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    Electronic device enclosure having electromagnetic energy containment and heat removal characteristics
    2.
    发明授权
    Electronic device enclosure having electromagnetic energy containment and heat removal characteristics 失效
    具有电磁能量控制和散热特性的电子设备外壳

    公开(公告)号：US5740013A

    公开(公告)日：1998-04-14

    申请号：US676602

    申请日：1996-07-03

    申请人： Arlen L. Roesner ,  Guy R. Wagner ,  Samuel M. Babb

    发明人： Arlen L. Roesner ,  Guy R. Wagner ,  Samuel M. Babb

    IPC分类号： H01L23/36 ,  H01L23/467 ,  H05K7/20 ,  H05K9/00

    CPC分类号： H05K9/0033 ,  H01L23/467 ,  H01L2924/0002

    摘要： An enclosure for integrated circuit devices is disclosed. The enclosure includes a first portion which substantially encloses a plurality of secondary, relatively low-power integrated circuit devices and which includes a mechanism for contacting the secondary integrated circuit devices in order to conduct heat away. The enclosure also includes a second portion, which may include an active cooling device, directly in contact with a primary, relatively high-power primary integrated circuit device. In addition to removing heat, the first and second enclosure portions together shield the integrated circuit devices to contain electromagnetic energy generated by the devices. The first and second enclosure portions also allow different levels of force to be applied to the primary and secondary devices.

    摘要翻译： 公开了用于集成电路器件的外壳。 外壳包括第一部分，其基本上包围多个次要的，相对低功率的集成电路装置，并且包括用于接触次级集成电路装置以便传导热量的机构。 外壳还包括第二部分，其可以包括主动冷却装置，其直接与主要相对高功率的一次集成电路装置接触。 除了去除热量之外，第一和第二外壳部分一起屏蔽集成电路器件以包含由器件产生的电磁能量。 第一和第二外壳部分还允许不同程度的力施加到主要和次要装置。

    ADVANCED GOLF MONITORING SYSTEM, METHOD AND COMPONENTS
    4.
    发明申请
    ADVANCED GOLF MONITORING SYSTEM, METHOD AND COMPONENTS 有权
    高级高尔夫监控系统，方法和组件

    公开(公告)号：US20120309553A1

    公开(公告)日：2012-12-06

    申请号：US13589116

    申请日：2012-08-18

    申请人： Larry J. Koudele ,  Guy R. Wagner

    发明人： Larry J. Koudele ,  Guy R. Wagner

    IPC分类号： A63B57/00

    CPC分类号： A63B43/00 ,  A63B69/3611 ,  A63B69/3655 ,  A63B69/3658 ,  A63B2220/13 ,  A63B2220/30 ,  A63B2220/35 ,  A63B2220/36 ,  A63B2220/40 ,  A63B2220/833 ,  A63B2225/15 ,  A63B2225/20 ,  A63B2225/50

    摘要： Monitoring of a golf ball and apparatus for doing so is described using differential time locating. Launch parameters of a golf ball can be characterized independent of any specific positional measurement on the basis of a ball signal that is transmitted from the ball. These parameters include initial spin, initial velocity, and initial trajectory. Ground proximity detection is described as well as a landing position and rollout position detection technique and associated apparatus. Calibration techniques are described for various kinds of range receivers that subsequently receive the ball signal.

    摘要翻译： 使用差分时间定位来描述高尔夫球和这样做的装置的监视。 高尔夫球的发射参数可以独立于基于从球传播的球信号的任何特定位置测量来表征。 这些参数包括初始旋转，初始速度和初始轨迹。 描述地面接近检测以及着陆位置和推出位置检测技术及相关装置。 对于随后接收球信号的各种距离接收机，描述校准技术。

    Heat Dissipation in a Lighting System and Method Thereof
    6.
    发明申请
    Heat Dissipation in a Lighting System and Method Thereof 审中-公开
    照明系统中的散热及其方法

    公开(公告)号：US20090189549A1

    公开(公告)日：2009-07-30

    申请号：US12197589

    申请日：2008-08-25

    申请人： John D. Crawford ,  Guy R. Wagner

    发明人： John D. Crawford ,  Guy R. Wagner

    IPC分类号： H05B37/02

    CPC分类号： H05B33/0845 ,  F21L4/02 ,  F21V5/006 ,  F21V5/007 ,  F21V23/0414 ,  F21V29/75 ,  F21V29/76 ,  F21W2111/10 ,  F21Y2113/00 ,  F21Y2115/10 ,  H05B33/0803 ,  H05B37/02

    摘要： A lighting system is provided that includes at least one lighting device, at least one connector, and a plurality of external power sources. The at least one lighting device includes at least one lighting source, and an internal power source applying a first electrical current to illuminate the at least one lighting element, wherein the internal power source supplies the first electrical current. The at least one connector electrically connects to the at least one lighting device. The plurality of external power sources include at least first and second external power sources that are adapted to be electrically connected to the at least one lighting device by the at least one connector. The first external power source supplies a second electrical current to the at least one lighting device to illuminate the at least one lighting source and the second external power source supplies a third electrical current to illuminate the at least one lighting source, such that the internal power source and one of the plurality of external power sources each supply electrical current to illuminate the at least one lighting source at different times.

    摘要翻译： 提供一种照明系统，其包括至少一个照明装置，至少一个连接器和多个外部电源。 所述至少一个照明装置包括至少一个照明源和施加第一电流以照亮所述至少一个照明元件的内部电源，其中所述内部电源提供所述第一电流。 所述至少一个连接器电连接到所述至少一个照明装置。 多个外部电源包括至少第一和第二外部电源，其适于通过至少一个连接器与至少一个照明装置电连接。 所述第一外部电源向所述至少一个照明装置提供第二电流以照亮所述至少一个照明源，并且所述第二外部电源提供第三电流以照亮所述至少一个照明源，使得所述内部功率 源和多个外部电源之一各自提供电流以在不同时间点亮至少一个照明源。

    Cooling apparatus for dissipating heat from a heat source
    7.
    发明授权
    Cooling apparatus for dissipating heat from a heat source 失效
    用于从热源散热的冷却装置

    公开(公告)号：US06986384B2

    公开(公告)日：2006-01-17

    申请号：US10208065

    申请日：2002-07-30

    申请人： Guy R. Wagner ,  Chandrakant D. Patel

    发明人： Guy R. Wagner ,  Chandrakant D. Patel

    IPC分类号： F28D15/00 ,  F28D15/02 ,  H05K7/20

    CPC分类号： H01L23/427 ,  F28D15/0233 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A cooling device primarily for cooling, e.g., integrated circuits or other electronic devices during operation may include a heat sink portion having a plurality of cooling vanes and a heat pipe chamber. Both the cooling vanes and the heat pipe chamber may be integrally formed within the heat sink portion. Because the heat pipe chamber is integrally formed with the cooling vanes, no joints exist between the condensing surface of the heat pipe chamber and the cooling vanes. This, in turn, allows extremely rapid and efficient heat transfer between the heat pipe chamber and the cooling vanes. The cooling device may include extensions of the main heat pipe chamber which project into each of the cooling vanes. In this manner, the condensing surface of the heat pipe chamber is actually moved into the vanes at a position very close to the surface of the vanes where heat transfer into the atmosphere occurs.

    摘要翻译： 主要用于冷却的冷却装置，例如在操作期间的集成电路或其他电子装置可以包括具有多个冷却叶片和热管室的散热部分。 冷却叶片和热管室都可以整体地形成在散热器部分内。 由于热管室与冷却叶片一体形成，所以在热管室的冷凝面和冷却叶片之间不存在接头。 这反过来又允许热管室和冷却叶片之间的极快速和有效的热传递。 冷却装置可以包括突出到每个冷却叶片中的主热管室的延伸部。 以这种方式，热管室的冷凝表面实际上在非常接近叶片表面的位置移动到叶片中，其中发生热传递到大气中。

    Removable mounting clip attaches a motorized fan to an active heat sink and then the entire assembly to a part to be cooled
    8.
    发明授权
    Removable mounting clip attaches a motorized fan to an active heat sink and then the entire assembly to a part to be cooled 失效
    可移动安装夹将电动风扇连接到主动散热器，然后将整个组件安装到待冷却的部件上

    公开(公告)号：US06640882B2

    公开(公告)日：2003-11-04

    申请号：US09919150

    申请日：2001-07-31

    申请人： James Glenn Dowdy ,  Guy Diemunsch ,  Guy R Wagner

    发明人： James Glenn Dowdy ,  Guy Diemunsch ,  Guy R Wagner

    IPC分类号： F28F700

    CPC分类号： H01L23/467 ,  H01L23/4093 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A removably mounted fan for an active heat sink, and the mounting of that combination to a part to be cooled, is obtained by: (1) The use a fan that engages and registers itself upon and against a top peripheral surface surrounding a cavity where the fan is to be located; (2) Holding the fan in place with one or more resilient mounting clips that span the distance from the top of the fan and an opposing outside bottom surface of the active heat sink; and, (3) Providing the resilient mounting clips with outward projecting mounting tabs that are flexible and resilient and that have mounting holes through which the resilient mounting clips (and the active heat sink they grip) can be attached to an assembly carrying the part to be cooled, such that the bottom of the active heat sink is in good thermal contact with that part.

    摘要翻译： 通过以下方式获得用于主动散热器的可拆卸地安装的风扇以及将该组合安装到待冷却部件上：（1）使用风扇，其接合并自身并且抵靠围绕空腔的顶部周边表面 风扇位于; （2）用一个或多个弹性安装夹将风扇固定在适当的位置，该安装夹与风扇的顶部和活动散热片的相对的外表面跨越; 和（3）向弹性安装夹提供具有弹性和弹性的向外突出的安装片，并且具有安装孔，弹性安装夹（及其夹持的主动散热片）可通过该安装孔附接到承载该部件的组件 被冷却，使得主动散热器的底部与该部件良好的热接触。

    Cooling apparatus for electronic devices
    9.
    发明授权
    Cooling apparatus for electronic devices 失效
    电子设备冷却装置

    公开(公告)号：US06176299B1

    公开(公告)日：2001-01-23

    申请号：US09253877

    申请日：1999-02-22

    申请人： Steven E. Hanzlik ,  Michael A. Hansen ,  Guy R. Wagner

    发明人： Steven E. Hanzlik ,  Michael A. Hansen ,  Guy R. Wagner

    IPC分类号： H05K720

    CPC分类号： H01L23/467 ,  F04D29/526 ,  F04D29/685 ,  H01L2924/0002 ,  H01L2924/00

    摘要： Disclosed herein is a cooling device primarily for cooling integrated circuits or other electronic devices during operation. The cooling device may include a heat sink portion and a fan, or other air movement device. The outer periphery of the heat sink portion may be formed with outwardly extending lobes, leaving recessed areas between the lobes. The lobes may be sized and located so as to correspond to heat concentration areas on an electronic device package. In this manner, heat sink material may be concentrated adjacent heat concentration areas where more heat removal is required. The overall mass and size of the heat sink portion may, thus, be reduced without significantly impairing the ability of the cooling device to remove heat from an electronic device.

    摘要翻译： 本文公开了一种主要用于在操作期间冷却集成电路或其它电子设备的冷却装置。 冷却装置可以包括散热部分和风扇或其它空气移动装置。 散热部分的外周可以形成有向外延伸的凸角，从而在凸角之间留下凹陷区域。 波瓣的尺寸和位置可以对应于电子设备封装上的热集中区域。 以这种方式，散热材料可以集中在需要更多散热的热集中区域。 因此，可以减少散热部分的整体质量和尺寸，而不会显着损害冷却装置从电子设备移除热量的能力。