公开(公告)号：US20210283895A1

公开(公告)日：2021-09-16

申请号：US17335536

申请日：2021-06-01

申请人： Akira SAITO ,  Shigenori YAGUCHI ,  Yasuo SUZUKI ,  Nozomu TAMOTO ,  Shinzo HIGUCHI ,  Hitoshi IWATSUKI

发明人： Akira SAITO ,  Shigenori YAGUCHI ,  Yasuo SUZUKI ,  Nozomu TAMOTO ,  Shinzo HIGUCHI ,  Hitoshi IWATSUKI

IPC分类号： B33Y70/00 ,  C08K5/52 ,  C08K5/09 ,  C08K5/1575 ,  C08K5/372 ,  C08K5/521 ,  B29C64/153 ,  C08L71/00 ,  C08L77/06 ,  C08L59/00 ,  B33Y10/00 ,  C08L77/02 ,  C08K5/00

摘要： A resin powder for solid freeform fabrication, having a ratio (Mv/Mn) of 2.00 or less, where Mv represents a volume average particle diameter and Mn represents a number average particle diameter and a ratio of melt mass-flow rate B to melt mass-flow rate A of greater than 0.80 to 1.20, wherein the melt mass-flow rate A and the melt mass-flow rate B are respectively measured at 15 degrees C. higher than the melting point under a load of 2.16 kg according to JIS K7210 format before and after the resin powder is maintained at a temperature 15 degrees C. lower than the melting point under a pressure of 0.1 kPa for four hours.

公开(公告)号：US20210023778A1

公开(公告)日：2021-01-28

申请号：US16936498

申请日：2020-07-23

申请人： Sohichiroh Iida ,  Hitoshi Iwatsuki ,  Satoshi Ogawa ,  Yunsheng Sun

发明人： Sohichiroh Iida ,  Hitoshi Iwatsuki ,  Satoshi Ogawa ,  Yunsheng Sun

IPC分类号： B29C64/153 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y70/00 ,  B29C64/268

摘要： A resin powder for solid freeform fabrication is provided which maintains the degree of smoothness of a thin layer formed with the resin powder for solid freeform fabrication even when the speed of supplying the resin powder for solid freeform fabrication using a recoater is increased and reduce lowering of the degree of smoothness of the thin layer caused by the resin powder for solid freeform fabrication that has scattered and accumulated on the recoater and others.

公开(公告)号：US20200016827A1

公开(公告)日：2020-01-16

申请号：US16495327

申请日：2018-03-07

申请人： Yasuyuki YAMASHITA ,  Akira SAITO ,  Sohichiroh IIDA ,  Hitoshi IWATSUKI ,  Yasuo SUZUKI ,  Nozomu TAMOTO ,  Kiichi KAMODA ,  Shigenori YAGUCHI ,  Shinzo HIGUCHI ,  Toshiyuki ISEKI ,  Yasutomo AMAN ,  Toshiyuki MUTOH ,  Mitsuru NARUSE

发明人： Yasuyuki YAMASHITA ,  Akira SAITO ,  Sohichiroh IIDA ,  Hitoshi IWATSUKI ,  Yasuo SUZUKI ,  Nozomu TAMOTO ,  Kiichi KAMODA ,  Shigenori YAGUCHI ,  Shinzo HIGUCHI ,  Toshiyuki ISEKI ,  Yasutomo AMAN ,  Toshiyuki MUTOH ,  Mitsuru NARUSE

IPC分类号： B29C64/153 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y70/00 ,  C08J3/12

摘要： Provided is a resin powder for producing a three-dimensional object, wherein the resin powder has a number-average equivalent circle diameter of 10 micrometers or greater but 150 micrometers or less, and wherein a median in an equivalent circle diameter-based particle size distribution of the resin powder is higher than the average equivalent circle diameter.

公开(公告)号：US20190134853A1

公开(公告)日：2019-05-09

申请号：US16184244

申请日：2018-11-08

申请人： Hitoshi IWATSUKI ,  Yasuyuki YAMASHITA ,  Kiichi KAMODA ,  Toshiyuki MUTOH ,  Yasutomo AMAN ,  Toshiyuki ISEKI ,  Mitsuru NARUSE ,  Akira SAITO ,  Shinzo HIGUCHI ,  Sohichiroh IIDA

发明人： Hitoshi IWATSUKI ,  Yasuyuki YAMASHITA ,  Kiichi KAMODA ,  Toshiyuki MUTOH ,  Yasutomo AMAN ,  Toshiyuki ISEKI ,  Mitsuru NARUSE ,  Akira SAITO ,  Shinzo HIGUCHI ,  Sohichiroh IIDA

IPC分类号： B29B9/12 ,  B29C64/153 ,  B33Y70/00

摘要： A particle for solid freeform fabrication having a columnar form has end surfaces and a side surface, wherein one of the end surfaces partially covers the side surface.

公开(公告)号：US20180147780A1

公开(公告)日：2018-05-31

申请号：US15822775

申请日：2017-11-27

申请人： Kiichi KAMODA ,  Yasuyuki YAMASHITA ,  Akira SAITO ,  Sohichiroh IIDA ,  Shinzo HIGUCHI ,  Hitoshi IWATSUKI ,  Nozomu TAMOTO ,  Yasuo SUZUKI

发明人： Kiichi KAMODA ,  Yasuyuki YAMASHITA ,  Akira SAITO ,  Sohichiroh IIDA ,  Shinzo HIGUCHI ,  Hitoshi IWATSUKI ,  Nozomu TAMOTO ,  Yasuo SUZUKI

IPC分类号： B29C64/153 ,  B33Y10/00 ,  B33Y30/00

CPC分类号： B29C64/153 ,  B29C64/268 ,  B29K2995/0094 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y70/00

摘要： A method of manufacturing a solid freeform fabrication object includes forming a layer of resin powder for solid freeform fabrication including particles having a pillar-like form and solidifying a particular area of the layer with irradiation of laser beams, wherein the laser beams have an energy intensity distribution having a top hat-like form.

公开(公告)号：US20180023219A1

公开(公告)日：2018-01-25

申请号：US15656214

申请日：2017-07-21

申请人： Akira SAITO ,  Shigenori YAGUCHI ,  Yasuyuki YAMASHITA ,  Kiichi KAMODA ,  Yasuo SUZUKI ,  Nozomu TAMOTO ,  Hitoshi IWATSUKI ,  Shinzo HIGUCHI ,  Sohichiroh IIDA

发明人： Akira SAITO ,  Shigenori YAGUCHI ,  Yasuyuki YAMASHITA ,  Kiichi KAMODA ,  Yasuo SUZUKI ,  Nozomu TAMOTO ,  Hitoshi IWATSUKI ,  Shinzo HIGUCHI ,  Sohichiroh IIDA

IPC分类号： D01F6/66 ,  C08K5/1575 ,  D01F6/84 ,  D01F1/10 ,  D01F1/07 ,  B05D3/06 ,  D01F6/06 ,  C08K3/16 ,  C08K3/22 ,  C08K3/04 ,  C08K7/14 ,  C08K7/20 ,  C08K5/527 ,  D01F6/80

CPC分类号： D01F6/665 ,  B05D3/06 ,  B33Y70/00 ,  C08J3/12 ,  C08J2323/12 ,  C08J2329/14 ,  C08J2367/02 ,  C08J2371/00 ,  C08J2377/06 ,  C08K3/046 ,  C08K3/16 ,  C08K3/2279 ,  C08K5/1575 ,  C08K5/527 ,  C08K7/14 ,  C08K7/20 ,  D01F1/07 ,  D01F1/10 ,  D01F6/06 ,  D01F6/66 ,  D01F6/80 ,  D01F6/84

摘要： A resin powder for solid freeform fabrication includes a particle having a pillar-like form, wherein the ratio of the height of the particle to the diameter or the long side of the bottom of the particle is 0.5 to 2.0, the particle has a 50 percent cumulative volume particle diameter of from 5 to 200 μm, and the ratio (Mv/Mn) of the volume average particle diameter (Mv) to the number average particle diameter (Mn) of the particle is 2.00 or less.

公开(公告)号：US20180022024A1

公开(公告)日：2018-01-25

申请号：US15656248

申请日：2017-07-21

申请人： Akira SAITO ,  Yasuyuki YAMASHITA ,  Kiichi KAMODA ,  Shigenori YAGUCHI ,  Nozomu TAMOTO ,  Hitoshi IWATSUKI ,  Shinzo HIGUCHI ,  Sohichiroh llDA ,  Yasuo SUZUKI

发明人： Akira SAITO ,  Yasuyuki YAMASHITA ,  Kiichi KAMODA ,  Shigenori YAGUCHI ,  Nozomu TAMOTO ,  Hitoshi IWATSUKI ,  Shinzo HIGUCHI ,  Sohichiroh llDA ,  Yasuo SUZUKI

IPC分类号： B29C64/153 ,  C08G69/26 ,  C08F110/06 ,  B33Y70/00 ,  C08G67/00 ,  C08K3/00 ,  C08K5/00 ,  C08G63/183 ,  C08G8/02

CPC分类号： B29C64/153 ,  B29K2101/12 ,  B29K2105/251 ,  B29K2995/0041 ,  B33Y10/00 ,  B33Y70/00 ,  C08F110/06 ,  C08G8/02 ,  C08G63/183 ,  C08G67/00 ,  C08G69/26 ,  C08J3/12 ,  C08J2361/00 ,  C08J2361/16 ,  C08J2367/02 ,  C08J2367/04 ,  C08J2377/02 ,  C08J2377/08 ,  C08J2377/10 ,  C08K3/016 ,  C08K5/0066

摘要： A resin powder for solid freeform fabrication has a 50 percent cumulative volume particle diameter of from 5 to 100 μm and a ratio (Mv/Mn) of a volume average particle diameter (Mv) to the number average particle diameter (Mn) of 2.50 or less and satisfies at least one of the following conditions (1) to (3): (1): Tmf1>Tmf2 and (Tmf1−Tmf2)≧3 degrees C., both Tmf1 and Tmf2 are measured in differential scanning calorimetry measuring according to ISO 3146, (2): Cd1>Cd2 and (Cd1−Cd2)≧3 percent, both Cd1 and Cd2 are measured in differential scanning calorimetry measuring according to ISO 3146, and (3): C×1>C×2 and (C1−C2)≧3 percent.

公开(公告)号：US09782935B2

公开(公告)日：2017-10-10

申请号：US15065161

申请日：2016-03-09

申请人： Yasuyuki Yamashita ,  Yasuo Suzuki ,  Mitsuru Naruse ,  Nozomu Tamoto ,  Shigenori Yaguchi ,  Hitoshi Iwatsuki ,  Kazumi Ohtaki

发明人： Yasuyuki Yamashita ,  Yasuo Suzuki ,  Mitsuru Naruse ,  Nozomu Tamoto ,  Shigenori Yaguchi ,  Hitoshi Iwatsuki ,  Kazumi Ohtaki

IPC分类号： B29C67/00 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y70/00 ,  B22F1/00 ,  B22F3/00 ,  C04B35/00 ,  B29K29/00 ,  B29L31/00 ,  C09D129/04

CPC分类号： B29C64/165 ,  B22F1/0062 ,  B22F3/003 ,  B22F3/008 ,  B29C64/20 ,  B29K2029/04 ,  B29L2031/00 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y70/00 ,  C04B35/00 ,  C09D129/04

摘要： A powder material for three-dimensional modeling includes a base particle and a coverage film including an organic material. The coverage film covers the base particle. The powder material is used for three dimensional modeling and when the coverage film is dissolved in a solvent to prepare a solution and the solution is formed into a coated film on a smooth surface, the coated film has a wetting tension of from 22 mN/m to 28 mN/m.

公开(公告)号：US09708502B2

公开(公告)日：2017-07-18

申请号：US14956916

申请日：2015-12-02

申请人： Mitsuru Naruse ,  Nozomu Tamoto ,  Yasuo Suzuki ,  Hitoshi Iwatsuki ,  Yasuyuki Yamashita ,  Kazumi Ohtaki

发明人： Mitsuru Naruse ,  Nozomu Tamoto ,  Yasuo Suzuki ,  Hitoshi Iwatsuki ,  Yasuyuki Yamashita ,  Kazumi Ohtaki

IPC分类号： C09D129/04 ,  C08K9/10 ,  B29C67/00 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y70/00 ,  B22F3/00 ,  B22F1/00 ,  B22F3/105

CPC分类号： C09D129/04 ,  B22F1/0059 ,  B22F3/008 ,  B22F2003/1056 ,  B29C64/165 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y70/00 ,  C08K9/10 ,  Y02P10/295

摘要： A powder for 3D modeling includes a base particle and a resin having a functional group represented by the following Chemical formula 1, where A1 represents O or NH and R1, R2, and R3 each, independently represent CH3, C2H5, C3H7, or C4H9. The base particle is covered with the resin.

公开(公告)号：US09229347B2

公开(公告)日：2016-01-05

申请号：US14107522

申请日：2013-12-16

申请人： Hiroyuki Kishida ,  Shigenori Yaguchi ,  Hiroshi Tohmatsu ,  Koichi Sakata ,  Hitoshi Iwatsuki ,  Toyoaki Tano ,  Kenichi Mashiko

发明人： Hiroyuki Kishida ,  Shigenori Yaguchi ,  Hiroshi Tohmatsu ,  Koichi Sakata ,  Hitoshi Iwatsuki ,  Toyoaki Tano ,  Kenichi Mashiko

IPC分类号： G03G9/00 ,  G03G9/10 ,  G03G13/08 ,  G03G9/113 ,  G03G15/08

CPC分类号： G03G13/08 ,  G03G9/1131 ,  G03G9/1136 ,  G03G9/1139 ,  G03G15/0818

摘要： A carrier for use in a two-component developer for developing an electrostatic latent image is provided. The carrier includes a particulate magnetic core; and a cover layer located on a surface of the particulate magnetic core and including a resin and a particulate electroconductive material. The carrier has a BET specific surface area of from 0.8 to 1.6 m2/g.

摘要翻译： 提供了用于显影静电潜像的双组分显影剂中的载体。 载体包括颗粒状磁芯; 以及位于所述颗粒状磁芯的表面上并且包括树脂和颗粒状导电材料的覆盖层。 载体的BET比表面积为0.8〜1.6m 2 / g。