10T428/24997 , Y10T428/249986 , Y10T428/249987 , Y10T428/24999 , Y10T428/25 , Y10T428/2991 , Y10T428/31678
摘要： A process for fabricating a composite material such as that having high thermal conductivity and having specific application as a heat sink or heat spreader for high density integrated circuits. The composite material produced by this process has a thermal conductivity between that of diamond and copper, and basically consists of coated diamond particles dispersed in a high conductivity metal, such as copper. The composite material can be fabricated in small or relatively large sizes using inexpensive materials. The process basically consists, for example, of sputter coating diamond powder with several elements, including a carbide forming element and a brazeable material, compacting them into a porous body, and infiltrating the porous body with a suitable braze material, such as copper-silver alloy, thereby producing a dense diamond-copper composite material with a thermal conductivity comparable to synthetic diamond films at a fraction of the cost.
摘要翻译： 一种制造复合材料的方法，例如具有高导热性并具有特定应用的复合材料作为用于高密度集成电路的散热器或散热器。 通过该方法生产的复合材料具有金刚石和铜之间的导热性，并且基本上由分散在诸如铜的高导电性金属中的涂覆的金刚石颗粒组成。 复合材料可以使用廉价的材料制造成小尺寸或相对大的尺寸。 该方法基本上包括例如溅射镀金刚石粉末，其中包含几种元素，包括碳化物形成元件和可钎焊材料，将其压实成多孔体，并用合适的钎焊材料如铜 - 银渗透多孔体 合金，从而制造出具有与人造金刚石膜相当的热导率的致密金刚石 - 铜复合材料，成本仅为成本的一小部分。
-
公开(公告)号：US5661450A
公开(公告)日：1997-08-26
申请号：US560206
申请日：1995-11-21
申请人： Howard L. Davidson
发明人： Howard L. Davidson
CPC分类号： H04L25/0298 , H01C1/14 , H01C1/16 , H01C10/46 , Y10T29/49099
摘要： An array of termination resistors has symmetrical geometry producing essentially no net magnetic field and a resultant low inductance is fabricated on a substrate as disk resistors. Conductive through vias are formed in the substrate in an array pattern defining what will be resistor first and second contacts. Each disk resistor has one first contact located at the resistor disk center, and preferably four second contacts located symmetrically about the resistor disk and shared by four adjacent disk resistors. For each resistor, a annular-shaped disk of resistive material is fabricated on a first surface of the substrate, such that a central opening in the disk overlies at least the upper surface of a first contact via. The disk geometry and material determines its resistance. Next, a layer of conductive material is formed over the first surface of the substrate to cover at least the periphery of each disk, and to fill the central opening in each disk. This conductive material electrically couples at least the periphery of each resistive disk with each second contact via to define V.sub.T nodes, and also separately electrically couples the disk center to the underlying first contact via. Solder balls at the lower surface of each via provide an array of first and second contacts for each resistor for attaching the substrate to a printed wiring board or other substrate. An array may include hundreds of termination resistors having substantially real impedances in the range of 50 .OMEGA. to 100 .OMEGA. at frequencies up to about 12 GHz.
摘要翻译： 终端电阻器阵列具有基本上不产生净磁场的对称几何形状，并且在基板上制造作为圆盘电阻器的合成低电感。 通过通孔的导电以阵列图案形成在衬底中，该阵列图形限定了将是电阻器第一和第二接触的部件。 每个盘式电阻器具有位于电阻器盘中心处的一个第一触点，并且优选地四个位于电阻器盘对称并且由四个相邻的磁盘电阻器共享的四个第二触点。 对于每个电阻器，在衬底的第一表面上制造电阻材料的环形盘，使得盘中的中心开口至少覆盖第一接触通孔的上表面。 磁盘几何和材料决定其电阻。 接下来，在基板的第一表面上形成导电材料层，以覆盖至少每个盘的周边，并填充每个盘中的中心开口。 该导电材料至少将每个电阻盘的周边与每个第二接触通孔电耦合以限定VT节点，并且还将盘中心分别电耦合到下面的第一接触通孔。 在每个通孔的下表面处的焊球提供用于每个电阻器的第一和第二触点的阵列，用于将衬底附接到印刷线路板或其它衬底。 在高达约12GHz的频率下，阵列可以包括数百个终端电阻器，其具有基本上实际阻抗在50欧姆到100欧姆的范围内。
-
公开(公告)号：US08325773B2
公开(公告)日：2012-12-04
申请号：US13326297
申请日：2011-12-14
IPC分类号： H01S3/04
CPC分类号： H01S5/423 , H01S5/005 , H01S5/02453 , H01S5/02461 , H01S5/0261 , H01S5/0422 , H01S5/0612 , H01S5/18305 , H01S5/18327 , H01S5/4087
摘要： One embodiment of the present invention provides a system that facilitates adjusting the wavelengths of lasers via temperature control. This system includes a chip with an active face upon which active circuitry and signal pads reside. A thermal-control mechanism provides localized thermal control of two lasers mounted upon the active face of the chip. By individually controlling the temperature of the lasers, the thermal-control mechanism controls the wavelengths emitted by each respective laser. By creating a temperature gradient that causes a temperature difference between two or more lasers, the system can cause the lasers to emit different wavelengths.
-
公开(公告)号：US07514937B2
公开(公告)日：2009-04-07
申请号：US11284354
申请日：2005-11-21
CPC分类号： G01R31/312 , G01R31/046 , G01R31/2812 , G01R31/2853
摘要： A system configured to detect faults in signal lines. A system includes a first component configured to communicate with a second component via a signal path including one or more signal traces. Sense signal lines are manufactured such that at some point they are in close proximity to a signal trace which is to be monitored. The sense signal lines are configured to use parasitic coupling to redirect a portion of a signal conveyed via a signal trace to a monitoring component. The first component is configured to convey a test signal indicative of a type of test via the signal path, and a reference signal to the monitoring component. The monitoring component is configured to utilize the reference signal to ascertain a presence or absence, or characteristics of a received redirected signal. The monitoring component may optionally utilize a locally generated reference signal.
摘要翻译： 被配置为检测信号线路中的故障的系统。 系统包括被配置为经由包括一个或多个信号迹线的信号路径与第二部件通信的第一部件。 感测信号线被制造成使得在某些点处它们处于要被监控的信号迹线附近。 感测信号线被配置为使用寄生耦合来将经由信号迹线传送的信号的一部分重定向到监视部件。 第一组件被配置为经由信号路径传送指示测试类型的测试信号，以及向监视组件传送参考信号。 监视组件被配置为利用参考信号来确定所接收的重定向信号的存在或不存在或特性。 监视组件可以可选地利用本地生成的参考信号。
-
公开(公告)号：US20090002947A1
公开(公告)日：2009-01-01
申请号：US12082640
申请日：2008-04-11
IPC分类号： H05K7/20
CPC分类号： H05K7/20336
摘要： An apparatus for cooling a number of electronic components comprises an enclosure within which the components are positioned, an arrangement for circulating a cooling fluid to the components so that the cooling fluid can evaporate on or proximate the components and thereby absorb the heat generated by the components, a mechanism for condensing the evaporated cooling fluid, and a reservoir which is in fluid communication with the circulating means and within which the condensed cooling fluid collects.
摘要翻译： 用于冷却多个电子部件的装置包括其中定位有部件的外壳，用于将冷却流体循环到部件的布置，使得冷却流体可以在部件上或附近蒸发，从而吸收由部件产生的热量 ，用于冷凝蒸发的冷却流体的机构，以及与循环装置流体连通并且冷凝的冷却流体收集在其中的储存器。
-
-
-
-
-
-
-
-
-
搜索结果
48 条记录 (耗时 0.019 秒)
