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    Method for manufacturing optical module
    3.
    发明授权
    Method for manufacturing optical module 有权
    光学模块制造方法

    公开(公告)号：US08777498B2

    公开(公告)日：2014-07-15

    申请号：US13107529

    申请日：2011-05-13

    Applicant: Akira Sakamoto ,  Yasushi Harano ,  Daisuke Awaji

    Inventor： Akira Sakamoto ,  Yasushi Harano ,  Daisuke Awaji

    IPC: G02B6/36

    CPC classification number: G02B6/4248 ,  G02B6/4238

    Abstract: A method of the present invention is a method for manufacturing an optical module (10) including an optical fiber (3) and an optical fiber insertion pipe (2) into which the optical fiber (3) is inserted, and includes a sealing step in which the optical fiber insertion pipe (2) is hermetically sealed. The sealing step includes a contact step, a heating step, and a feeding step. In the contact step, a heat conductor member (5) is provided along and in contact with a side surface of the optical fiber insertion pipe (2), the heat conductor member having a heat conductivity greater than that of an environmental atmosphere of the sealing step and having a heat generating property of generating heat by induction heating, which heat generating property of the heat conductor member is inferior to that of the optical fiber insertion pipe (2) in terms of heat generation amount. In the heating step, the optical fiber insertion pipe (2) thus provided with the heat conductor member (5) is heated by induction heating. In the feeding step, a solder (6) is fed to a feed hole (4) provided in the optical fiber insertion pipe (2). The present invention provides the method in which workability of hermetic sealing is thus improved.

    Abstract translation: 本发明的一种方法是一种用于制造包括光纤（3）和光纤插入管（2）的光学模块（10）的方法，光纤（3）插入其中，并且包括密封步骤 光纤插入管（2）被气密地密封。 密封步骤包括接触步骤，加热步骤和进料步骤。 在接触步骤中，沿着光纤插入管（2）的侧表面设置热导体部件（5），该热导体部件的热导率大于密封的环境气氛 并且具有通过感应加热产生热量的发热特性，热导体部件的发热性能在发热量方面不如光纤插入管（2）的发热性。 在加热工序中，通过感应加热来加热设置有导热体部件（5）的光纤插入管（2）。 在进给步骤中，将焊料（6）供给到设置在光纤插入管（2）中的供给孔（4）。 本发明提供了这样一种方法，其中提高了气密密封的可加工性。

    FIXING DEVICE AND IMAGE FORMING APPARATUS
    4.
    发明申请
    FIXING DEVICE AND IMAGE FORMING APPARATUS 有权
    固定装置和图像形成装置

    公开(公告)号：US20130045018A1

    公开(公告)日：2013-02-21

    申请号：US13365923

    申请日：2012-02-03

    Applicant: Naoyuki EGUSA ,  Makoto FURUKI ,  Akira SAKAMOTO

    Inventor： Naoyuki EGUSA ,  Makoto FURUKI ,  Akira SAKAMOTO

    IPC: G03G15/20

    CPC classification number: G03G15/201

    Abstract: A fixing device includes a fixing unit and a switching unit. The fixing unit includes an emitting unit that emits light and a housing that houses the emitting unit. The fixing unit fixes a toner image to a recording medium by emitting the light to a surface of the recording medium, the recording medium having the toner image formed thereon and having been transported to a predetermined fixing position that is away from the housing. The switching unit switches a state of the fixing device from a first state in which the housing and the recording medium are positioned away from each other to a second state in which the surface of the recording medium at the fixing position is sealed with the housing.

    Abstract translation: 定影装置包括定影单元和切换单元。 定影单元包括发射光的发射单元和容纳发射单元的壳体。 定影单元通过将光发射到记录介质的表面而将调色剂图像定影到记录介质，记录介质具有形成在其上的调色剂图像，并且已经被运送到远离壳体的预定的固定位置。 切换单元将固定装置的状态从壳体和记录介质彼此远离的第一状态切换到固定位置处的记录介质的表面与壳体密封的第二状态。

    SEMICONDUCTOR LIGHT DETECTING ELEMENT
    5.
    发明申请
    SEMICONDUCTOR LIGHT DETECTING ELEMENT 有权
    半导体光检测元件

    公开(公告)号：US20130001651A1

    公开(公告)日：2013-01-03

    申请号：US13634249

    申请日：2011-02-22

    Applicant: Mitsuhito Mase ,  Akira Sakamoto ,  Takashi Suzuki ,  Tomohiro Yamazaki ,  Yoshimaro Fujii

    Inventor： Mitsuhito Mase ,  Akira Sakamoto ,  Takashi Suzuki ,  Tomohiro Yamazaki ,  Yoshimaro Fujii

    IPC: H01L31/102

    CPC classification number: H01L27/1464 ,  H01L27/1463 ,  H01L27/14643 ,  H01L31/0236

    Abstract: A semiconductor light detecting element is provided with a silicon substrate having a semiconductor layer, and an epitaxial semiconductor layer grown on the semiconductor layer and having a lower impurity concentration than the semiconductor layer; and conductors provided on a surface of the epitaxial semiconductor layer. A photosensitive region is formed in the epitaxial semiconductor layer. Irregular asperity is formed at least in a surface opposed to the photosensitive region in the semiconductor layer. The irregular asperity is optically exposed.

    Abstract translation: 半导体光检测元件设置有具有半导体层的硅衬底和在半导体层上生长且具有比半导体层低的杂质浓度的外延半导体层; 以及设置在外延半导体层的表面上的导体。 在外延半导体层中形成感光区域。 至少在与半导体层中的感光区域相对的表面中形成不规则的凹凸。 不规则的凹凸光学曝光。

    Optical transmission module
    7.
    发明授权
    Optical transmission module 有权
    光传输模块

    公开(公告)号：US08195045B2

    公开(公告)日：2012-06-05

    申请号：US12327248

    申请日：2008-12-03

    Applicant: Akira Sakamoto ,  Kazuhiro Sakai ,  Osamu Ueno

    Inventor： Akira Sakamoto ,  Kazuhiro Sakai ,  Osamu Ueno

    IPC: H04B10/08

    CPC classification number: H01S5/0014 ,  G01R31/2635 ,  G01R31/2642 ,  H01S5/0021 ,  H01S5/02296 ,  H01S5/042 ,  H01S5/0683 ,  H01S5/18311

    Abstract: Provided is an optical transmission module that includes: a semiconductor light emitting element for emitting laser light; a first driving unit for providing a first driving current to the semiconductor light emitting element; a switching unit connected between the semiconductor light emitting element and the first driving unit; and a package for accommodating the semiconductor light emitting element, the first driving unit, and the switching unit. The switching unit includes a first input for receiving a first driving current outputted from at least from the first driving unit, a second input for receiving a second driving current for testing the semiconductor light emitting element, and an output connected to the semiconductor light emitting element. The switching unit connects the first input or the second input to the output.

    Abstract translation: 提供一种光传输模块，其包括：用于发射激光的半导体发光元件; 第一驱动单元，用于向半导体发光元件提供第一驱动电流; 连接在所述半导体发光元件和所述第一驱动单元之间的开关单元; 以及用于容纳半导体发光元件，第一驱动单元和开关单元的封装。 开关单元包括用于接收从至少从第一驱动单元输出的第一驱动电流的第一输入端，用于接收用于测试半导体发光元件的第二驱动电流的第二输入端和连接到半导体发光元件的输出端 。 开关单元将第一输入或第二输入连接到输出。

    SEMICONDUCTOR LIGHT DETECTING ELEMENT AND MANUFACTURING METHOD THEREFOR
    8.
    发明申请
    SEMICONDUCTOR LIGHT DETECTING ELEMENT AND MANUFACTURING METHOD THEREFOR 审中-公开
    半导体光检测元件及其制造方法

    公开(公告)号：US20120061785A1

    公开(公告)日：2012-03-15

    申请号：US13320912

    申请日：2010-06-02

    Applicant: Yoshitaka Ishikawa ,  Akira Sakamoto ,  Kazuhisa Yamamura ,  Satoshi Kawai

    Inventor： Yoshitaka Ishikawa ,  Akira Sakamoto ,  Kazuhisa Yamamura ,  Satoshi Kawai

    IPC: H01L31/0236

    CPC classification number: H01L31/02363 ,  H01L31/0232 ,  H01L31/103 ,  H01L31/109 ,  Y02E10/50

    Abstract: A photodiode PD1 is provided with an n− type semiconductor substrate 1 with a pn junction formed of a first conductivity type semiconductor region and a second conductivity type semiconductor region. For the n− type semiconductor substrate 1, an accumulation layer 7 is formed on the second principal surface 1b side of the n− type semiconductor substrate 1 and an irregular asperity 10 is formed at least in regions opposed to the pn junction in a first principal surface 1a and in the second principal surface 1b. The regions opposed to the pn junction in the first principal surface 1a and in the second principal surface 1b of the n− type semiconductor substrate 1 are optically exposed.

    Abstract translation: 光电二极管PD1设置有具有由第一导电类型半导体区域和第二导电类型半导体区域形成的pn结的n型半导体衬底1。 对于n型半导体衬底1，在n型半导体衬底1的第二主表面1b侧上形成有积累层7，并且至少在第一主体中与pn结相对的区域中形成不规则凹凸10 表面1a和第二主表面1b中。 在n型半导体衬底1的第一主表面1a和第二主表面1b中与pn结相对的区域被光学曝光。

    SEMICONDUCTOR LIGHT-DETECTING ELEMENT
    9.
    发明申请
    SEMICONDUCTOR LIGHT-DETECTING ELEMENT 有权
    半导体光检测元件

    公开(公告)号：US20110303999A1

    公开(公告)日：2011-12-15

    申请号：US13147871

    申请日：2010-02-15

    Applicant: Akira Sakamoto ,  Takashi Iida ,  Koei Yamamoto ,  Kazuhisa Yamamura ,  Terumasa Nagano

    Inventor： Akira Sakamoto ,  Takashi Iida ,  Koei Yamamoto ,  Kazuhisa Yamamura ,  Terumasa Nagano

    IPC: H01L31/0236

    CPC classification number: H01L31/02366 ,  H01L27/1446 ,  H01L31/0236 ,  H01L31/02363 ,  H01L31/035281 ,  H01L31/1804 ,  Y02E10/547 ,  Y02P70/521

    Abstract: Prepared is an n− type semiconductor substrate 1 having a first principal surface 1a and a second principal surface 1b opposed to each other, and having a p+ type semiconductor region 3 formed on the first principal surface 1a side. At least a region opposed to the p+ type semiconductor region 3 in the second principal surface 1b of the n− type semiconductor substrate 1 is irradiated with a pulsed laser beam to form an irregular asperity 10. After formation of the irregular asperity 10, an accumulation layer 11 with an impurity concentration higher than that of the n− type semiconductor substrate 1 is formed on the second principal surface 1b side of the n− type semiconductor substrate 1. After formation of the accumulation layer 11, the n− type semiconductor substrate 1 is subjected to a thermal treatment.

    Abstract translation: 制备的n型半导体衬底1具有彼此相对的第一主表面1a和第二主表面1b，并且具有形成在第一主表面1a侧上的p +型半导体区域3。 在n型半导体衬底1的第二主表面1b中至少与p +型半导体区域3相对的区域用脉冲激光束照射以形成不规则凹凸。在形成不规则凹凸10之后，积累 在n型半导体衬底1的第二主表面1b侧上形成杂质浓度高于n型半导体衬底1的层11。在形成蓄积层11之后，n型半导体衬底1 进行热处理。

    APPARATUS FOR CONTROLLING POWER SUPPLIED TO ON-VEHICLE ELECTRICAL LOADS
    10.
    发明申请
    APPARATUS FOR CONTROLLING POWER SUPPLIED TO ON-VEHICLE ELECTRICAL LOADS 有权
    用于控制供电到车载电力负载的装置

    公开(公告)号：US20110278920A1

    公开(公告)日：2011-11-17

    申请号：US13095334

    申请日：2011-04-27

    Applicant: Akira SAKAMOTO ,  Kazuyoshi OBAYASHI

    Inventor： Akira SAKAMOTO ,  Kazuyoshi OBAYASHI

    IPC: B60L1/00

    CPC classification number: H02J3/14 ,  B60L1/00 ,  B60L11/1824 ,  B60L11/1838 ,  B60L11/184 ,  B60L2240/525 ,  B60L2260/50 ,  B60L2260/54 ,  B60L2260/56 ,  H02J2003/146 ,  Y02B70/3225 ,  Y02T10/7005 ,  Y02T10/7072 ,  Y02T90/121 ,  Y02T90/128 ,  Y02T90/14 ,  Y02T90/163 ,  Y02T90/169 ,  Y04S20/222 ,  Y04S20/224 ,  Y04S30/14

    Abstract: A power control apparatus is applied to a vehicle provided with a receiving port connected with an external power supply device placed outside the vehicle and on-vehicle electrical loads including a second battery which stores power supplied from the external power supply device via the receiving port. The power control apparatus for vehicles has power supply processing means that performs a power supply process for supplying desired power to the loads during a stop of the vehicle. This power supply processing means predicts cost required to supply the desired power, based on future predicted power cost information, in planning a power supply process needed during the stop of the vehicle. This planned power supply process is performed.

    Abstract translation: 电力控制装置被应用于设置有与放置在车辆外部的外部电源装置连接的接收端口的车辆，以及包括存储经由接收端口从外部电力供应装置提供的电力的第二电池的车载电气负载。 用于车辆的动力控制装置具有供电处理装置，其执行在车辆停止期间向负载提供期望的动力的供电处理。 该电源处理装置根据将来的预测功率成本信息来预测在规划车辆停止期间所需的电力供应过程中提供期望功率所需的成本。 执行该计划的电源处理。

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