公开(公告)号：US07478347B2

公开(公告)日：2009-01-13

申请号：US11404754

申请日：2006-04-17

Applicant: Hiromi Yajima ,  Tatsumi Suganuma ,  Noriaki Yoshikawa ,  Tadashi Yotsumoto ,  Kenji Nakata

Inventor： Hiromi Yajima ,  Tatsumi Suganuma ,  Noriaki Yoshikawa ,  Tadashi Yotsumoto ,  Kenji Nakata

IPC: G06F17/50 ,  G06F19/00 ,  G06F11/30

CPC classification number: G05B19/4065 ,  G05B2219/37253 ,  Y02P90/86

Abstract: A semiconductor manufacturing apparatus having a plurality of portions according to this invention includes a storage device which stores, for each portion, information representing the lapsed time of use or the product processing count till occurrence of a failure after installation of the portion, and a calculation device which receives the information stored in the storage device and outputs function information representing a failure probability and/or failure rate as a function of the lapsed time of use or the product processing count for each portion.

Abstract translation: 根据本发明的具有多个部分的半导体制造装置包括：存储装置，其针对每个部分存储表示经过的使用时间或产品处理计数的信息，直到安装该部分之后的故障发生，并且计算 装置，其接收存储在存储装置中的信息，并且输出表示故障概率和/或故障率的功能信息，作为每个部分的使用时间或产品处理计数的函数。

公开(公告)号：US07198552B2

公开(公告)日：2007-04-03

申请号：US11294365

申请日：2005-12-06

Applicant: Toyomi Nishi ,  Tetsuji Togawa ,  Harumitsu Saito ,  Manabu Tsujimura ,  Hiromi Yajima ,  Kazuaki Himukai ,  Shoichi Kodama ,  Yukio Imoto ,  Riichiro Aoki ,  Masako Watase ,  Atsushi Shigeta ,  Shiro Mishima ,  Gisuke Kouno

Inventor： Toyomi Nishi ,  Tetsuji Togawa ,  Harumitsu Saito ,  Manabu Tsujimura ,  Hiromi Yajima ,  Kazuaki Himukai ,  Shoichi Kodama ,  Yukio Imoto ,  Riichiro Aoki ,  Masako Watase ,  Atsushi Shigeta ,  Shiro Mishima ,  Gisuke Kouno

IPC: B24B1/00

CPC classification number: B24B37/345 ,  B08B1/04 ,  B08B15/02 ,  B24B27/0023 ,  B24B51/00 ,  B24B55/12 ,  F24F3/161 ,  H01L21/67017 ,  H01L21/67028 ,  H01L21/67057 ,  H01L21/67219

Abstract: A polishing apparatus for polishing a surface of a workpiece includes a housing unit, a partition wall partitioning an interior of the housing unit into a first chamber and a second chamber, a polishing section disposed in the first chamber and having a turntable with an abrasive cloth mounted on an upper surface thereof and a top ring positioned above the turntable for supporting the workpiece to be polished and pressing the workpiece against the abrasive cloth, and a cleaning section disposed in the second chamber and cleaning the workpiece which has been polished. The polishing apparatus further includes a transferring device for transferring the workpiece which has been polished from the polishing section to the cleaning section through an opening and an exhaust system for exhausting ambient air from each of the polishing section and cleaning section separately and independently.

Abstract translation: 用于抛光工件表面的抛光装置包括壳体单元，将壳体单元的内部分隔成第一室和第二室的分隔壁，设置在第一室中的抛光部分，并且具有带有研磨布的转台 安装在其上表面和位于转台上方的顶环，用于支撑待抛光的工件并将工件压靠在研磨布上，以及设置在第二室中并清洁已经被抛光的工件的清洁部。 抛光装置还包括转印装置，用于通过用于从每个抛光部分和清洁部分分别且独立地排出周围空气的开口和排气系统将已经从抛光部分抛光的工件传送到清洁部分。

公开(公告)号：US06547638B2

公开(公告)日：2003-04-15

申请号：US09804232

申请日：2001-03-13

Applicant: Katsuya Okumura ,  Riichirou Aoki ,  Hiromi Yajima ,  Seiji Ishikawa ,  Manabu Tsujimura

Inventor： Katsuya Okumura ,  Riichirou Aoki ,  Hiromi Yajima ,  Seiji Ishikawa ,  Manabu Tsujimura

IPC: B24B5100

CPC classification number: H01L21/67161 ,  B08B1/04 ,  B24B27/0023 ,  B24B37/04 ,  B24B37/345 ,  B24B51/00 ,  B24B55/12 ,  F24F3/161 ,  H01L21/67028 ,  H01L21/67046 ,  H01L21/67057 ,  H01L21/67167 ,  H01L21/67219 ,  H01L21/67745 ,  H01L21/67778 ,  H03M13/39 ,  H04N5/4401 ,  H04N5/455

Abstract: A polishing apparatus includes an arrangement of a plurality of units to deal with various operations and a robot having at least one arm. The plurality of units are disposed around the robot and include a loading unit for receiving thereon a, e.g. dry, workpiece to be polished, a polishing system including at least one polishing unit for polishing the workpiece, a washing system and a drying system at least including one washing unit for washing and drying the polished workpiece, and an unloading unit for receiving thereon a resultant clean and dry polished workpiece.

公开(公告)号：US06036582A

公开(公告)日：2000-03-14

申请号：US92046

申请日：1998-06-05

Applicant: Hideo Aizawa ,  Kenya Ito ,  Hiromi Yajima ,  Kenichi Shigeta ,  Yoshikuni Tateyama

Inventor： Hideo Aizawa ,  Kenya Ito ,  Hiromi Yajima ,  Kenichi Shigeta ,  Yoshikuni Tateyama

IPC: B23Q37/00 ,  B24B37/04 ,  B24B1/00

CPC classification number: B24B37/04 ,  B23Q37/00

Abstract: A polishing apparatus for polishing semiconductor wafers has a space divided into a plurality of rooms cleaned to different degrees. A storage unit for storing semiconductor wafers is disposed in one of the rooms. A polishing unit for chemically and mechanically polishing a semiconductor wafer supplied from the storage unit is disposed in another one of the rooms. A delivery gate is disposed between the storage unit and the polishing unit and has a temporary storage chamber defined therein for temporarily storing a semiconductor wafer therein.

Abstract translation: 用于研磨半导体晶片的抛光装置具有被划分成不同程度清洁的多个房间的空间。 用于存储半导体晶片的存储单元设置在其中一个房间中。 用于对从存储单元供应的半导体晶片进行化学和机械抛光的抛光单元设置在另一个房间中。 输送门设置在存储单元和抛光单元之间，并且具有限定在其中的临时存储室，用于在其中临时存储半导体晶片。

公开(公告)号：US5597341A

公开(公告)日：1997-01-28

申请号：US451226

申请日：1995-05-26

Applicant: Masako Kodera ,  Hiroyuki Yano ,  Atsushi Shigeta ,  Riichirou Aoki ,  Hiromi Yajima ,  Haruo Okano

Inventor： Masako Kodera ,  Hiroyuki Yano ,  Atsushi Shigeta ,  Riichirou Aoki ,  Hiromi Yajima ,  Haruo Okano

IPC: B24B37/04 ,  B24B49/00 ,  B24B49/02 ,  B24B49/04 ,  B24B49/16 ,  C09K3/14 ,  H01L21/3105 ,  H01L21/66 ,  H01L21/768 ,  B24B51/00

CPC classification number: B24B37/013 ,  B24B37/04 ,  B24B49/00 ,  B24B49/02 ,  B24B49/04 ,  B24B49/16 ,  C09K3/1463 ,  H01L21/31051 ,  H01L21/31053 ,  H01L21/76819 ,  H01L22/26 ,  H01L2924/0002

Abstract: To planarize an insulating film formed on a semiconductor substrate, a polishing slurry containing cerium oxide is used to polish the surface of the insulating film. Using the cerium oxide included slurry as a polishing agent, the insulating film is not contaminated by alkali metal is during the polishing process. Furthermore, the insulating film is polished at an enhanced polishing rate.

Abstract translation: 为了平坦化形成在半导体衬底上的绝缘膜，使用含有氧化铈的抛光浆料来抛光绝缘膜的表面。 使用包含二氧化铈的浆料作为抛光剂，在抛光过程中绝缘膜不被碱金属污染。 此外，以增强的抛光速率对绝缘膜进行抛光。

公开(公告)号：US20080166949A1

公开(公告)日：2008-07-10

申请号：US11980667

申请日：2007-10-31

Applicant: Hiromi Yajima ,  Yukio Imoto ,  Shoichi Kodama ,  Riichiro Aoki ,  Takashi Omichi ,  Toyomi Nishi ,  Tetsuji Togawa

Inventor： Hiromi Yajima ,  Yukio Imoto ,  Shoichi Kodama ,  Riichiro Aoki ,  Takashi Omichi ,  Toyomi Nishi ,  Tetsuji Togawa

IPC: B24B1/00 ,  B24B27/00

CPC classification number: H01L21/67161 ,  B08B1/04 ,  B24B27/0023 ,  B24B37/04 ,  B24B37/345 ,  B24B51/00 ,  B24B55/12 ,  F24F3/161 ,  H01L21/67028 ,  H01L21/67046 ,  H01L21/67057 ,  H01L21/67167 ,  H01L21/67219 ,  H01L21/67745 ,  H01L21/67778 ,  H03M13/39 ,  H04N5/4401 ,  H04N5/455

Abstract: A polishing apparatus includes an arrangement of a plurality of units to deal with various operations and a robot having at least one arm. The plurality of units are disposed around the robot and include a loading unit for receiving thereon a, e.g. dry, workpiece to be polished, a polishing system including at least one polishing unit for polishing the workpiece, a washing system and a drying system at least including one washing unit for washing and drying the polished workpiece, and an unloading unit for receiving thereon a resultant clean and dry polished workpiece.

Abstract translation: 抛光装置包括用于处理各种操作的多个单元的布置以及具有至少一个臂的机器人。 所述多个单元设置在所述机器人周围，并且包括用于在其上接收的加载单元。 干燥的待抛光工件，包括至少一个用于抛光工件的抛光单元的抛光系统，至少包括一个用于洗涤和干燥抛光的工件的洗涤单元的洗涤系统和干燥系统，以及用于在其上接收的卸载单元 得到清洁和干燥的抛光工件。

公开(公告)号：US20060009130A1

公开(公告)日：2006-01-12

申请号：US11221924

申请日：2005-09-09

Applicant: Katsuya Okumura ,  Riichirou Aoki ,  Hiromi Yajima ,  Seiji Ishikawa ,  Manabu Tsujimura

Inventor： Katsuya Okumura ,  Riichirou Aoki ,  Hiromi Yajima ,  Seiji Ishikawa ,  Manabu Tsujimura

IPC: B24B49/00

CPC classification number: H01L21/67161 ,  B08B1/04 ,  B24B27/0023 ,  B24B37/04 ,  B24B37/345 ,  B24B51/00 ,  B24B55/12 ,  F24F3/161 ,  H01L21/67028 ,  H01L21/67046 ,  H01L21/67057 ,  H01L21/67167 ,  H01L21/67219 ,  H01L21/67745 ,  H01L21/67778 ,  H03M13/39 ,  H04N5/4401 ,  H04N5/455

Abstract: A polishing apparatus includes an arrangement of a plurality of units to deal with various operations and a robot having at least one arm. The plurality of units are disposed around the robot and include a loading unit for receiving thereon a, e.g. dry, workpiece to be polished, a polishing system including at least one polishing unit for polishing the workpiece, a washing system and a drying system at least including one washing unit for washing and drying the polished workpiece, and an unloading unit for receiving thereon a resultant clean and dry polished workpiece.

公开(公告)号：US06966821B2

公开(公告)日：2005-11-22

申请号：US10372224

申请日：2003-02-25

Applicant: Katsuya Okumura ,  Riichirou Aoki ,  Hiromi Yajima ,  Seiji Ishikawa ,  Manabu Tsujimura

Inventor： Katsuya Okumura ,  Riichirou Aoki ,  Hiromi Yajima ,  Seiji Ishikawa ,  Manabu Tsujimura

IPC: B08B1/04 ,  B24B27/00 ,  B24B37/04 ,  B24B51/00 ,  B24B55/12 ,  F24F3/16 ,  H01L21/00 ,  H01L21/677 ,  H03M13/39 ,  H04L1/00 ,  H04N5/44 ,  H04N5/455 ,  B24B1/00

CPC classification number: H01L21/67161 ,  B08B1/04 ,  B24B27/0023 ,  B24B37/04 ,  B24B37/345 ,  B24B51/00 ,  B24B55/12 ,  F24F3/161 ,  H01L21/67028 ,  H01L21/67046 ,  H01L21/67057 ,  H01L21/67167 ,  H01L21/67219 ,  H01L21/67745 ,  H01L21/67778 ,  H03M13/39 ,  H04N5/4401 ,  H04N5/455

Abstract: A polishing apparatus includes an arrangement of a plurality of units to deal with various operations and a robot having at least one arm. The plurality of units are disposed around the robot and include a loading unit for receiving thereon a, e.g. dry, workpiece to be polished, a polishing system including at least one polishing unit for polishing the workpiece, a washing system and a drying system at least including one washing unit for washing and drying the polished workpiece, and an unloading unit for receiving thereon a resultant clean and dry polished workpiece.

Abstract translation: 抛光装置包括用于处理各种操作的多个单元的布置以及具有至少一个臂的机器人。 所述多个单元设置在所述机器人周围，并且包括用于在其上接收的加载单元。 干燥的待抛光工件，包括至少一个用于抛光工件的抛光单元的抛光系统，至少包括一个用于洗涤和干燥抛光的工件的洗涤单元的洗涤系统和干燥系统，以及用于在其上接收的卸载单元 得到清洁和干燥的抛光工件。

公开(公告)号：US06443808B2

公开(公告)日：2002-09-03

申请号：US09804231

申请日：2001-03-13

Applicant: Katsuya Okumura ,  Riichirou Aoki ,  Hiromi Yajima ,  Seiji Ishikawa ,  Manabu Tsujimura

Inventor： Katsuya Okumura ,  Riichirou Aoki ,  Hiromi Yajima ,  Seiji Ishikawa ,  Manabu Tsujimura

IPC: B24B5100

CPC classification number: H01L21/67161 ,  B08B1/04 ,  B24B27/0023 ,  B24B37/04 ,  B24B37/345 ,  B24B51/00 ,  B24B55/12 ,  F24F3/161 ,  H01L21/67028 ,  H01L21/67046 ,  H01L21/67057 ,  H01L21/67167 ,  H01L21/67219 ,  H01L21/67745 ,  H01L21/67778 ,  H03M13/39 ,  H04N5/4401 ,  H04N5/455

Abstract: A polishing apparatus includes an arrangement of a plurality of units to deal with various operations and a robot having at least one arm. The plurality of units are disposed around the robot and include a loading unit for receiving thereon a, e.g. dry, workpiece to be polished, a polishing system including at least one polishing unit for polishing the workpiece, a washing system and a drying system at least including one washing unit for washing and drying the polished workpiece, and an unloading unit for receiving thereon a resultant clean and dry polished workpiece.

Abstract translation: 抛光装置包括用于处理各种操作的多个单元的布置以及具有至少一个臂的机器人。 所述多个单元设置在所述机器人周围，并且包括用于在其上接收的加载单元。 干燥的待抛光工件，包括至少一个用于抛光工件的抛光单元的抛光系统，至少包括一个用于洗涤和干燥抛光的工件的洗涤单元的洗涤系统和干燥系统，以及用于在其上接收的卸载单元 得到清洁和干燥的抛光工件。

公开(公告)号：US06425806B2

公开(公告)日：2002-07-30

申请号：US09804234

申请日：2001-03-13

Applicant: Katsuya Okumura ,  Riichirou Aoki ,  Hiromi Yajima ,  Seiji Ishikawa ,  Manabu Tsujimura

Inventor： Katsuya Okumura ,  Riichirou Aoki ,  Hiromi Yajima ,  Seiji Ishikawa ,  Manabu Tsujimura

IPC: B24B100

CPC classification number: H01L21/67161 ,  B08B1/04 ,  B24B27/0023 ,  B24B37/04 ,  B24B37/345 ,  B24B51/00 ,  B24B55/12 ,  F24F3/161 ,  H01L21/67028 ,  H01L21/67046 ,  H01L21/67057 ,  H01L21/67167 ,  H01L21/67219 ,  H01L21/67745 ,  H01L21/67778 ,  H03M13/39 ,  H04N5/4401 ,  H04N5/455

Abstract: A polishing apparatus includes an arrangement of a plurality of units to deal with various operations and a robot having at least one arm. The plurality of units are disposed around the robot and include a loading unit for receiving thereon a, e.g. dry, workpiece to be polished, a polishing system including at least one polishing unit for polishing the workpiece, a washing system and a drying system at least including one washing unit for washing and drying the polished workpiece, and an unloading unit for receiving thereon a resultant clean and dry polished workpiece.