Polyamide graft as hot-melt adhesive, and elastomer blend
    3.
    发明授权
    Polyamide graft as hot-melt adhesive, and elastomer blend 失效
    聚酰胺接枝作为热熔胶,和弹性体共混

    公开(公告)号:US4378448A

    公开(公告)日:1983-03-29

    申请号:US192341

    申请日:1980-09-29

    摘要: A polyamide suitable as a hot-melt adhesive contains pendent graft copolymerized chains derived from aromatic compounds having an olefinically unsaturated moiety, e.g., styrene, lower methacrylates, epoxy-containing unsaturated compounds, acrylonitrile or methacrylonitrile, but contains no free graft comonomer.The polyamides show improved peel strengths, especially at low and high temperatures. The low temperature properties may be further improved by incorporating an elastomer, preferably a thermoplastic elastomer, part of which is compatible with the graft copolymerized chains.

    摘要翻译: 适合作为热熔粘合剂的聚酰胺包含衍生自具有烯属不饱和部分的芳族化合物的侧链接枝共聚链,例如苯乙烯,低级甲基丙烯酸酯,含环氧基的不饱和化合物,丙烯腈或甲基丙烯腈,但不含游离的接枝共聚单体。 聚酰胺显示出改善的剥离强度,特别是在低温和高温下。 可以通过引入弹性体,优选热塑性弹性体,其中的一部分与接枝共聚链相容而进一步改善低温性能。

    Conductive polymer composition
    4.
    发明授权
    Conductive polymer composition 失效
    导电聚合物组成

    公开(公告)号:US5250228A

    公开(公告)日:1993-10-05

    申请号:US788655

    申请日:1991-11-06

    摘要: A conductive polymer composition in which a particulate conductive filler is dispersed in a polymeric component which is a mixture of an essentially amorphous thermoplastic resin and a thermosetting resin. In preferred compositions, the amorphous thermoplastic resin and the thermosetting resin are substantially mutually soluble. In order to improve the thermal stability of the composition on exposure to successive thermal cycles, it is preferred that the composition be cured by heating the uncured mixture of amorphous thermoplastic resin, thermosetting resin, and particulate conductive filler at a rate of at least 15.degree. C./minute to the cure temperature.

    摘要翻译: 一种导电聚合物组合物,其中颗粒状导电填料分散在聚合物组分中,聚合物组分是基本上无定形的热塑性树脂和热固性树脂的混合物。 在优选的组合物中,无定形热塑性树脂和热固性树脂基本上是相互溶解的。 为了提高组合物暴露于连续热循环的热稳定性,优选通过以至少15℃的速度加热无定形热塑性树脂,热固性树脂和颗粒状导电填料的未固化混合物来固化组合物 C. /分钟到治愈温度。