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公开(公告)号:US07198552B2
公开(公告)日:2007-04-03
申请号:US11294365
申请日:2005-12-06
申请人: Toyomi Nishi , Tetsuji Togawa , Harumitsu Saito , Manabu Tsujimura , Hiromi Yajima , Kazuaki Himukai , Shoichi Kodama , Yukio Imoto , Riichiro Aoki , Masako Watase , Atsushi Shigeta , Shiro Mishima , Gisuke Kouno
发明人: Toyomi Nishi , Tetsuji Togawa , Harumitsu Saito , Manabu Tsujimura , Hiromi Yajima , Kazuaki Himukai , Shoichi Kodama , Yukio Imoto , Riichiro Aoki , Masako Watase , Atsushi Shigeta , Shiro Mishima , Gisuke Kouno
IPC分类号: B24B1/00
CPC分类号: B24B37/345 , B08B1/04 , B08B15/02 , B24B27/0023 , B24B51/00 , B24B55/12 , F24F3/161 , H01L21/67017 , H01L21/67028 , H01L21/67057 , H01L21/67219
摘要: A polishing apparatus for polishing a surface of a workpiece includes a housing unit, a partition wall partitioning an interior of the housing unit into a first chamber and a second chamber, a polishing section disposed in the first chamber and having a turntable with an abrasive cloth mounted on an upper surface thereof and a top ring positioned above the turntable for supporting the workpiece to be polished and pressing the workpiece against the abrasive cloth, and a cleaning section disposed in the second chamber and cleaning the workpiece which has been polished. The polishing apparatus further includes a transferring device for transferring the workpiece which has been polished from the polishing section to the cleaning section through an opening and an exhaust system for exhausting ambient air from each of the polishing section and cleaning section separately and independently.
摘要翻译: 用于抛光工件表面的抛光装置包括壳体单元,将壳体单元的内部分隔成第一室和第二室的分隔壁,设置在第一室中的抛光部分,并且具有带有研磨布的转台 安装在其上表面和位于转台上方的顶环,用于支撑待抛光的工件并将工件压靠在研磨布上,以及设置在第二室中并清洁已经被抛光的工件的清洁部。 抛光装置还包括转印装置,用于通过用于从每个抛光部分和清洁部分分别且独立地排出周围空气的开口和排气系统将已经从抛光部分抛光的工件传送到清洁部分。
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公开(公告)号:US20060084369A1
公开(公告)日:2006-04-20
申请号:US11294365
申请日:2005-12-06
申请人: Toyomi Nishi , Tetsuji Togawa , Harumitsu Saito , Manabu Tsujimura , Hiromi Yajima , Kazuaki Himukai , Shoichi Kodama , Yukio Imoto , Riichiro Aoki , Masako Watase , Atsushi Shigeta , Shiro Mishima , Gisuke Kouno
发明人: Toyomi Nishi , Tetsuji Togawa , Harumitsu Saito , Manabu Tsujimura , Hiromi Yajima , Kazuaki Himukai , Shoichi Kodama , Yukio Imoto , Riichiro Aoki , Masako Watase , Atsushi Shigeta , Shiro Mishima , Gisuke Kouno
IPC分类号: B24B1/00
CPC分类号: B24B37/345 , B08B1/04 , B08B15/02 , B24B27/0023 , B24B51/00 , B24B55/12 , F24F3/161 , H01L21/67017 , H01L21/67028 , H01L21/67057 , H01L21/67219
摘要: A polishing apparatus for polishing a surface of a workpiece includes a housing unit, a partition wall partitioning an interior of the housing unit into a first chamber and a second chamber, a polishing section disposed in the first chamber and having a turntable with an abrasive cloth mounted on an upper surface thereof and a top ring positioned above the turntable for supporting the workpiece to be polished and pressing the workpiece against the abrasive cloth, and a cleaning section disposed in the second chamber and cleaning the workpiece which has been polished. The polishing apparatus further includes a transferring device for transferring the workpiece which has been polished from the polishing section to the cleaning section through an opening and an exhaust system for exhausting ambient air from each of the polishing section and cleaning section separately and independently.
摘要翻译: 用于抛光工件表面的抛光装置包括壳体单元,将壳体单元的内部分隔成第一室和第二室的分隔壁,设置在第一室中的抛光部分,并且具有带有研磨布的转台 安装在其上表面和位于转台上方的顶环,用于支撑待抛光的工件并将工件压靠在研磨布上,以及设置在第二室中并清洁已经被抛光的工件的清洁部。 抛光装置还包括转印装置,用于通过用于从每个抛光部分和清洁部分分别且独立地排出周围空气的开口和排气系统将已经从抛光部分抛光的工件传送到清洁部分。
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公开(公告)号:US06500051B1
公开(公告)日:2002-12-31
申请号:US08884410
申请日:1997-06-27
申请人: Toyomi Nishi , Tetsuji Togawa , Harumitsu Saito , Manabu Tsujimura , Hiromi Yajima , Kazuaki Himukai , Shoichi Kodama , Yukio Imoto , Riichiro Aoki , Masako Watase , Atsushi Shigeta , Shiro Mishima , Gisuke Kouno
发明人: Toyomi Nishi , Tetsuji Togawa , Harumitsu Saito , Manabu Tsujimura , Hiromi Yajima , Kazuaki Himukai , Shoichi Kodama , Yukio Imoto , Riichiro Aoki , Masako Watase , Atsushi Shigeta , Shiro Mishima , Gisuke Kouno
IPC分类号: B24B100
CPC分类号: B24B37/345 , B08B1/04 , B08B15/02 , B24B27/0023 , B24B51/00 , B24B55/12 , F24F3/161 , H01L21/67017 , H01L21/67028 , H01L21/67057 , H01L21/67219
摘要: A polishing apparatus for polishing a surface of a workpiece includes a housing unit, a partition wall partitioning an interior of the housing unit into a first chamber and a second chamber, a polishing section disposed in the first chamber and having a turntable with an abrasive cloth mounted on an upper surface thereof and a top ring positioned above the turntable for supporting the workpiece to be polished and pressing the workpiece against the abrasive cloth, and a cleaning section disposed in the second chamber and cleaning the workpiece which has been polished. The polishing apparatus further includes a transferring device for transferring the workpiece which has been polished from the polishing section to the cleaning section through an opening and an exhaust system for exhausting ambient air from each of the polishing section and cleaning section separately and independently.
摘要翻译: 用于抛光工件表面的抛光装置包括壳体单元,将壳体单元的内部分隔成第一室和第二室的分隔壁,设置在第一室中的抛光部分,并且具有带有研磨布的转台 安装在其上表面和位于转台上方的顶环,用于支撑待抛光的工件并将工件压靠在研磨布上,以及设置在第二室中并清洁已经被抛光的工件的清洁部。 抛光装置还包括转印装置,用于通过用于从每个抛光部分和清洁部分分别且独立地排出周围空气的开口和排气系统将已经从抛光部分抛光的工件传送到清洁部分。
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公开(公告)号:US06997782B2
公开(公告)日:2006-02-14
申请号:US10255793
申请日:2002-09-27
申请人: Toyomi Nishi , Tetsuji Togawa , Harumitsu Saito , Manabu Tsujimura , Hiromi Yajima , Kazuaki Himukai , Shoichi Kodama , Yukio Imoto , Riichiro Aoki , Masako Watase , Atsushi Shigeta , Shiro Mishima , Gisuke Kouno
发明人: Toyomi Nishi , Tetsuji Togawa , Harumitsu Saito , Manabu Tsujimura , Hiromi Yajima , Kazuaki Himukai , Shoichi Kodama , Yukio Imoto , Riichiro Aoki , Masako Watase , Atsushi Shigeta , Shiro Mishima , Gisuke Kouno
IPC分类号: B24B1/00
CPC分类号: B24B37/345 , B08B1/04 , B08B15/02 , B24B27/0023 , B24B51/00 , B24B55/12 , F24F3/161 , H01L21/67017 , H01L21/67028 , H01L21/67057 , H01L21/67219
摘要: A polishing apparatus for polishing a surface of a workpiece includes a housing unit, a partition wall partitioning an interior of the housing unit into a first chamber and a second chamber, a polishing section disposed in the first chamber and having a turntable with an abrasive cloth mounted on an upper surface thereof and a top ring positioned above the turntable for supporting the workpiece to be polished and pressing the workpiece against the abrasive cloth, and a cleaning section disposed in the second chamber and cleaning the workpiece which has been polished. The polishing apparatus further includes a transferring device for transferring the workpiece which has been polished from the polishing section to the cleaning section through an opening and an exhaust system for exhausting ambient air from each of the polishing section and cleaning section separately and independently.
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5.
公开(公告)号:US5704827A
公开(公告)日:1998-01-06
申请号:US544534
申请日:1995-10-18
申请人: Toyomi Nishi , Manabu Tsujimura , Tamami Takahashi , Hiromi Yajima , Riichiro Aoki , Yukio Imoto , Shoichi Kodama , Kazuaki Himukai , Gisuke Kouno , Takanobu Nishimura
发明人: Toyomi Nishi , Manabu Tsujimura , Tamami Takahashi , Hiromi Yajima , Riichiro Aoki , Yukio Imoto , Shoichi Kodama , Kazuaki Himukai , Gisuke Kouno , Takanobu Nishimura
IPC分类号: B24B37/20 , B24B37/24 , H01L21/304 , B24B5/00
CPC分类号: B24B37/12
摘要: A polishing apparatus includes a detachable light weight cloth cartridge which shows little deformation under uneven loading during a polishing operation. Either mechanical or non-mechanical fixation of the cloth cartridge to a turntable is achieved. Mechanical fixation involves attaching the cloth cartridge to the turntable at peripheral and center sections of the cloth cartridge. Non-mechanical fixation involves attaching the cloth cartridge to the turntable by a vacuum arrangement. The assembly of the cloth cartridge and the turntable not only produces excellent flatness on polished semiconductor wafers by maintaining a level polishing surface, but also improves the production yield by preventing breakage of wafers during the polishing process.
摘要翻译: 抛光装置包括可拆卸轻量布料筒,其在抛光操作期间在不均匀载荷下几乎不变形。 实现了布料盒到转台的机械或非机械固定。 机械固定包括将布料盒连接到布料盒周边和中心部分的转台上。 非机械固定包括通过真空装置将布料盒附接到转台上。 布料盒和转盘的组装不仅通过保持抛光表面而在抛光的半导体晶片上产生优异的平整度,而且还通过防止抛光过程中的晶片破损而提高了生产率。
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公开(公告)号:US5679059A
公开(公告)日:1997-10-21
申请号:US563295
申请日:1995-11-28
申请人: Toyomi Nishi , Tetsuji Togawa , Harumitsu Saito , Manabu Tsujimura , Hiromi Yajima , Kazuaki Himukai , Shoichi Kodama , Yukio Imoto , Riichiro Aoki , Masako Watase , Atsushi Shigeta , Shiro Mishima , Gisuke Kouno
发明人: Toyomi Nishi , Tetsuji Togawa , Harumitsu Saito , Manabu Tsujimura , Hiromi Yajima , Kazuaki Himukai , Shoichi Kodama , Yukio Imoto , Riichiro Aoki , Masako Watase , Atsushi Shigeta , Shiro Mishima , Gisuke Kouno
IPC分类号: H01L21/304 , B08B1/04 , B24B27/00 , B24B37/34 , B24B51/00 , B24B55/12 , F24F3/16 , H01L21/00 , B24B1/00
CPC分类号: B24B37/345 , B08B1/04 , B08B15/02 , B24B27/0023 , B24B51/00 , B24B55/12 , F24F3/161 , H01L21/67017 , H01L21/67028 , H01L21/67057 , H01L21/67219
摘要: A polishing apparatus for polishing a surface of a workpiece includes a housing unit, a partition wall partitioning an interior of the housing unit into a first chamber and a second chamber, a polishing section disposed in the first chamber and having a turntable with an abrasive cloth mounted on an upper surface thereof and a top ring positioned above the turntable for supporting the workpiece to be polished and pressing the workpiece against the abrasive cloth, and a cleaning section disposed in the second chamber and cleaning the workpiece which has been polished. The polishing apparatus further includes a transferring device for transferring the workpiece which has been polished from the polishing section to the cleaning section through an opening and an exhaust system for exhausting ambient air from each of the polishing section and cleaning section separately and independently.
摘要翻译: 用于抛光工件表面的抛光装置包括壳体单元,将壳体单元的内部分隔成第一室和第二室的分隔壁,设置在第一室中的抛光部分,并且具有带有研磨布的转台 安装在其上表面和位于转台上方的顶环,用于支撑待抛光的工件并将工件压靠在研磨布上,以及设置在第二室中并清洁已经被抛光的工件的清洁部。 抛光装置还包括转印装置,用于通过用于从每个抛光部分和清洁部分分别且独立地排出周围空气的开口和排气系统将已经从抛光部分抛光的工件传送到清洁部分。
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