摘要:
A method of fabricating a tag includes the steps of applying a first patterned adhesive to the surface of the substrate and applying a first electrically conductive foil to the first patterned adhesive. A portion of the first electrically conductive foil not adhered to the first patterned adhesive is removed and a second patterned adhesive is applied to a portion of a surface area of the tag. A preformed second electrically conductive foil is applied to the second patterned adhesive to adhere the second electrically conductive foil to the surface of the substrate and portions of the first and second electrically conductive foils are electrically coupled to each other to form a tag circuit. A second patterned adhesive can be disposed between the first and second electrically conductive foils.
摘要:
A circuit element the presence of the circuit element includes first and second capacitor plates disposed over the surface of the substrate in an aligned relationship with each other. The aligned relationship has manufacturing variations in the relative positioning of the first and second capacitor plates and a dielectric layer disposed between the first and second capacitor plates. At least one of the first and second capacitor plates is formed substantially smaller relative to the other of the first and second capacitor plates. The at least one of the capacitor plates is disposed at a predetermined offset in at least one planar direction from an edge of the other of the first and second capacitor plates. The predetermined offset is selected according to the manufacturing variations to prevent variations in the value of capacitance of the capacitor due to the manufacturing variations.
摘要:
A tag having a substrate having a surface with a preformed first patterned adhesive disposed over the surface thereof and a first layer of electrically conductive material having a shape corresponding to a desired final pattern for a first electrically conductive trace secured to the surface of the substrate. The preformed first patterned adhesive corresponds to the desired final pattern. A second patterned adhesive is disposed over a portion of a surface area of the tag. An electrically conductive trace is disposed over the second patterned adhesive to adhere the second electrically conductive trace thereto. An electrical connection is provided for electrically coupling portions of the first and second electrically conductive traces to form a tag circuit. The tag circuit can be an LC resonant circuit. The preformed first patterned adhesive can be a flexographic printed layer.
摘要:
A stowable antenna system for a security system is providing which includes an electronic radiating element in the form of a furlable flexible sheet, a power supply to power the electronic radiating element and a housing to receive and store the radiating element in a furled condition. The radiating element may be extended to an unfurled condition for use in the security system. One or more risers may extend from the housing for supporting the radiating element in the unfurled condition. The electronic radiating element may be received in the housing and stored in the housing in a rolled up, windowshade configuration.
摘要:
A system is disclosed for detecting the presence of an article. The system includes a transmitter for radiating a first electromagnetic signal at a predetermined primary frequency and a resonant tag secured to the article. The resonant tag generates a second electromagnetic signal in response to receiving the first electromagnetic signal. The second electromagnetic signal has components at the primary frequency and at a predetermined secondary frequency different from the primary frequency. The system also includes a receiver for receiving the second electromagnetic signal and a computer connected to an output of the receiver. The computer processes the received second electromagnetic signal and generates an output signal when the secondary frequency is detected in the second electromagnetic signal.
摘要:
Noise reduction schemes are provided in a radio frequency identification (RFID) system for use with RFID intelligent tags. Amplitude and phase noise is minimized by starting with a low noise crystal oscillator having an output frequency which is an integer multiple n of the desired RF field frequency, and then dividing this frequency by the integer multiple n. One or more cascaded flip-flops are used for the frequency dividing. Both outputs of the final stage flip-flop are used to drive the transmitter antenna to produce a continuous wave signal.
摘要:
Embodiments of systems include a capsule that houses one or more peripheral devices, such as radios, capable of being used with hand-held computing devices such as RFID tag readers. A receptacle can be mounted on the hand-held computing device. The receptacle receives the capsule. Electrical connectors on the capsule and the receptacle mate when the receptacle is received by the receptacle, to electrically connect the peripheral device and the hand-held computing device. A seal is provided to prevent infiltration of water, dust, and other contaminates into the electrical connectors. A portion of the capsule is exposed when the capsule is located in the receptacle, to accommodate external antennas, connectors, optical ports, etc. that may be required by the peripheral device.
摘要:
A process for forming a portion of a package or envelope bearing printed indicia, a label bearing printed indicia or a sheet bearing printed indicia includes providing a substrate which constitutes a portion of the package, label or sheet to a printing apparatus, and utilizing the printing apparatus or an adjunct to the printing apparatus to form at least one electrically conductive component of an EAS and/or RFID tag on the substrate substantially contemporaneously with the printing of the indicia on the substrate. The forming of the electrically conductive component on the substrate is accomplished slightly prior to the printing of the indicia on the substrate, slightly after the printing of the indicia on the substrate and at the same time as the printing of the indicia on the substrate.
摘要:
A method and apparatus for bonding integrated circuits uniquely suited to high volume tag production is described, where conductive material of a substrate at the die-attach-area is cut before an IC chip or transponder is placed on the conductive material over the cut and bonded. The apparatus performs the method of placing a first chip on a substrate having a conductive layer, measuring the location of the first chip on the substrate, cutting the conductive layer at a location of an expected subsequently placed chip to form a cut based on the measured location of the first chip, and placing the subsequently placed chip on the substrate over the cut.