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公开(公告)号：US08883034B2
公开(公告)日：2014-11-11
申请号：US12462638
申请日：2009-09-16
Applicant: Brian Reiss , John Clark , Lamon Jones , Jeffrey Gilliland , Michael White
Inventor： Brian Reiss , John Clark , Lamon Jones , Jeffrey Gilliland , Michael White
CPC classification number: C09G1/02 , C09K3/1463 , H01L21/02024
Abstract: The invention provides a polishing composition comprising (a) silica, (b) one or more compounds that increases the removal rate of silicon, (c) one or more tetraalkylammonium salts, and (d) water, wherein the polishing composition has a pH of about 7 to about 11. The invention further provides a method of polishing a substrate with the polishing composition.
Abstract translation: 本发明提供一种抛光组合物，其包含（a）二氧化硅，（b）一种或多种增加硅去除速率的化合物，（c）一种或多种四烷基铵盐和（d）水，其中抛光组合物的pH为 约7至约11.本发明还提供了用抛光组合物抛光基材的方法。
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公开(公告)号：US20120058642A1
公开(公告)日：2012-03-08
申请号：US12807324
申请日：2010-09-02
Applicant: Michael White , Richard Romine , Brian Reiss , Jeffrey Gilliland , Lamon Jones
Inventor： Michael White , Richard Romine , Brian Reiss , Jeffrey Gilliland , Lamon Jones
IPC: C09K13/02 , H01L21/306 , C09K13/00
CPC classification number: H01L21/02024 , C09G1/02
Abstract: The invention relates to a chemical-mechanical polishing composition comprising silica, one or more organic carboxylic acids or salts thereof, one or more polysaccharides, one or more bases, optionally one or more surfactants and/or polymers, optionally one or more reducing agents, optionally one or more biocides, and water, wherein the polishing composition has an alkaline pH. The polishing composition exhibits a high removal rate and low particle defects and low haze. The invention further relates to a method of chemically-mechanically polishing a substrate using the polishing composition described herein.
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公开(公告)号：US20110136344A1
公开(公告)日：2011-06-09
申请号：US12971714
申请日：2010-12-17
Applicant: Brian REISS , Timothy Johns , Michael White , Lamon Jones , John Clark
Inventor： Brian REISS , Timothy Johns , Michael White , Lamon Jones , John Clark
IPC: H01L21/306 , C09K13/00 , C09K13/02
CPC classification number: C09G1/02 , C09K3/1463 , H01L21/02024 , H01L21/3212
Abstract: The invention provides a polishing composition comprising silica, an aminophosphonic acid, a polysaccharide, a tetraalkylammonium salt, a bicarbonate salt, an azole ring, and water, wherein the polishing composition has a pH of about 7 to about 11. The invention further provides a method of polishing a substrate with the polishing composition.
Abstract translation: 本发明提供一种抛光组合物，其包含二氧化硅，氨基膦酸，多糖，四烷基铵盐，碳酸氢盐，唑环和水，其中抛光组合物的pH为约7至约11.本发明还提供了一种 用抛光组合物研磨衬底的方法。
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4.发明授权Composition and method for polishing nickel-phosphorous-coated aluminum hard disks 有权用于抛光镍 - 磷涂层铝硬盘的组合物和方法公开(公告)号：US07922926B2
公开(公告)日：2011-04-12
申请号：US11970978
申请日：2008-01-08
Applicant: Selvaraj Palanisamy Chinnathambi , Ping-Ha Yeung , Brian Reiss
Inventor： Selvaraj Palanisamy Chinnathambi , Ping-Ha Yeung , Brian Reiss
IPC: C03C15/00
CPC classification number: C23F3/06 , C09G1/02 , C09K3/1463 , C09K13/00
Abstract: The invention provides a chemical-mechanical polishing composition consisting essentially of flumed alumina, alpha alumina, silica, a nonionic surfactant, an additive compound selected from the group consisting of glycine, alanine, iminodiacetic acid, and maleic acid, hydrogen peroxide, and water. The invention further provides a method of chemically-mechanically polishing a substrate comprising contacting a substrate with a polishing pad and the chemical-mechanical polishing composition, moving the polishing pad and the polishing composition relative to the substrate, and abrading at least a portion of the substrate to polish the substrate.
Abstract translation: 本发明提供了一种化学机械抛光组合物，其基本上由熔融氧化铝，α氧化铝，二氧化硅，非离子表面活性剂，选自甘氨酸，丙氨酸，亚氨基二乙酸和马来酸，过氧化氢和水组成的组的组合物组成。 本发明还提供了一种化学机械抛光衬底的方法，包括使衬底与抛光垫和化学机械抛光组合物接触，使抛光垫和抛光组合物相对于衬底移动，并研磨至少一部分 底物抛光底物。
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公开(公告)号：US20050064508A1
公开(公告)日：2005-03-24
申请号：US10665721
申请日：2003-09-22
Applicant: Angela Belcher , Brian Reiss , Chuanbin Mao , Daniel Solis
Inventor： Angela Belcher , Brian Reiss , Chuanbin Mao , Daniel Solis
IPC: C40B30/04 , G01N33/53 , G01N33/531 , G01N33/543 , G01N33/553 , G01N33/68
CPC classification number: C12N15/1037 , B82Y5/00 , B82Y30/00 , C07K7/00 , C07K7/06 , C07K7/08 , C40B30/04 , G01N33/531 , G01N33/54326
Abstract: The present invention includes methods for producing magnetic nanocrystals by using a biological molecule that has been modified to possess an amino acid oligomer that is capable of specific binding to a magnetic material.
Abstract translation: 本发明包括通过使用经修饰以具有能够特异性结合磁性材料的氨基酸低聚物的生物分子来制备磁性纳米晶体的方法。
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Patent Agency Ranking
公开(公告)号：US09481215B2
公开(公告)日：2016-11-01
申请号：US15054799
申请日：2016-02-26
Applicant: Brian Reiss
Inventor： Brian Reiss
CPC classification number: B60C23/004 , B60C23/002 , B60C23/0408
Abstract: A system for controlling bicycle tire air pressure on the go is provided. The system has a wheel mounted portion and a control unit in communication with one another. The wheel mounted portion attached to each wheel has a gas source, manifold, regulator to control air flow into and out of the tire, and a communication device. The control unit monitors air pressure in each tire, and has a user interface allowing input of a higher or lower tire pressure. Based on user input, the control unit instructs operation of the wheel mounted portion, controlling pressure within the tire.
Abstract translation: 提供了一种用于在旅途中控制自行车轮胎气压的系统。 该系统具有彼此通信的车轮安装部分和控制单元。 连接到每个车轮的车轮安装部分具有气体源，歧管，调节器以控制进入和离开轮胎的气流，以及通信装置。 控制单元监视每个轮胎中的空气压力，并且具有允许输入更高或更低轮胎压力的用户界面。 基于用户输入，控制单元指示车轮安装部的操作，控制轮胎内的压力。
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公开(公告)号：US09425037B2
公开(公告)日：2016-08-23
申请号：US13351339
申请日：2012-01-17
Applicant: Brian Reiss , John Clark , Lamon Jones , Michael White
Inventor： Brian Reiss , John Clark , Lamon Jones , Michael White
CPC classification number: H01L21/02024 , C09G1/02
Abstract: The invention relates to a chemical-mechanical polishing composition comprising silica, one or more tetraalkylammonium salts, one or more bicarbonate salts, one or more alkali metal hydroxides, one or more aminophosphonic acids, one or more rate accelerator compounds, one or more polysaccharides, and water. The polishing composition reduces surface roughness and PSD of polished substrates. The invention further relates to a method of chemically-mechanically polishing a substrate, especially a silicon substrate, using the polishing composition described herein.
Abstract translation: 本发明涉及一种化学机械抛光组合物，其包括二氧化硅，一种或多种四烷基铵盐，一种或多种碳酸氢盐，一种或多种碱金属氢氧化物，一种或多种氨基膦酸，一种或多种速率促进剂化合物，一种或多种多糖， 和水。 抛光组合物降低抛光基材的表面粗糙度和PSD。 本发明还涉及使用本文所述的抛光组合物对衬底，特别是硅衬底进行化学机械抛光的方法。
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公开(公告)号：US08697576B2
公开(公告)日：2014-04-15
申请号：US12971714
申请日：2010-12-17
Applicant: Brian Reiss , Timothy Johns , Michael White , Lamon Jones , John Clark
Inventor： Brian Reiss , Timothy Johns , Michael White , Lamon Jones , John Clark
IPC: H01L21/302
CPC classification number: C09G1/02 , C09K3/1463 , H01L21/02024 , H01L21/3212
Abstract: The invention provides a polishing composition comprising silica, an aminophosphonic acid, a polysaccharide, a tetraalkylammonium salt, a bicarbonate salt, an azole ring, and water, wherein the polishing composition has a pH of about 7 to about 11. The invention further provides a method of polishing a substrate with the polishing composition.
Abstract translation: 本发明提供一种抛光组合物，其包含二氧化硅，氨基膦酸，多糖，四烷基铵盐，碳酸氢盐，唑环和水，其中抛光组合物的pH为约7至约11.本发明还提供了一种 用抛光组合物研磨衬底的方法。
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公开(公告)号：US08273142B2
公开(公告)日：2012-09-25
申请号：US12807324
申请日：2010-09-02
Applicant: Michael White , Richard Romine , Brian Reiss , Jeffrey Gilliland , Lamon Jones
Inventor： Michael White , Richard Romine , Brian Reiss , Jeffrey Gilliland , Lamon Jones
CPC classification number: H01L21/02024 , C09G1/02
Abstract: The invention relates to a chemical-mechanical polishing composition comprising silica, one or more organic carboxylic acids or salts thereof, one or more polysaccharides, one or more bases, optionally one or more surfactants and/or polymers, optionally one or more reducing agents, optionally one or more biocides, and water, wherein the polishing composition has an alkaline pH. The polishing composition exhibits a high removal rate and low particle defects and low haze. The invention further relates to a method of chemically-mechanically polishing a substrate using the polishing composition described herein.
Abstract translation: 本发明涉及包含二氧化硅，一种或多种有机羧酸或其盐，一种或多种多糖，一种或多种碱，任选的一种或多种表面活性剂和/或聚合物，任选的一种或多种还原剂的化学机械抛光组合物， 任选地一种或多种杀生物剂和水，其中抛光组合物具有碱性pH。 抛光组合物表现出高的去除率和低的颗粒缺陷和低雾度。 本发明还涉及使用本文所述的抛光组合物对衬底进行化学机械抛光的方法。
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公开(公告)号：US20120190199A1
公开(公告)日：2012-07-26
申请号：US13351339
申请日：2012-01-17
Applicant: Brian REISS , John CLARK , Lamon JONES , Michael WHITE
Inventor： Brian REISS , John CLARK , Lamon JONES , Michael WHITE
IPC: H01L21/306 , C09K13/02
CPC classification number: H01L21/02024 , C09G1/02
Abstract: The invention relates to a chemical-mechanical polishing composition comprising silica, one or more tetraalkylammonium salts, one or more bicarbonate salts, one or more alkali metal hydroxides, one or more aminophosphonic acids, one or more rate accelerator compounds, one or more polysaccharides, and water. The polishing composition reduces surface roughness and PSD of polished substrates. The invention further relates to a method of chemically-mechanically polishing a substrate, especially a silicon substrate, using the polishing composition described herein.
Abstract translation: 本发明涉及一种化学机械抛光组合物，其包括二氧化硅，一种或多种四烷基铵盐，一种或多种碳酸氢盐，一种或多种碱金属氢氧化物，一种或多种氨基膦酸，一种或多种速率促进剂化合物，一种或多种多糖， 和水。 抛光组合物降低抛光基材的表面粗糙度和PSD。 本发明还涉及使用本文所述的抛光组合物对衬底，特别是硅衬底进行化学机械抛光的方法。
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