摘要:
Acoustic resonator device (1) includes an active element (6) and a support provided with a membrane (5). The active element (6) is provided with at least one piezoelectric layer (10) and is surmounted by a multilayer stack (12). The multilayer stack (12) is provided with at least three layers, including at least one layer (15) of high acoustic impedance and at least one layer (13) of low acoustic impedance. An integrated circuit including at least one such acoustic resonator device is also disclosed.
摘要:
A piezoelectric resonator includes a substrate and a vibrator. The vibrator includes a thin-film portion having at least one piezoelectric thin-film layer disposed on the substrate and at least one pair of upper and lower electrodes disposed on the substrate. The vibrator has a structure in which the thin-film portion is sandwiched from the upper and lower surfaces thereof by the upper and lower electrodes, which oppose each other in the depth direction, and the overlapping portion of the vibrator defined by the opposing upper and lower electrodes has a tetragonal shape, when viewed in the depth direction, other than a rectangle and a square, the tetragonal shape having substantially parallel sides having a longitudinal length equal to or smaller than about 10 times the oscillatory wavelength and also having at least one portion in which the distance between opposing electrode edges varies.
摘要:
Disclosed are a film bulk acoustic resonator, a duplexer filter having the same, and a semiconductor package thereof. The film bulk acoustic resonator comprising: a semiconductor substrate; a lower electrode more than two layers formed at an upper surface of the semiconductor substrate; a piezoelectric layer deposited on an upper surface of the lower electrode with a certain thickness; and an upper electrode more than two layers formed at an upper surface of the piezoelectric layer, has an excellent bonding characteristic. The duplexer filter can microminiaturize a size thereof by integrating a film bulk acoustic filter formed by connecting the plurality of film bulk acoustic resonators serially and in parallel and peripheral passive elements of the film bulk acoustic filter into one semiconductor chip. Also, the semiconductor package is suitable for the duplexer filter.
摘要:
An air-gap type thin film bulk acoustic resonator (FBAR) and method for fabricating the same. Also disclosed are a filter and a duplexer employing the air-gap type FBAR. The air-gap type FBAR includes: a first substrate having a cavity part at a predetermined region on its upper surface; a dielectric film stacked on the upper part of the first substrate; a first air gap formed between the first substrate and the dielectric film; a stacked resonance part including a lower electrode/piezoelectric layer/upper electrode formed on the upper part of the dielectric film; a second substrate having a cavity part at a predetermined region on its lower surface and joined to the first substrate; and a second air gap formed between the stacked resonance part and the second substrate. A thin film of predetermined thickness made of a liquid crystal polymer (LCP) may be used as the dielectric film.
摘要:
The encapsulated film bulk acoustic resonator (FBAR) device comprises a substrate, an FBAR stack over the substrate, an element for acoustically isolating the FBAR stack from the substrate, encapsulant covering the FBAR stack, and an acoustic Bragg reflector between the top surface of the FBAR stack and the encapsulant. The FBAR stack comprises an FBAR and has a top surface remote from the substrate. The FBAR comprises opposed planar electrodes and a piezoelectric element between the electrodes. The acoustic Bragg reflector comprises a metal Bragg layer and a plastic Bragg layer juxtaposed with the metal Bragg layer. The large ratio between the acoustic impedances of the metal of the metal Bragg layer and the plastic material of the plastic Bragg layer enables the acoustic Bragg reflector to provide sufficient acoustic isolation between the FBAR and the encapsulant for the frequency response of the FBAR device to exhibit minor, if any, spurious artifacts arising from undesirable acoustic coupling between the FBAR and the encapsulant.
摘要:
A duplexer includes a transmission band filter and a reception band filter connected in parallel to each other and connected to an antenna terminal. The transmission band filter and the reception band filter are accommodated in a package covered with an electroconductive lid. The package is mounted on a mounting substrate having the antenna terminal and covered with an electroconductive shield mounted on the mounting substrate. At least one of the transmission band filter and the reception band filter has a ground terminal connected to the lid. The lid is electrically connected to the shield.
摘要:
A piezoelectric device 100 includes first and second piezoeletric resonators 110, 120. The first piezoeletric resonator 110 has a structure in which a cavity 111, a lower electrode 112, a piezoeletric layer 113, and an upper electrode 114 are formed on a substrate 101. The second piezoeletric resonator 120 has a structure in which a cavity 121, a lower electrode 122, a piezoeletric layer 123, and an upper electrode 124 are formed on the substrate 110. A feature of the above-structure piezoelectric device 100 is that the piezoeletric layers 113, 123 have the same film thickness and the depth t1 of the cavity 111 of the first piezoeletric resonator 110 is different from the depth t2 of the cavity 121 of the second piezoeletric resonator 120.
摘要:
The band-pass filter has a stacked pair of film bulk acoustic resonators (FBARs) and an acoustic decoupler between the FBARs. Each of the FBARs has opposed planar electrodes and a layer of piezoelectric material between the electrodes. The acoustic decoupler controls the coupling of acoustic energy between the FBARs. Specifically, the acoustic decoupler couples less acoustic energy between the FBARs than would be coupled by direct contact between the FBARs. The reduced acoustic coupling gives the band-pass filter desirable in-band and out-of-band properties.
摘要:
A band-pass filter has a ladder-type circuit including first and second terminals whose characteristic impedances are Z0, and series elements and shunt elements disposed between a first terminal and a second terminal, each of the series elements and shunt elements containing a film bulk acoustic resonator. Assuming that characteristic impedance of any one of the series elements is Z1 and that characteristic impedance of any one of the shunt elements is Z2, the characteristic impedances Z0, Z1, and Z2 have a relation of 1
摘要翻译:带通滤波器具有梯形电路,其包括特征阻抗为Z 0的第一和第二端子,以及设置在第一端子和第二端子之间的串联元件和分流元件,每个串联元件和分流元件包含膜 体声波谐振器。 假设串联元件中的任一个的特性阻抗为Z 1,并且分路元件中的任一个的特性阻抗为Z 2,则特性阻抗Z 0,Z 1和Z 2具有1 <(Z 1 / Z 0)<2,优选为1.3 <(Z 1 / Z 0)<1.7,0.5 <(Z 2 / Z 0)<1,优选为0.6 <(Z 2 / Z 0)<0.8。
摘要:
The present invention relates to a ladder-type bulk acoustic wave filter with a common ground inductor, which obtains high attenuation in a high frequency stop band adjacent to a pass band without the insertion loss degradation of the pass band, so that the ladder-type bulk acoustic wave filter is useful as a transmit filter. According to the present invention, the plurality of shunt resonators are commonly grounded through the inductor, so that zeros are generated due to the interaction between the stray capacitance of shunt resonators and the common ground inductor, thus improving attenuation characteristics in a high frequency stop band.