公开(公告)号：US08664773B2

公开(公告)日：2014-03-04

申请号：US13477524

申请日：2012-05-22

Applicant: Atsushi Yamaguchi ,  Hideyuki Tsujimura ,  Hiroe Kowada ,  Ryo Kuwabara ,  Naomichi Ohashi

Inventor： Atsushi Yamaguchi ,  Hideyuki Tsujimura ,  Hiroe Kowada ,  Ryo Kuwabara ,  Naomichi Ohashi

IPC: H01L21/58 ,  H01L21/60 ,  H01L23/488

CPC classification number: H01L23/315 ,  H01L23/3157 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/131 ,  H01L2224/14131 ,  H01L2224/14136 ,  H01L2224/16238 ,  H01L2224/29017 ,  H01L2224/29035 ,  H01L2224/29082 ,  H01L2224/29083 ,  H01L2224/2919 ,  H01L2224/30155 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/81143 ,  H01L2224/81193 ,  H01L2224/81411 ,  H01L2224/81815 ,  H01L2224/831 ,  H01L2224/83862 ,  H01L2224/9221 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/00014 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00012 ,  H01L2924/0665

Abstract: A manufacturing method for a mounting structure of a semiconductor package component, including: applying a first adhesive with viscosity η1 and a thixotropy index T1 at a position on the substrate, which is on an outer side of the mounted semiconductor package component; applying, on the first adhesive, a second adhesive with viscosity η2 and a thixotropy index T2 so that the second adhesive gets in contact with an outer periphery part of the semiconductor package component; and forming, through a subsequent reflow process, a first adhesive part of the hardened first adhesive and a second adhesive part of the hardened second adhesive, wherein the first and second adhesives satisfy 30≦η2≦η1≦300 (Pa·s) and 3≦T2≦T1≦7, and sectional area S1 of the first adhesive part and sectional area S2 of the second adhesive part with respect to a direction perpendicular to a mounting surface of the substrate satisfy a relation S1≦S2.

Abstract translation: 一种半导体封装件的安装结构的制造方法，包括：在安装的半导体封装部件的外侧的基板上的位置处施加粘度eta1和触变指数T1的第一粘合剂; 在第一粘合剂上施加具有粘度eta2和触变指数T2的第二粘合剂，使得第二粘合剂与半导体封装部件的外周部分接触; 并且通过随后的回流工艺形成所述硬化的第一粘合剂的第一粘合部分和所述硬化的第二粘合剂的第二粘合部分，其中所述第一和第二粘合剂满足30（Pa·s）和3 @ T2 @ T1 @ 7，第一粘合部分的截面面积S1和第二粘合部分相对于垂直于基板的安装表面的方向的截面面积S2满足关系S1 @ S2。

公开(公告)号：US08344268B2

公开(公告)日：2013-01-01

申请号：US12496017

申请日：2009-07-01

Applicant: Hideyuki Tsujimura ,  Hidenori Miyakawa ,  Atsushi Yamaguchi ,  Hiroe Kowada ,  Koso Matsuno

Inventor： Hideyuki Tsujimura ,  Hidenori Miyakawa ,  Atsushi Yamaguchi ,  Hiroe Kowada ,  Koso Matsuno

IPC: H05K1/11

CPC classification number: H05K3/288 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H05K3/284 ,  H05K2201/09872 ,  H05K2201/0989 ,  H05K2203/0783 ,  H05K2203/1322 ,  Y10T29/49146 ,  H01L2224/0401

Abstract: An electronic component packaging structure includes a circuit board, electronic components mounted on the circuit board and a moisture-proof coating layer covering the electronic components. The moisture-proof coating layer is constituted from a polymer material coating having at least two layers of a lower layer and an upper layer, and the polymer material forming the lower layer has higher swelling property and/or solubility to a repairing solvent that is selected from among hydrocarbon-based solvents than the polymer material forming the upper layer.

Abstract translation: 电子部件封装结构包括电路板，安装在电路板上的电子部件和覆盖电子部件的防潮涂层。 防潮涂层由具有至少两层下层和上层的聚合物材料涂层构成，形成下层的聚合物材料具有较高的溶胀性和/或对所选择的修补溶剂的溶解性 与烃类溶剂相比，形成上层的聚合物材料。

公开(公告)号：US20120299202A1

公开(公告)日：2012-11-29

申请号：US13477524

申请日：2012-05-22

Applicant: Atsushi YAMAGUCHI ,  Hideyuki TSUJIMURA ,  Hiroe KOWADA ,  Ryo KUWABARA ,  Naomichi OHASHI

Inventor： Atsushi YAMAGUCHI ,  Hideyuki TSUJIMURA ,  Hiroe KOWADA ,  Ryo KUWABARA ,  Naomichi OHASHI

IPC: H01L21/58 ,  H01L21/60 ,  H01L23/488

CPC classification number: H01L23/315 ,  H01L23/3157 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/131 ,  H01L2224/14131 ,  H01L2224/14136 ,  H01L2224/16238 ,  H01L2224/29017 ,  H01L2224/29035 ,  H01L2224/29082 ,  H01L2224/29083 ,  H01L2224/2919 ,  H01L2224/30155 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/81143 ,  H01L2224/81193 ,  H01L2224/81411 ,  H01L2224/81815 ,  H01L2224/831 ,  H01L2224/83862 ,  H01L2224/9221 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/00014 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00012 ,  H01L2924/0665

Abstract: A manufacturing method for a mounting structure of a semiconductor package component, including: applying a first adhesive with viscosity η1 and a thixotropy index T1 at a position on the substrate, which is on an outer side of the mounted semiconductor package component; applying, on the first adhesive, a second adhesive with viscosity η2 and a thixotropy index T2 so that the second adhesive gets in contact with an outer periphery part of the semiconductor package component; and forming, through a subsequent reflow process, a first adhesive part of the hardened first adhesive and a second adhesive part of the hardened second adhesive, wherein the first and second adhesives satisfy 30≦η2≦η1≦300 (Pa·s) and 3≦T2≦T1≦7, and sectional area S1 of the first adhesive part and sectional area S2 of the second adhesive part with respect to a direction perpendicular to a mounting surface of the substrate satisfy a relation S1≦S2.

Abstract translation: 一种半导体封装件的安装结构的制造方法，包括：在安装的半导体封装部件的外侧的基板上的位置处施加粘度1和触变指数T1的第一粘合剂; 在第一粘合剂上施加粘度为2和触变指数T2的第二粘合剂，使得第二粘合剂与半导体封装部件的外周部分接触; 并且通过随后的回流工艺形成所述硬化的第一粘合剂的第一粘合剂部分和所述硬化的第二粘合剂的第二粘合剂部分，其中所述第一和第二粘合剂满足30＆lt; 1＆nlE; 2＆nlE; 1＆nlE; 300（Pa· s和3＆nlE; T2＆nlE; T1＆nlE; 7，第一粘合部分的截面面积S1和第二粘合部分的截面面积S2相对于与基板的安装表面垂直的方向满足关系S1＆lt; lE; S2。

公开(公告)号：US07785500B2

公开(公告)日：2010-08-31

申请号：US12092453

申请日：2006-10-31

Applicant: Atsushi Yamaguchi ,  Hidenori Miyakawa ,  Takayuki Higuchi ,  Koso Matsuno ,  Hideyuki Tsujimura

Inventor： Atsushi Yamaguchi ,  Hidenori Miyakawa ,  Takayuki Higuchi ,  Koso Matsuno ,  Hideyuki Tsujimura

IPC: H01B1/22 ,  C09J9/02

CPC classification number: C09J9/02 ,  H01B1/22 ,  H05K3/321 ,  H05K2201/0218 ,  H05K2201/0272 ,  H05K2203/0425

Abstract: The present invention provides an electrically conductive adhesive which prevents migration and sulfuration of a metal component in electronic component mounting. The electrically conductive adhesive includes a thermosetting resin and metal filler particles dispersed in the thermosetting resin. It is possible to use, as the metal filler particles, metal filler particles having a composition including an alloy of Ag with at least one metal selected from the group consisting of Sn, Cu, In, Bi and Ni, a mixture of such metal filler particles and Ag filler particles, and metal filler particles including Ag filler particles and a coating layer formed on the surface of the Ag filler particles using a metal such as Sn.

Abstract translation: 本发明提供一种导电粘合剂，其防止电子部件安装中的金属成分的迁移和硫化。 导电粘合剂包括热固性树脂和分散在热固性树脂中的金属填料颗粒。 作为金属填料颗粒，可以使用包含Ag合金和至少一种选自Sn，Cu，In，Bi和Ni的金属的组成的金属填料颗粒，将这种金属填料 颗粒和Ag填料颗粒，以及包括Ag填料颗粒的金属填料颗粒和使用Sn等金属在Ag填料颗粒的表面上形成的涂层。

公开(公告)号：US20100002401A1

公开(公告)日：2010-01-07

申请号：US12496017

申请日：2009-07-01

Applicant: Hideyuki TSUJIMURA ,  Hidenori MIYAKAWA ,  Atsushi YAMAGUCHI ,  Hiroe KOWADA ,  Koso MATSUNO

Inventor： Hideyuki TSUJIMURA ,  Hidenori MIYAKAWA ,  Atsushi YAMAGUCHI ,  Hiroe KOWADA ,  Koso MATSUNO

IPC: H05K1/00 ,  H05K3/30

CPC classification number: H05K3/288 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H05K3/284 ,  H05K2201/09872 ,  H05K2201/0989 ,  H05K2203/0783 ,  H05K2203/1322 ,  Y10T29/49146 ,  H01L2224/0401

Abstract: The electronic component packaging structure having, as the moisture-proof coating layer, a polymer material that has sufficient moisture-proof performance and can be relatively easily peeled off from a circuit board and/or electronic components when repairing can be provided.The electronic component packaging structure of the invention comprises a circuit board, electronic components mounted on the circuit board and a moisture-proof coating layer covering the electronic components. The moisture-proof coating layer is constituted from a polymer material coating having at least two layers of a lower layer and an upper layer, and the polymer material forming the lower layer has higher swelling property and/or volubility to a repairing solvent that is selected from among hydrocarbon-based solvents than the polymer material forming the upper layer.

Abstract translation: 作为防湿涂层的电子部件包装结构体可以提供具有充分的防潮性能并且在修理时可以相对容易地从电路板和/或电子部件剥离的聚合物材料。 本发明的电子部件封装结构包括电路板，安装在电路板上的电子部件和覆盖电子部件的防湿涂层。 防潮涂层由具有至少两层下层和上层的聚合物材料涂层构成，并且形成下层的聚合物材料对于所选择的修补溶剂具有较高的溶胀性和/或挥发性 与烃类溶剂相比，形成上层的聚合物材料。

公开(公告)号：US20090114885A1

公开(公告)日：2009-05-07

申请号：US12092453

申请日：2006-10-31

Applicant: Atsushi Yamaguchi ,  Hidenori Miyakawa ,  Takayuki Higuchi ,  Koso Matsuno ,  Hideyuki Tsujimura

Inventor： Atsushi Yamaguchi ,  Hidenori Miyakawa ,  Takayuki Higuchi ,  Koso Matsuno ,  Hideyuki Tsujimura

IPC: H01B1/12

CPC classification number: C09J9/02 ,  H01B1/22 ,  H05K3/321 ,  H05K2201/0218 ,  H05K2201/0272 ,  H05K2203/0425

Abstract: The present invention provides an electrically conductive adhesive which prevents migration and sulfuration of a metal component in electronic component mounting. The electrically conductive adhesive includes a thermosetting resin and metal filler particles dispersed in the thermosetting resin. It is possible to use, as the metal filler particles, metal filler particles having a composition including an alloy of Ag with at least one metal selected from the group consisting of Sn, Cu, In, Bi and Ni, a mixture of such metal filler particles and Ag filler particles, and metal filler particles including Ag filler particles and a coating layer formed on the surface of the Ag filler particles using a metal such as Sn.

Abstract translation: 本发明提供一种导电粘合剂，其防止电子部件安装中的金属成分的迁移和硫化。 导电粘合剂包括热固性树脂和分散在热固性树脂中的金属填料颗粒。 作为金属填料颗粒，可以使用包含Ag合金和至少一种选自Sn，Cu，In，Bi和Ni的金属的组成的金属填料颗粒，将这种金属填料 颗粒和Ag填料颗粒，以及包括Ag填料颗粒的金属填料颗粒和使用Sn等金属在Ag填料颗粒的表面上形成的涂层。