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    Optical devices and methods to construct the same
    2.
    发明授权
    Optical devices and methods to construct the same 失效
    光学器件和方法构造相同

    公开(公告)号：US07195941B2

    公开(公告)日：2007-03-27

    申请号：US10397580

    申请日：2003-03-26

    Applicant: Daoqiang Lu ,  Gilroy Vandentop

    Inventor： Daoqiang Lu ,  Gilroy Vandentop

    IPC: H01L21/00 ,  H32B6/36

    CPC classification number: G02B6/423 ,  G02B6/4232

    Abstract: Optical devices and methods for constructing the same are disclosed. An example optical device includes an optical transmitter, a photodetector and a waveguide optically coupling the optical transmitter and the photodetector. It also includes a substrate having a first cavity to receive the optical transmitter and a second cavity to receive the second transmitter. The first and second cavities are located and dimensioned to passively align the optical transmitter, the waveguide and the photodetector when the transmitter is inserted into the first cavity and the photodetector is inserted into the second cavity.

    Abstract translation: 公开了用于构造它们的光学器件和方法。 一种示例性的光学器件包括光发射器，光电检测器和光学耦合光发射器和光电检测器的波导。 其还包括具有用于接收光发射器的第一腔体和用于接收第二发射器的第二腔体的衬底。 第一和第二空腔的位置和尺寸被定位成当发射器被插入到第一空腔中并且光电检测器被插入到第二腔中时被动对准光发射器，波导和光电检测器。

    Optical package
    3.
    发明申请
    Optical package 失效
    光学包装

    公开(公告)号：US20060067609A1

    公开(公告)日：2006-03-30

    申请号：US10954903

    申请日：2004-09-30

    Applicant: Daoqiang Lu ,  Henning Braunisch ,  Gilroy Vandentop

    Inventor： Daoqiang Lu ,  Henning Braunisch ,  Gilroy Vandentop

    IPC: G02B6/26 ,  G02B6/12 ,  G02B6/42

    CPC classification number: G02B6/1228 ,  G02B6/24 ,  G02B2006/12147

    Abstract: Optical packages are disclosed. In one aspect, an optical package may include a surface, a microelectronic device coupled with the surface, a first waveguide coupled with the microelectronic device, a second waveguide having a first end that is evanescently coupled with the first waveguide and a second end, a first thickness of a cladding material disposed between the second end and the surface, and a second thickness of a cladding material disposed between the first end and the first waveguide. The first thickness may be greater than the second thickness. Methods of making the optical packages are also disclosed. Apparatus and methods of aligning operations on optical packages are also disclosed.

    Abstract translation: 公开了光学封装。 在一个方面，光学封装可以包括表面，与表面耦合的微电子器件，与微电子器件耦合的第一波导，具有与第一波导ev逝地耦合的第一端和第二端的第二波导， 设置在第二端和表面之间的包层材料的第一厚度，以及设置在第一端和第一波导之间的包层材料的第二厚度。 第一厚度可以大于第二厚度。 还公开了制造光学封装件的方法。 还公开了在光学封装上对准操作的装置和方法。

    Electronic package with integrated clock distribution structure
    8.
    发明授权
    Electronic package with integrated clock distribution structure 有权

    公开(公告)号：US06593793B1

    公开(公告)日：2003-07-15

    申请号：US10042273

    申请日：2002-01-11

    Applicant: Henning Braunisch ,  Raj Nair ,  Gilroy Vandentop

    Inventor： Henning Braunisch ,  Raj Nair ,  Gilroy Vandentop

    IPC: H03K300

    CPC classification number: G06F1/10

    Abstract: An electronic package and method for spatially distributing a clock signal is presented. The electronic package includes a low-loss structure, a semiconductor die, clocking vias, and clock receivers on the die. The low-loss structure is constructed and arranged to be driven by a clock signal and to produce standing waves. The clocking vias are constructed and arranged to connect the low-loss structure to the die and to conduct the standing waves to the die. The clock receivers generate respective synchronous on-chip clock signals based at least in part on the conducted standing waves.

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