公开(公告)号：US06825249B1

公开(公告)日：2004-11-30

申请号：US09616943

申请日：2000-07-14

Applicant: Shinji Takeda ,  Takashi Masuko ,  Masami Yusa ,  Yasuo Miyadera ,  Mituo Yamasaki ,  Iwao Maekawa ,  Akio Kotato ,  Yuusuke Miyamae ,  Tadaji Satou ,  Makoto Saitou ,  Tooru Kikuchi ,  Akira Kageyama ,  Aizou Kaneda

Inventor： Shinji Takeda ,  Takashi Masuko ,  Masami Yusa ,  Yasuo Miyadera ,  Mituo Yamasaki ,  Iwao Maekawa ,  Akio Kotato ,  Yuusuke Miyamae ,  Tadaji Satou ,  Makoto Saitou ,  Tooru Kikuchi ,  Akira Kageyama ,  Aizou Kaneda

IPC: C08K300

CPC classification number: H01L24/27 ,  H01L21/4821 ,  H01L23/49513 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/743 ,  H01L24/75 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/75 ,  H01L2224/7565 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/83805 ,  H01L2224/8385 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/01014 ,  H01L2924/01026 ,  H01L2924/01028 ,  H01L2924/3512 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: Provided are a laminating method and machine for successively heating and compression-bonding a film-shaped organic die-bonding material on a leadframe. leadframe 7 is placed on a travelling table 8 and is heated there. A film-shaped organic die-bonding material 2 is punched out and the resulting film is tack-bonded to a die pad on the leadframe. The leadframe with the film tack-bonded thereon is then moved to a position B by the travelling table. After the film is pressed by a compression-bonding element at the position B, a chip is mounted on the film-shaped organic die-bonding material 2. It is therefore possible to bond a film-shaped organic die-bonding material under compression on a leadframe with good productivity but without voids and further to avoid package cracking upon mounting a chip.

Abstract translation: 提供了一种用于在引线框上依次加热和压接薄膜状有机芯片接合材料的层压方法和机器。将框架7放置在行进台8上并在那里被加热。 将膜状有机芯片接合材料2冲压出来，将所得的薄膜粘合到引线框架上的芯片焊盘上。 然后将其上粘贴有胶片的引线框架通过移动台移动到位置B. 在位置B的压接元件压制薄膜后，将薄片状的有机芯片接合材料2安装在芯片上。因此，可以将薄膜状的有机模片接合材料压缩 引导框架，生产效率高，但没有空隙，并进一步避免了在安装芯片时的封装破裂。

公开(公告)号：US6099678A

公开(公告)日：2000-08-08

申请号：US875330

申请日：1997-06-25

Applicant: Akio Kotato ,  Yuusuke Miyamae ,  Tadaji Satou ,  Makoto Saitou ,  Tooru Kikuchi ,  Akira Kageyama ,  Shinji Takeda ,  Takashi Masuko ,  Masami Yusa ,  Yasuo Miyadera ,  Mituo Yamasaki ,  Iwao Maekawa ,  Aizou Kaneda

Inventor： Akio Kotato ,  Yuusuke Miyamae ,  Tadaji Satou ,  Makoto Saitou ,  Tooru Kikuchi ,  Akira Kageyama ,  Shinji Takeda ,  Takashi Masuko ,  Masami Yusa ,  Yasuo Miyadera ,  Mituo Yamasaki ,  Iwao Maekawa ,  Aizou Kaneda

IPC: H01L21/58 ,  H01L21/60 ,  B32B31/00 ,  B23P19/00 ,  B32B35/00 ,  H05K3/30

CPC classification number: H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/743 ,  H01L24/75 ,  H01L24/83 ,  H01L24/97 ,  H01L2224/05599 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/7565 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/83805 ,  H01L2224/8385 ,  H01L2224/85 ,  H01L2224/85399 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L24/48 ,  H01L24/73 ,  H01L24/85 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/181 ,  Y10T156/1062 ,  Y10T156/107 ,  Y10T156/12 ,  Y10T156/1322 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/53178

Abstract: A laminating method and a machine are provided for successively heating and compression-bonding a film-shaped organic die-bonding material on a leadframe with good productivity but without voids and further to avoid package cracking upon mounting a chip. A leadframe 7 is placed on a travelling table 8 and is heated there. A film-shaped organic die-bonding material 2 is punched out and the resulting film is tack-bonded to a die pad on the leadframe. The leadframe with the film tack-bonded thereon is then moved to a position b by the travelling table. After the film is pressed by a compression-bonding element at the position B, a chip is mounted on the film-shaped organic die-bonding material 2.

Abstract translation: PCT No.PCT / JP95 / 02691 Sec。 371日期：1997年6月25日 102（e）日期1997年6月25日PCT 1995年12月26日PCT PCT。 公开号WO96 / 29730 日期1996年9月26日提供层压方法和机器，用于在引线框上以良好的生产率连续加热和压接粘合材料，但没有空隙，并且进一步避免了在安装芯片时的封装破裂。 引线框架7放置在行进台8上并在那里被加热。 将膜状有机芯片接合材料2冲压出来，将所得的薄膜粘合到引线框架上的芯片焊盘上。 然后将其上粘贴有胶片的引线框架通过移动台移动到位置b。 在位置B的压接元件压制薄膜后，在薄膜状有机芯片接合材料2上安装芯片。