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公开(公告)号：US08581378B2
公开(公告)日：2013-11-12
申请号：US12934814
申请日：2009-09-29
Applicant: Toshiyuki Yokoe , Chie Fujioka , Daichi Kumano
Inventor： Toshiyuki Yokoe , Chie Fujioka , Daichi Kumano
IPC: H01L23/495
CPC classification number: H01L24/40 , H01L23/49524 , H01L23/49562 , H01L23/49582 , H01L24/06 , H01L24/29 , H01L24/37 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/85 , H01L2224/04042 , H01L2224/05553 , H01L2224/05554 , H01L2224/05599 , H01L2224/0603 , H01L2224/29339 , H01L2224/32245 , H01L2224/37124 , H01L2224/40091 , H01L2224/40245 , H01L2224/40247 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/48091 , H01L2224/48108 , H01L2224/48247 , H01L2224/48472 , H01L2224/48599 , H01L2224/48639 , H01L2224/48647 , H01L2224/48655 , H01L2224/48699 , H01L2224/48739 , H01L2224/48747 , H01L2224/48755 , H01L2224/73219 , H01L2224/73221 , H01L2224/73265 , H01L2224/8388 , H01L2224/8485 , H01L2224/85399 , H01L2224/85439 , H01L2224/85447 , H01L2224/85455 , H01L2224/92 , H01L2224/92247 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0781 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/181 , H01L2924/351 , H01L2224/83 , H01L2224/84 , H01L2224/85 , H01L2924/00 , H01L2924/00012 , H01L2924/01049
Abstract: Terminals (2b, 2c) are divided into two along a common boundary, coatings (10, 11) most suitable for two conductive bonding materials (5, 6) to be used are exposed on the terminals (2b, 2c), the most suitable one of the coatings (10, 11) is selected, and the corresponding conductive bonding material (5, 6) is bonded onto the coating. Thus it is possible to improve the reliability of bonding and easily reduce a bonding resistance while suppressing a decrease in the reliability of a semiconductor element 3.
Abstract translation: 端子（2b，2c）沿着公共边界被分成两部分，最适用于两个导电接合材料（5,6）的涂层（10,11）暴露在端子（2b，2c）上，最适合 选择一个涂层（10,11），并将相应的导电接合材料（5,6）粘合到涂层上。 因此，可以提高接合的可靠性，并且容易降低接合电阻，同时抑制半导体元件3的可靠性的降低。
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公开(公告)号：US20110163431A1
公开(公告)日：2011-07-07
申请号：US12934018
申请日：2009-09-08
Applicant: Chie Fujioka , Toshiyuki Yokoe , Daichi Kumano
Inventor： Chie Fujioka , Toshiyuki Yokoe , Daichi Kumano
IPC: H01L23/495 , H01L21/449
CPC classification number: H01L24/40 , H01L23/49524 , H01L23/49562 , H01L24/06 , H01L24/16 , H01L24/29 , H01L24/37 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/84 , H01L2224/0401 , H01L2224/05553 , H01L2224/05624 , H01L2224/0603 , H01L2224/29339 , H01L2224/37124 , H01L2224/40091 , H01L2224/40245 , H01L2224/40247 , H01L2224/45144 , H01L2224/48091 , H01L2224/48108 , H01L2224/48247 , H01L2224/48624 , H01L2224/73219 , H01L2224/73221 , H01L2224/83801 , H01L2224/8385 , H01L2224/84205 , H01L2224/85375 , H01L2224/92 , H01L2224/92247 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , H01L2924/00014 , H01L2224/83 , H01L2224/85 , H01L2224/84 , H01L2924/00 , H01L2924/00012
Abstract: Retaining regions 310a and 310b are added to a pad shaped portion 303a of leads and a die pad 302 that are electrically connected via a conductive ribbon 309, so that during the bonding of the ribbon, strong ultrasonic waves can be applied in a state in which the retaining regions 310a and 310b are pressed and fixed. It is therefore possible to reduce a resistance at a joint while firmly bonding the conductive ribbon 309. Further, the bonding strength of the conductive ribbon 309 increases and thus it is possible to eliminate the need for stacking the conductive ribbons 309 and easily reduce a stress caused by ultrasonic waves on a semiconductor chip 306.
Abstract translation: 保持区域310a和310b被添加到通过导电带309电连接的引线和芯片焊盘302的焊盘形部分303a，使得在带状物的接合期间可以在其中施加强超声波 保持区域310a和310b被按压和固定。 因此，可以在牢固地接合导电带309的同时降低接头处的电阻。此外，导电带309的接合强度增加，因此可以消除堆叠导电带309的需要并且容易地减小应力 由半导体芯片306上的超声波引起的。
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Patent Agency Ranking
公开(公告)号：US20110115062A1
公开(公告)日：2011-05-19
申请号：US12934814
申请日：2009-09-29
Applicant: Toshiyuki Yokoe , Chie Fujioka , Daichi Kumano
Inventor： Toshiyuki Yokoe , Chie Fujioka , Daichi Kumano
IPC: H01L23/495 , H01L21/60
CPC classification number: H01L24/40 , H01L23/49524 , H01L23/49562 , H01L23/49582 , H01L24/06 , H01L24/29 , H01L24/37 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/85 , H01L2224/04042 , H01L2224/05553 , H01L2224/05554 , H01L2224/05599 , H01L2224/0603 , H01L2224/29339 , H01L2224/32245 , H01L2224/37124 , H01L2224/40091 , H01L2224/40245 , H01L2224/40247 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/48091 , H01L2224/48108 , H01L2224/48247 , H01L2224/48472 , H01L2224/48599 , H01L2224/48639 , H01L2224/48647 , H01L2224/48655 , H01L2224/48699 , H01L2224/48739 , H01L2224/48747 , H01L2224/48755 , H01L2224/73219 , H01L2224/73221 , H01L2224/73265 , H01L2224/8388 , H01L2224/8485 , H01L2224/85399 , H01L2224/85439 , H01L2224/85447 , H01L2224/85455 , H01L2224/92 , H01L2224/92247 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0781 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/181 , H01L2924/351 , H01L2224/83 , H01L2224/84 , H01L2224/85 , H01L2924/00 , H01L2924/00012 , H01L2924/01049
Abstract: Terminals (2b, 2c) are divided into two along a common boundary, coatings (10, 11) most suitable for two conductive bonding materials (5, 6) to be used are exposed on the terminals (2b, 2c), the most suitable one of the coatings (10, 11) is selected, and the corresponding conductive bonding material (5, 6) is bonded onto the coating. Thus it is possible to improve the reliability of bonding and easily reduce a bonding resistance while suppressing a decrease in the reliability of a semiconductor element 3.
Abstract translation: 端子（2b，2c）沿着公共边界被分成两部分，最适用于两个导电接合材料（5,6）的涂层（10,11）暴露在端子（2b，2c）上，最适合 选择一个涂层（10,11），并将相应的导电接合材料（5,6）粘合到涂层上。 因此，可以提高接合的可靠性，并且容易降低接合电阻，同时抑制半导体元件3的可靠性的降低。
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公开(公告)号：US08378468B2
公开(公告)日：2013-02-19
申请号：US12934033
申请日：2009-09-17
Applicant: Chie Fujioka , Toshiyuki Yokoe , Daichi Kumano
Inventor： Chie Fujioka , Toshiyuki Yokoe , Daichi Kumano
IPC: H01L23/495
CPC classification number: H01L24/40 , H01L23/49524 , H01L23/49562 , H01L24/06 , H01L24/37 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/84 , H01L2224/05624 , H01L2224/0603 , H01L2224/32245 , H01L2224/40091 , H01L2224/40245 , H01L2224/40247 , H01L2224/45144 , H01L2224/48091 , H01L2224/48108 , H01L2224/48247 , H01L2224/48624 , H01L2224/49171 , H01L2224/73219 , H01L2224/73221 , H01L2224/73263 , H01L2224/73265 , H01L2224/8385 , H01L2224/84205 , H01L2224/92246 , H01L2224/92247 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/37099
Abstract: By increasing the area of a source electrode 3a of a semiconductor element 3 and the area of a source terminal 2b of a lead frame 2, it is possible to extend a joint 8a of the source electrode 3a bonded to a conductive ribbon 6 and a joint 8b of the source terminal 2b. Thus it is possible to reduce an on resistance and easily reduce the number of times a bonding tool comes into contact with the joints to reduce a stress on the semiconductor element 3.
Abstract translation: 通过增加半导体元件3的源极电极3a的面积和引线框架2的源极端子2b的面积，可以延长接合到导电带6的接合部8a， 8b的源端子2b。 因此，可以降低导通电阻并且容易地减少接合工具与接头接触的次数，以减少对半导体元件3的应力。
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公开(公告)号：US08378467B2
公开(公告)日：2013-02-19
申请号：US12934018
申请日：2009-09-08
Applicant: Chie Fujioka , Toshiyuki Yokoe , Daichi Kumano
Inventor： Chie Fujioka , Toshiyuki Yokoe , Daichi Kumano
IPC: H01L23/495
CPC classification number: H01L24/40 , H01L23/49524 , H01L23/49562 , H01L24/06 , H01L24/16 , H01L24/29 , H01L24/37 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/84 , H01L2224/0401 , H01L2224/05553 , H01L2224/05624 , H01L2224/0603 , H01L2224/29339 , H01L2224/37124 , H01L2224/40091 , H01L2224/40245 , H01L2224/40247 , H01L2224/45144 , H01L2224/48091 , H01L2224/48108 , H01L2224/48247 , H01L2224/48624 , H01L2224/73219 , H01L2224/73221 , H01L2224/83801 , H01L2224/8385 , H01L2224/84205 , H01L2224/85375 , H01L2224/92 , H01L2224/92247 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , H01L2924/00014 , H01L2224/83 , H01L2224/85 , H01L2224/84 , H01L2924/00 , H01L2924/00012
Abstract: Retaining regions 310a and 310b are added to a pad shaped portion 303a of leads and a die pad 302 that are electrically connected via a conductive ribbon 309, so that during the bonding of the ribbon, strong ultrasonic waves can be applied in a state in which the retaining regions 310a and 310b are pressed and fixed. It is therefore possible to reduce a resistance at a joint while firmly bonding the conductive ribbon 309. Further, the bonding strength of the conductive ribbon 309 increases and thus it is possible to eliminate the need for stacking the conductive ribbons 309 and easily reduce a stress caused by ultrasonic waves on a semiconductor chip 306.
Abstract translation: 保持区域310a和310b被添加到通过导电带309电连接的引线和芯片焊盘302的焊盘形部分303a，使得在带状物的接合期间可以在其中施加强超声波 保持区域310a和310b被按压和固定。 因此，可以在牢固地接合导电带309的同时降低接头处的电阻。此外，导电带309的接合强度增加，因此可以消除堆叠导电带309的需要并且容易地减小应力 由半导体芯片306上的超声波引起的。
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公开(公告)号：US20110163432A1
公开(公告)日：2011-07-07
申请号：US12935120
申请日：2009-11-26
Applicant: Chie Fujioka
Inventor： Chie Fujioka
IPC: H01L23/495 , H01L21/58
CPC classification number: H01L24/37 , H01L23/49524 , H01L23/49551 , H01L23/49562 , H01L24/06 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/84 , H01L24/85 , H01L2224/05553 , H01L2224/05624 , H01L2224/0603 , H01L2224/32245 , H01L2224/37124 , H01L2224/40091 , H01L2224/40245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48108 , H01L2224/48247 , H01L2224/48624 , H01L2224/73219 , H01L2224/73221 , H01L2224/73265 , H01L2224/83801 , H01L2224/8385 , H01L2224/84205 , H01L2224/85 , H01L2224/92 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , H01L2924/00014 , H01L2224/84 , H01L2924/00 , H01L2924/00012
Abstract: Protrusions 310 are provided on the back side of a lead frame 301. During ultrasonic bonding, the lead frame 301 is placed on a stage and the protrusions 310 are brought into contact with or inserted into the stage, so that the lead frame 301 can be firmly retained on the stage.
Abstract translation: 突起310设置在引线框架301的背面。在超声波接合期间，引线框架301放置在台架上，并且突起310与台架接触或插入到台架中，使得引线框架301可以 坚定地保留在舞台上。
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公开(公告)号：US20110163392A1
公开(公告)日：2011-07-07
申请号：US12934033
申请日：2009-09-17
Applicant: Chie Fujioka , Toshiyuki Yokoe , Daichi Kumano
Inventor： Chie Fujioka , Toshiyuki Yokoe , Daichi Kumano
IPC: H01L29/78 , H01L21/449 , H01L23/495
CPC classification number: H01L24/40 , H01L23/49524 , H01L23/49562 , H01L24/06 , H01L24/37 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/84 , H01L2224/05624 , H01L2224/0603 , H01L2224/32245 , H01L2224/40091 , H01L2224/40245 , H01L2224/40247 , H01L2224/45144 , H01L2224/48091 , H01L2224/48108 , H01L2224/48247 , H01L2224/48624 , H01L2224/49171 , H01L2224/73219 , H01L2224/73221 , H01L2224/73263 , H01L2224/73265 , H01L2224/8385 , H01L2224/84205 , H01L2224/92246 , H01L2224/92247 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/37099
Abstract: By increasing the area of a source electrode 3a of a semiconductor element 3 and the area of a source terminal 2b of a lead frame 2, it is possible to extend a joint 8a of the source electrode 3a bonded to a conductive ribbon 6 and a joint 8b of the source terminal 2b. Thus it is possible to reduce an on resistance and easily reduce the number of times a bonding tool comes into contact with the joints to reduce a stress on the semiconductor element 3.
Abstract translation: 通过增加半导体元件3的源极电极3a的面积和引线框架2的源极端子2b的面积，可以延长接合到导电带6的接合部8a， 8b的源端子2b。 因此，可以降低导通电阻并且容易地减少接合工具与接头接触的次数，以减少对半导体元件3的应力。
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