Method of manufacturing photoelectric device
    10.
    发明授权
    Method of manufacturing photoelectric device 失效
    制造光电器件的方法

    公开(公告)号:US07972883B2

    公开(公告)日:2011-07-05

    申请号:US12400674

    申请日:2009-03-09

    Abstract: In a method of manufacturing a photoelectric device, a transparent conductive layer is formed on a substrate, and the transparent conductive layer is partially etched using an etching solution including hydrofluoric acid. Thus, a transparent electrode having a concavo-convex pattern on its surface is formed. When the transparent conductive layer is partially etched, a haze of the transparent electrode may be controlled by adjusting an etching time of the transparent conductive layer. Also, since the etching solution is sprayed to the transparent conductive layer to etch the transparent conductive layer, the concavo-convex pattern on the surface of the transparent electrode may be easily formed even though the size of the substrate increases.

    Abstract translation: 在制造光电器件的方法中,在衬底上形成透明导电层,并且使用包括氢氟酸的蚀刻溶液部分蚀刻透明导电层。 因此,形成在其表面具有凹凸图案的透明电极。 当透明导电层被部分蚀刻时,可以通过调节透明导电层的蚀刻时间来控制透明电极的雾度。 此外,由于将蚀刻溶液喷射到透明导电层以蚀刻透明导电层,所以即使基板的尺寸增加,也可以容易地形成透明电极表面上的凹凸图案。

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