公开(公告)号：US5242715A

公开(公告)日：1993-09-07

申请号：US835805

申请日：1992-02-14

申请人： Lothar Schoen ,  Bernhard Stapp ,  Heiner Bayer ,  Helmut Markert ,  Volker Muhrer

发明人： Lothar Schoen ,  Bernhard Stapp ,  Heiner Bayer ,  Helmut Markert ,  Volker Muhrer

IPC分类号： B05D3/02 ,  B05D3/06 ,  B05D7/24 ,  C08G59/00 ,  C08G59/68 ,  C08L63/00 ,  C09D163/00 ,  C09J163/00 ,  G03F7/029 ,  H01L21/56 ,  H01L23/29 ,  H05K3/28

CPC分类号： H01L23/293 ,  C08G59/687 ,  G03F7/029 ,  H01L21/56 ,  H01L2924/0002 ,  H05K3/285

摘要： In a process for coating or bonding electronic components and subassemblies with reaction resin mixtures that are stable in storage at room temperature as a one-component system for several months, reaction resin mixtures are used, which contain the following components:a cationically hardenable, solvent-free epoxy resin;a triarylsulphonium salt with hexafluorophosphate, -arsenate or -antimonate as anion, with a mass concentration of 0.01 to 5% (relative to epoxy resin); anda benzylthiolanium salt with hexafluorophosphate, -arsenate or -antimonate as anion, with a mass concentration of 0.01 to 5% (relative to epoxy resin);as well as possibly customary additives.These reaction resin mixtures are hardened through UV radiation and thermally.

摘要翻译： 在用作为单组分体系几个月在室温下储存稳定的反应树脂混合物涂覆或粘合电子部件和组件的方法中，使用反应树脂混合物，其含有以下组分：阳离子可硬化溶剂 无环氧树脂; 三芳基锍盐与六氟磷酸盐，胂酸盐或锑酸盐阴离子，质量浓度为0.01〜5％（相对于环氧树脂）; 和具有六氟磷酸盐，胂酸盐或锑酸盐作为阴离子的苄基硫鎓盐，质量浓度为0.01〜5％（相对于环氧树脂）; 以及可能的常规添加剂。 这些反应树脂混合物通过UV辐射和热固化。

公开(公告)号：US20090302713A1

公开(公告)日：2009-12-10

申请号：US12298096

申请日：2007-04-24

申请人： Heiner Bayer ,  Hellmut Freudenberg ,  Axel Ganster ,  Christoph Hamann ,  Oliver Hennig ,  Jens Dahl Jensen ,  Günter Lugert ,  Randolf Mock ,  Carsten Schuh ,  Jörg Zapf

发明人： Heiner Bayer ,  Hellmut Freudenberg ,  Axel Ganster ,  Christoph Hamann ,  Oliver Hennig ,  Jens Dahl Jensen ,  Günter Lugert ,  Randolf Mock ,  Carsten Schuh ,  Jörg Zapf

IPC分类号： H01L41/053 ,  H01L41/24

CPC分类号： H01L41/23 ,  H01L41/0533 ,  H01L41/083 ,  Y10T29/42

摘要： In a method for producing a multilayer encapsulation (1) of a piezo actuator (5) such that the piezo actuator (5) is protected towards the outside without having to use an additional enveloping housing-type structure, in order to produce the multilayer encapsulation (1), an electrically insulating elastic layer (10) is first applied to the surface of the piezo actuator (5), whereupon a metallic layer is applied to the electrically insulating elastic layer (10) so as to planarly cover the same.

摘要翻译： 在制造压电致动器（5）的多层封装（1）的方法中，使得压电致动器（5）被保护以朝向外部而不必使用附加的包封外壳型结构，以便产生多层封装 （1）中，首先将电绝缘弹性层（10）施加到压电致动器（5）的表面，由此将金属层施加到电绝缘弹性层（10）上以平面地覆盖该电绝缘弹性层。

公开(公告)号：US06692986B1

公开(公告)日：2004-02-17

申请号：US10070608

申请日：2002-06-25

申请人： Heiner Bayer ,  Wolfgang Rogler ,  Wolfgang Roth

发明人： Heiner Bayer ,  Wolfgang Rogler ,  Wolfgang Roth

IPC分类号： H01L5120

CPC分类号： H01L51/5246

摘要： A method of encapsulating components based on organic semiconductors, includes adhesively bonding a housing to a substrate. Bonding is carried out using a UV-curable reactive adhesive including an epoxy resin, a hydroxy-functional reaction product of an epoxide compound with a phenolic compound, a silane-type adhesion promoter, and a photoinitiator, and also if desired, filler. This method is used in particular for encapsulating organic light-emitting diodes (OLEDs).

摘要翻译： 基于有机半导体封装组件的方法包括将壳体粘合到基底上。 使用包含环氧树脂，环氧化合物与酚类化合物的羟基官能化反应产物，硅烷型粘合促进剂和光引发剂的UV固化反应性粘合剂，以及根据需要的填料进行粘合。 该方法特别用于封装有机发光二极管（OLED）。

公开(公告)号：US06297344B1

公开(公告)日：2001-10-02

申请号：US09230310

申请日：1999-01-22

申请人： Klaus Höhn ,  Heiner Bayer

发明人： Klaus Höhn ,  Heiner Bayer

IPC分类号： C08K505

CPC分类号： C09J11/06 ,  C08G59/24 ,  C09J11/04 ,  C09J163/00

摘要： A composition comprises from 60-98 weight percent of a casting resin such as an epoxy resin, from 2-30 weight percent of an alcohol or sugar such as 3 (4), 8 (9)-bis(hydroxymethyl)tricyclo[5.2.1.02,6]decane, from 0.2 to 2.0 weight percent of a thermal initiator such as an onium salt, from 0.2-2.0 weight percent of a bonding agent such as 3-glycidyloxypropyltrimethoxysilane, from 0-3.0 weight percent of a flow improver, from 0.2-5.0 weight percent of a metal complex with an organic ligand such as an amino acid, acetate, carbonic acid, amine and acetylacetonate including zinc di-(2-ethylhexanoate) and from 0-4 weight percent of a thixotropic agent and/or a flow modifier.

摘要翻译： 组合物包含60-98重量％的浇铸树脂如环氧树脂，2-30重量％的醇或糖如3（4），8（9） - 双（羟甲基）三环[5.2。 1.02,6]癸烷，0.2-2.0重量％的热引发剂如鎓盐，0.2-2.0重量％的粘合剂如3-缩水甘油氧基丙基三甲氧基硅烷，0-3.0重量％的流动改进剂，来自 0.2-5.0重量％的具有有机配体如氨基酸，乙酸酯，碳酸，胺和乙酰丙酮化物的金属络合物，包括二 - （2-乙基己酸锌）和0-4重量％的触变剂和/或 流动修改器。

公开(公告)号：US06200408B1

公开(公告)日：2001-03-13

申请号：US09341927

申请日：1999-07-20

申请人： Heiner Bayer ,  Ernst Wipfelder

发明人： Heiner Bayer ,  Ernst Wipfelder

IPC分类号： B32B3128

CPC分类号： H01L24/83 ,  C08G59/68 ,  C08L63/00 ,  C09J5/06 ,  C09J163/00 ,  C09J2463/00 ,  G03F7/038 ,  H01L24/29 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/8319 ,  H01L2224/83224 ,  H01L2224/8388 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01051 ,  H01L2924/01061 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199

摘要： A rapid and precise cementing of components to a surface is achieved using a specially modified cement on an epoxy base in that the parts to be cemented are precisely aligned at the cemented location, are fixed with UV light and are subsequently thermally hardened.

摘要翻译： 使用环氧树脂基底上的特别改性的水泥可快速而精确地将组分固化到表面上，因为待胶结的部件在胶合位置精确对准，用UV光固定并随后热固化。

公开(公告)号：US5468786A

公开(公告)日：1995-11-21

申请号：US191141

申请日：1994-02-02

申请人： Heiner Bayer ,  Barbara Lehner ,  Michael Rogalli

发明人： Heiner Bayer ,  Barbara Lehner ,  Michael Rogalli

IPC分类号： C08F2/46 ,  C08F2/50 ,  C08F2/54 ,  C08F283/00 ,  C08G59/00 ,  C08G59/18 ,  C08L63/00 ,  C08L101/00

CPC分类号： C08F283/00

摘要： A radiation-curable reaction resin system, comprising a homogeneous solution of a thermoplastic and a reaction resin, whereby the proportion of the thermoplastic in the solution is approximately 3 to about 50% by weight. The reaction resin system has a stable shelf life. Further, the reaction resin system can be cured by radiation to form a shaped material, comprising a continuous and a discontinuous phase and which exhibits thermoplastic-like behavior.

摘要翻译： 一种可辐射固化的反应树脂体系，其包含热塑性树脂和反应树脂的均匀溶液，由此该溶液中热塑性塑料的比例为约3至约50重量％。 反应树脂体系具有稳定的保质期。 此外，反应树脂体系可以通过辐射固化以形成成型材料，其包含连续的和不连续的相，并表现出类似热塑性的行为。

公开(公告)号：US4970399A

公开(公告)日：1990-11-13

申请号：US392362

申请日：1989-08-10

申请人： Reiner Habrich ,  Heiner Bayer

发明人： Reiner Habrich ,  Heiner Bayer

IPC分类号： B01J19/12 ,  B05C9/10 ,  B05D3/06 ,  B29B13/08 ,  B29C35/08 ,  C08F2/48 ,  C08F2/50 ,  C08G8/00 ,  C08G12/00 ,  C08G59/00

CPC分类号： B05D3/06 ,  B05C9/10

摘要： UV-hardenable reaction resin compounds are irradiated in an applicator and immediately fed to an object that is to be covered. An initial, not activated reaction resin compound is irradiated after entering an input opening in a reactor having an irradiation space, a UV-radiation source and, optionally, a reflector. Immediately thereafter the activated compound is fed to an object to be coated or to an object to be surrounded, in an open casting mold or to a closed casting mold via the exit opening, optionally via a casting canal. The method and the apparatus are particularly well suited for covering semiconductor components and for encapsulating active and passive components as well as for cementing UV-impermeable fitting parts.

公开(公告)号：US07851978B2

公开(公告)日：2010-12-14

申请号：US12298096

申请日：2007-04-24

申请人： Heiner Bayer ,  Hellmut Freudenberg ,  Axel Ganster ,  Christoph Hamann ,  Oliver Hennig ,  Jens Dahl Jensen ,  Günter Lugert ,  Randolf Mock ,  Carsten Schuh ,  Jörg Zapf

发明人： Heiner Bayer ,  Hellmut Freudenberg ,  Axel Ganster ,  Christoph Hamann ,  Oliver Hennig ,  Jens Dahl Jensen ,  Günter Lugert ,  Randolf Mock ,  Carsten Schuh ,  Jörg Zapf

IPC分类号： H01L41/083

CPC分类号： H01L41/23 ,  H01L41/0533 ,  H01L41/083 ,  Y10T29/42

摘要： In a method for producing a multilayer encapsulation (1) of a piezo actuator (5) such that the piezo actuator (5) is protected towards the outside without having to use an additional enveloping housing-type structure, in order to produce the multilayer encapsulation (1), an electrically insulating elastic layer (10) is first applied to the surface of the piezo actuator (5), whereupon a metallic layer is applied to the electrically insulating elastic layer (10) so as to planarly cover the same.

摘要翻译： 在制造压电致动器（5）的多层封装（1）的方法中，使得压电致动器（5）被保护以朝向外部而不必使用附加的包封外壳型结构，以便产生多层封装 （1）中，首先将电绝缘弹性层（10）施加到压电致动器（5）的表面，由此将金属层施加到电绝缘弹性层（10）上以平面地覆盖该电绝缘弹性层。

公开(公告)号：US20090278423A1

公开(公告)日：2009-11-12

申请号：US12298116

申请日：2007-04-24

申请人： Heiner Bayer ,  Hellmut Freudenberg ,  Axel Ganster ,  Christoph Hamann ,  Oliver Hennig ,  Jens Dahl Jensen ,  Günter Lugert ,  Randolf Mock ,  Carsten Schuh

发明人： Heiner Bayer ,  Hellmut Freudenberg ,  Axel Ganster ,  Christoph Hamann ,  Oliver Hennig ,  Jens Dahl Jensen ,  Günter Lugert ,  Randolf Mock ,  Carsten Schuh

IPC分类号： H01L41/053 ,  B05D1/08

CPC分类号： H01L41/23 ,  C23C4/06 ,  C23C24/04 ,  H01L41/0533 ,  H01L41/083

摘要： In a method for the production of a gradient encapsulation layer 20 on a piezoelectric actuator 1, based on this gradient encapsulation layer 20, the piezoelectric actuator 1 does not 5 require an additional housing-like enveloping structure in order to be protected externally. The gradient encapsulation layer 20 is produced by cold gas spraying of particles having different material properties.

摘要翻译： 在压电致动器1上制造梯度封装层20的方法中，基于该梯度封装层20，压电致动器1不需要额外的外壳状包封结构以便被外部保护。 梯度封装层20是通过冷气喷射具有不同材料特性的颗粒制成的。

公开(公告)号：US06931699B2

公开(公告)日：2005-08-23

申请号：US10169854

申请日：2000-12-20

申请人： Wolfgang Pahl ,  Heiner Bayer

发明人： Wolfgang Pahl ,  Heiner Bayer

IPC分类号： H01L41/09 ,  H01L23/62 ,  H01L41/18 ,  H01L41/22 ,  H03H3/08 ,  H03H9/02 ,  H03H9/145 ,  H04R17/00 ,  H01L41/04 ,  H01L41/08 ,  H02N2/00

CPC分类号： H01L23/62 ,  H01L2924/0002 ,  H01L2924/3011 ,  H03H9/02921 ,  Y10T29/42 ,  Y10T29/49005 ,  Y10T29/49155 ,  H01L2924/00

摘要： A method of producing a surface wave component with a drain for pyroelectric voltage includes forming electrically-conductive structures on a piezoelectric substrate. The structures form an acoustic path comprising an electroacoustic transducer. The method also includes forming a high-resistance layer on an entire surface of the substrate and on top of the electrically-conductive structures, and removing the high-resistance layer from at least a region corresponding to the electroacoustic transducer, such that at least a region outside the acoustic path remains covered by the high-resistance layer.

摘要翻译： 制造具有用于热电电压的漏极的表面波分量的方法包括在压电基片上形成导电结构。 该结构形成包括电声换能器的声路。 该方法还包括在基板的整个表面上和导电结构的顶部上形成高电阻层，并且从至少对应于电声换能器的区域去除高电阻层，使得至少一个 声道外部的区域保持被高电阻层覆盖。