公开(公告)号：US20190176221A1

公开(公告)日：2019-06-13

申请号：US15776191

申请日：2016-11-18

Applicant: Daisuke SERINO ,  Fumio KAWAHARA ,  Yuzo MATSUDA ,  Tetsushi YAMAGUCHI ,  Hiroshi KAWAHARA ,  Sakayuki ISHIKAWA ,  Takuto TAKAHASHI ,  Naoshi SAKAGUCHI ,  Hiroyuki KAYABA ,  Takahiro MICHIMOTO

Inventor： Daisuke SERINO ,  Fumio KAWAHARA ,  Yuzo MATSUDA ,  Tetsushi YAMAGUCHI ,  Hiroshi KAWAHARA ,  Sakayuki ISHIKAWA ,  Takuto TAKAHASHI ,  Naoshi SAKAGUCHI ,  Hiroyuki KAYABA ,  Takahiro MICHIMOTO

IPC: B22C9/06 ,  B22C23/02 ,  G01M3/20 ,  B22D17/22

Abstract: A casting device in which refrigerant is pressure-fed to a cooling passage formed in a die, leakage of refrigerant in the die can be reliably detected in a short time without a significant modification applied to the conventional device. A casting device includes a pressure-feed device that pressure-feeds refrigerant to a cooling passage formed in a die, and a release agent coating applicator that applies a release agent to the die, and further includes a unit that mixes a fluorescent agent into the refrigerant (fluorescent agent tank), a unit that irradiates the die surface of the die with black light while the refrigerant containing the fluorescent agent mixed therein is pressure-fed to the die, and an imaging device that captures an image of the die surface. The imaging device is integrally assembled with the release agent coating applicator.

公开(公告)号：US08656798B2

公开(公告)日：2014-02-25

申请号：US13516454

申请日：2011-04-26

Applicant: Hiroshi Kawahara ,  Tooru Harada ,  Tomofumi Yamashita

Inventor： Hiroshi Kawahara ,  Tooru Harada ,  Tomofumi Yamashita

IPC: F16H1/26

CPC classification number: F16H25/20 ,  F16H25/2015 ,  F16H25/2214 ,  F16H2025/204 ,  F16H2025/2081

Abstract: A linear actuator is provided which is able to simplify its structure by adding a stopper function, too, to a detent mechanism and to prevent generation of radial load. The linear actuator comprises a ball screw mechanism, to which a rotational driving force is transmitted, for converting a rotational motion into a linear motion. The ball screw mechanism comprises radially projecting guide projections provided in a linear motion component, and a guide groove arranged in a securing portion facing the linear motion component and is engaged with the guide projections to guide the guide projections in an axial direction. The guide projection has a projection projecting by the predetermined length, while engaging into the guide groove, at a stroke end of the linear motion component and a locking portion provided in a rotary motion component is locked to the projection of the guide projection.

Abstract translation: 提供了一种线性致动器，其能够通过向制动机构添加止动器功能并且防止径向载荷的产生来简化其结构。 线性致动器包括用于将旋转运动转换成直线运动的滚珠丝杠机构，旋转驱动力被传递到该滚珠丝杠机构。 滚珠丝杠机构包括设置在直线运动部件中的径向突出的引导突起，以及布置在面向线性运动部件的固定部分中的引导槽，并且与引导突起接合以沿轴向引导引导突起。 引导突起具有在线性运动部件的行程末端处突出预定长度的突起，同时在引导槽中接合，并且设置在旋转运动部件中的锁定部分锁定到引导突起的突出部。

公开(公告)号：US08429800B2

公开(公告)日：2013-04-30

申请号：US12880514

申请日：2010-09-13

Applicant: Hiroshi Kawahara ,  Ryoichi Ichikawa

Inventor： Hiroshi Kawahara ,  Ryoichi Ichikawa

IPC: H04R17/10 ,  H01L41/053

CPC classification number: H03H9/1035 ,  H03H9/0595 ,  Y10T29/42 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T156/10 ,  Y10T156/1052

Abstract: In an exemplary method a piezoelectric wafer is prepared on which multiple piezoelectric frames are formed. Each frame has a piezoelectric vibrating piece including excitation electrodes, and a frame portion surrounds the vibrating piece. A lid wafer is prepared on which multiple respective lids are formed, each sized substantially similarly to the respective frames. A base wafer is prepared on which multiple of bases are formed, each sized substantially similarly to the respective frames. Each base has through-holes. Stripes of a first bonding film are formed on both major surfaces of the piezoelectric wafer around the periphery of each frame. Stripes of a second bonding film are formed on the inner major surface of the lid wafer, corresponding to respective stripes of the first bonding film. Stripes of a third bonding film are formed on the inner major surface of the base wafer, corresponding to respective stripes of the first bonding film. A bonding material is placed between the stripes of first bonding film and respective stripes of second bonding film, and between stripes of first bonding film and respective stripes of third bonding film, by which the three wafers are bonded together after being aligned with each other in a sandwich manner.

Abstract translation: 在一个示例性方法中，准备在其上形成多个压电框架的压电晶片。 每个框架具有包括激励电极的压电振动片，框架部分围绕振动片。 制备盖片晶片，其上形成有多个相应的盖子，每个尺寸基本上与各个框架类似。 制备基底晶片，其上形成有多个基底，每个尺寸基本上与各个框架类似。 每个基地都有通孔。 在每个框架的周围的压电晶片的两个主表面上形成第一接合膜的条纹。 第二接合膜的条纹形成在盖晶片的内主表面上，对应于第一接合膜的各条纹。 对应于第一接合膜的各个条纹，在基底晶片的内主表面上形成第三接合膜的条纹。 在第一接合膜的条纹和第二接合膜的条纹之间以及第一接合膜的条纹和第三接合膜的各条之间放置接合材料，通过该接合材料将三个晶片彼此对准接合在一起 一个三明治的方式。

公开(公告)号：US20110309720A1

公开(公告)日：2011-12-22

申请号：US13120256

申请日：2009-09-24

Applicant: Hiroshi Kawahara

Inventor： Hiroshi Kawahara

IPC: H01L41/00 ,  H01L41/22

CPC classification number: H03H9/1035 ,  H01L23/10 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/09701 ,  H03H9/0595 ,  H01L2924/00

Abstract: A piezoelectric device employs solder on a roughened surface to improve bonding of electrical contacts with the device package. The device package includes a base, a crystal frame and a lid. The base includes connecting electrodes on a side of the base adjacent the crystal frame. The base has a through hole and a through hole electrode formed in the through hole in electrical contact with the connecting electrodes. The through hole is sealed with a sealing material and a first external electrode layer, which is electrically connected to the through hole electrode, is formed on an outside surface of the base opposite the piezoelectric plate. A second external electrode layer is formed to cover the first external electrode layer and the sealing material.

Abstract translation: 压电装置在粗糙表面上使用焊料来改善电触点与器件封装的结合。 该装置包装包括底座，水晶框架和盖子。 底座包括在与水晶框架相邻的底座一侧的连接电极。 基座具有通孔和形成在通孔中的与通孔电连接的电气接触的通孔电极。 通孔用密封材料密封，与通孔电极电连接的第一外部电极层形成在与压电板相对的基座的外表面上。 形成第二外部电极层以覆盖第一外部电极层和密封材料。

公开(公告)号：US20110062825A1

公开(公告)日：2011-03-17

申请号：US12859202

申请日：2010-08-18

Applicant: Hiroshi Kawahara

Inventor： Hiroshi Kawahara

IPC: H01L41/053 ,  H01L41/22

CPC classification number: H03H9/1035 ,  H03H9/0595 ,  Y10T29/42

Abstract: An exemplary piezoelectric device includes a piezoelectric vibrating piece, on which excitation electrodes are formed, and a piezoelectric frame having a frame portion surrounding the piezoelectric vibrating piece. A plate (e.g., lid or base) is bonded to one surface of the frame portion. Fitting members are provided on both the frame and the plate. When the piezoelectric frame and plate are brought together for assembly, the fitting members fit together (e.g., interdigitate) to provide quick and error-free alignment. Then, the fitting members are bonded together by a bonding material.

Abstract translation: 示例性压电装置包括其上形成有激励电极的压电振动片和具有围绕压电振动片的框架部分的压电框架。 板（例如，盖子或底座）结合到框架部分的一个表面。 配件均设在框架和板上。 当将压电框架和板组合在一起用于组装时，配合构件配合在一起（例如，交叉），以提供快速无误差的对准。 然后，通过接合材料将嵌合构件接合在一起。

公开(公告)号：US07587328B2

公开(公告)日：2009-09-08

申请号：US10070358

申请日：2001-05-11

Applicant: Hiroshi Kawahara ,  Takuya Sato ,  Daisuke Kobayashi ,  Jingo Takemura ,  Yuji Yamamoto ,  Norio Iwai

Inventor： Hiroshi Kawahara ,  Takuya Sato ,  Daisuke Kobayashi ,  Jingo Takemura ,  Yuji Yamamoto ,  Norio Iwai

IPC: G06F9/46

CPC classification number: G06Q30/06 ,  G06Q10/0631

Abstract: A transaction coordinating device 100 is composed, in which a transportation adjusting portion 140 is provided for adjusting an insertion of cargo transportation of a spot transaction with respect to a schedule of single and/or plural cargo transportation of predetermined fixed transactions, in the event an insertion of a spot transaction based on a temporary contract with respect to fixed transactions based on the contracts of predetermined period of time is adjusted. Accordingly, inserting cargo transportation of a spot transaction easily into a schedule of single and/or plural cargo transportation of fixed transactions becomes possible even in the event that a spot transaction arises suddenly, and further inserting a commodity transaction under a flexible contract into commodity transactions under rigid contract simply also becomes possible.

公开(公告)号：US20060197197A1

公开(公告)日：2006-09-07

申请号：US11418148

申请日：2006-05-05

Applicant: Tadaaki Tsuda ,  Yasushi Yamamoto ,  Hiroshi Kawahara ,  Yoshihiro Takahashi ,  Minoru Sakai

Inventor： Tadaaki Tsuda ,  Yasushi Yamamoto ,  Hiroshi Kawahara ,  Yoshihiro Takahashi ,  Minoru Sakai

IPC: H01L23/495

CPC classification number: H03H9/1071 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48471 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/16152 ,  H03H9/0585 ,  Y10T29/42 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/48227

Abstract: In the surface acoustic wave device including a lead frame made of metal in which a plurality of inner leads 9 are formed, wherein a chip 1 comprising at least one piezoelectric substrate is mounted on a resin base 3 into which a lead frame is molded integrally, are provided a wire lead section metal surface 7a that is formed by exposing a wire lead section 7, which is electrically connected with an electrode of the chip through a bonding wire 4, out of inner leads that are arranged on both sides of the chip, from the resin base, and a chip lead section metal surface 10a that is formed by exposing a chip lead section 10, which is partially covered with the chip, from the resin base.

Abstract translation: 在包括形成有多个内部引线9的由金属构成的引线框架的弹性表面波装置中，其中包括至少一个压电基板的芯片1安装在一个引线框架一体模制的树脂基座3上， 设置有引线部金属表面7A，其通过将通过接合线4与芯片的电极电连接的引线部7从配置在芯片的两侧的内部引线露出而形成 和从树脂基部暴露由芯片部分覆盖的芯片引线部10形成的芯片引线部金属面10a。

公开(公告)号：US07067963B2

公开(公告)日：2006-06-27

申请号：US09983250

申请日：2001-10-23

Applicant: Tadaaki Tsuda ,  Yasushi Yamamoto ,  Hiroshi Kawahara ,  Yoshihiro Takahashi ,  Minoru Sakai

Inventor： Tadaaki Tsuda ,  Yasushi Yamamoto ,  Hiroshi Kawahara ,  Yoshihiro Takahashi ,  Minoru Sakai

IPC: H01L41/053

CPC classification number: H03H9/1071 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48471 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/16152 ,  H03H9/0585 ,  Y10T29/42 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/48227

Abstract: In the surface acoustic wave device including a lead frame made of metal in which a plurality of inner leads 9 are formed, wherein a chip 1 comprising at least one piezoelectric substrate is mounted on a resin base 3 into which a lead frame is molded integrally, are provided a wire lead section metal surface 7a that is formed by exposing a wire lead section 7, which is electrically connected with an electrode of the chip through a bonding wire 4, out of inner leads that are arranged on both sides of the chip, from the resin base, and a chip lead section metal surface 10a that is formed by exposing a chip lead section 10, which is partially covered with the chip, from the resin base.

Abstract translation: 在包括形成有多个内部引线9的由金属构成的引线框架的弹性表面波装置中，其中包括至少一个压电基板的芯片1安装在一个引线框架一体模制的树脂基座3上， 设置有引线部金属表面7A，其通过将通过接合线4与芯片的电极电连接的引线部7从配置在芯片的两侧的内部引线露出而形成 和从树脂基部暴露由芯片部分覆盖的芯片引线部10形成的芯片引线部金属面10a。

公开(公告)号：US07008682B2

公开(公告)日：2006-03-07

申请号：US10793278

申请日：2004-03-05

Applicant: Narutoshi Fukuzawa ,  Hiroshi Take ,  Hiroshi Kawahara

Inventor： Narutoshi Fukuzawa ,  Hiroshi Take ,  Hiroshi Kawahara

IPC: B32B3/02

CPC classification number: G11B7/2542 ,  G11B7/24053 ,  G11B7/2534 ,  G11B7/2545 ,  G11B7/256 ,  G11B7/266 ,  Y10T428/21 ,  Y10T428/2982

Abstract: An optical disc is includes a recording layer, a reflective layer, and a protective layer provided, in that order, on one surface of a light-transmissive substrate and a hard coating layer having a thickness in the range of 1 to 5 μm on the other surface of the substrate. The hard coating layer is formed by applying and curing a solution comprising a hard coating agent containing colloidal silica and a UV-curable acrylic resin and a solvent containing propylene glycol monomethyl ether as a principal constituent. The hard coating layer contains 40 mg/cm3 or less of residual solvent.

Abstract translation: 光盘包括依次设置在透光性基板的一个表面上的记录层，反射层和保护层，该保护层的厚度在1〜5μm的范围内 衬底的其他表面。 通过涂布固化包含胶体二氧化硅和UV固化型丙烯酸树脂的硬涂层剂和含有丙二醇单甲基醚的溶剂作为主要成分的溶液来形成硬涂层。 硬涂层含有40mg / cm 3以下的残留溶剂。

公开(公告)号：US06720845B2

公开(公告)日：2004-04-13

申请号：US09986096

申请日：2001-11-07

Applicant: Yoshihiro Takahashi ,  Tadaaki Tuda ,  Yasushi Yamamoto ,  Hiroshi Kawahara

Inventor： Yoshihiro Takahashi ,  Tadaaki Tuda ,  Yasushi Yamamoto ,  Hiroshi Kawahara

IPC: H03H964

CPC classification number: H03H9/1071 ,  H03H9/02921

Abstract: A GND terminal 74 extends into a package 7, and the inwardly extending portion has a laterally extending portion (lateral portion) and a longitudinally extending portion (longitudinal portion). The lateral and longitudinal portions of the GND terminal 74 form an L-shaped metal portion 80 extending in a recess 78 of the package 7. When accommodating an SAW filter 100 in the package 7, the SAW package 100 is set in the recess 78 of the package 7 such that the back surface of the chip substrate is in contact with the L-shaped portion 80.

Abstract translation: GND端子74延伸到封装7中，并且向内延伸的部分具有横向延伸部分（侧向部分）和纵向延伸部分（纵向部分）。 GND端子74的横向和纵向部分形成在封装7的凹部78中延伸的L形金属部分80.当在封装7中容纳SAW滤波器100时，SAW封装件100被设置在 封装7使得芯片基板的背面与L形部分80接触。