摘要:
A substrate case includes a shaft portion around which a sheet-shaped substrate having a circuit area in which a circuit manufacturing process is performed is wound; and a cover portion that accommodates the substrate in the state of being wound around the shaft portion, the shaft portion having a holding portion that holds an area different from the circuit area at a winding start portion of the substrate.
摘要:
When a segmented region SAi of a sheet S is scan-exposed, a stage SST1 adsorbs, at a standby position at the +X end portion of a scan region AS, a rear surface portion corresponding to the segmented region SAi of the sheet S onto a holding surface of a sheet holder SH1, and moves in the X axis direction (the −X direction) with a predetermined stroke in synchronization with a mask (a mask stage). At this time, illumination beams corresponding to the parts of a pattern of the mask are irradiated onto the sheet S via projection optical systems. Thereby, the pattern is transferred (formed). After scan-exposure on the segmented region SAi, a stage SST2 moves to a standby position within the XY plane. After the stage SST2 adsorbs a rear surface portion corresponding to the next segmented region SAi+1 of the sheet S onto a holding surface of a sheet holder SH1, an exposure is performed by the scan-exposure method similarly to the above, to thereby form the pattern.
摘要:
Six auxiliary sheet holders SH2 and SH3 temporarily holding a sheet S are minutely driven in the −Z-axis direction by a control device so that holding surfaces thereof are positioned on the slightly lower side (−Z side) of the holding surface of the sheet holder SH1. Accordingly, an appropriate tension is applied to the sheet S in the width direction (Y-axis direction) and the longitudinal direction, so that the center portion of the sheet S is fixed onto the holding surface of the sheet holder SH1. That is, in the state where an XY two-dimensional tension is applied to a separate area SAi of the sheet S, a rear surface portion corresponding to the separate area SAi of the sheet S is changed in accordance with the flat shape of the holding surface of the sheet holder SH1. In addition, in the state where the tension is applied to the predetermined area in the longitudinal direction and the width direction, the rear surface portion corresponding to the predetermined area of the sheet material S is changed in accordance with the flat reference surface so as to be flattened. In addition, the predetermined area of the flattened sheet material is irradiated with an energy beam so as to form a pattern thereon.
摘要:
A substrate case includes a shaft portion around which a sheet-shaped substrate having a circuit area in which a circuit manufacturing process is performed is wound; and a cover portion that accommodates the substrate in the state of being wound around the shaft portion, the shaft portion having a holding portion that holds an area different from the circuit area at a winding start portion of the substrate.
摘要:
A manufacturing method for a printed wiring board includes forming an electroless plated film on an interlayer resin insulation layer, forming on the electroless plated film a plating resist with an opening to expose a portion of the electroless plated film, forming an electrolytic plated film on the portion of the electroless plated film exposed through the opening, removing the plating resist using a resist-removing solution containing an amine, reducing a thickness of a portion of the electroless plated film existing between adjacent portions of the electrolytic plated film by using the resist-removing solution, and forming a conductive pattern by removing the portion of the electroless plated film existing between the adjacent portions of the electrolytic plated film by using an etchant.
摘要:
Six auxiliary sheet holders SH2 and SH3 temporarily holding a sheet S are minutely driven in the −Z-axis direction by a control device so that holding surfaces thereof are positioned on the slightly lower side (−Z side) of the holding surface of the sheet holder SH1. Accordingly, an appropriate tension is applied to the sheet S in the width direction (Y-axis direction) and the longitudinal direction, so that the center portion of the sheet S is fixed onto the holding surface of the sheet holder SH1. That is, in the state where an XY two-dimensional tension is applied to a separate area SAi of the sheet S, a rear surface portion corresponding to the separate area SAi of the sheet S is changed in accordance with the flat shape of the holding surface of the sheet holder SH1. In addition, in the state where the tension is applied to the predetermined area in the longitudinal direction and the width direction, the rear surface portion corresponding to the predetermined area of the sheet material S is changed in accordance with the flat reference surface so as to be flattened. In addition, the predetermined area of the flattened sheet material is irradiated with an energy beam so as to form a pattern thereon.
摘要:
An exposure apparatus of one aspect of the present invention is provided with a moving mechanism that moves a first portion of a belt-shaped substrate that has photosensitivity in a first heading along a first direction and moves a second portion of the substrate in a second heading along the first direction, a stage mechanism that holds a mask and moves it in a third heading along a second direction in synchronization with the movement of the substrate, and a projection optical system. The projection optical system forms a first projection image of the pattern on the first portion so that the third heading on the mask and the first heading on the first portion optically correspond, and forms a second projection image of the pattern on the second portion so that the third heading on the mask and the second heading on the second portion optically correspond.
摘要:
An exposure apparatus, wherein an exposure of a substrate (P) is carried out by filling at least a portion of the space between a projection optical system and the substrate (P) with a liquid and projecting an image of a pattern onto the substrate (P) via the projection optical system and the liquid, includes a bubble detector (20) which detects air bubble or bubbles in the liquid between the projection optical system and the substrate (P). Consequently, the exposure apparatus is capable of suppressing deterioration of a pattern image caused by bubbles in the liquid when an exposure is carried out while filling the space between the projection optical system and the substrate with the liquid.
摘要:
An alignment apparatus according to the present invention is constructed, for example, which is arranged in an exposure apparatus provided with a projection optical system which projects a predetermined pattern formed on a mask onto a substrate under exposure light, which performs relative positioning between the mask and the substrate, which has light irradiating means for irradiating alignment light in a wavelength region different from that of exposure light onto an alignment mark formed on the substrate through the projection optical system and detecting means for detecting light from the alignment mark through the projection optical system, wherein, for alignment light as irradiation light traveling toward the alignment mark and alignment light as detection light from the alignment mark, there are provided correction optical elements for irradiation light and correction optical elements for detection light to cause axial chromatic aberration and magnification chromatic aberration in the opposite directions to axial chromatic aberration and magnification chromatic aberration of the projection optical system between the mask and the substrate, wherein the alignment light is multi-colored light with a plurality of beams different in wavelength from each other in the wavelength region different from that of exposure light, and wherein the correction optical elements for irradiation light or the correction optical elements for detection light each are provided in correspondence with the plurality of beams different in wavelength.
摘要:
In order to measure an image formation characteristic of a projection optical system directly and continuously without using a substrate to be replaced during a step for exposure a reticle, a wafer or the like, a reference unit, on which a reference mark is formed, is disposed between the projection optical system and the wafer. In a measuring optical system, diffracted light obtained by irradiating laser beam onto a diffraction grating on a measuring reference plate is irradiated onto a reference mark on the reference unit through a modulator and the projection optical system. Interference light generated from the reference mark is received by a photoelectric sensor through the projection optical system. A variation quantity of a focus position of the projection optical system is obtained from a phase difference of a detection signals output from the photoelectric sensor. A variation quantity of a projection magnification is obtained from an average of the phases of the detection signals.