公开(公告)号：US20190045483A1

公开(公告)日：2019-02-07

申请号：US16053186

申请日：2018-08-02

Applicant: Apple Inc.

Inventor： Tarik Tabet ,  Lydi Smaini ,  Ronald W. Dimpflmaier ,  Matthias Sauer ,  Jason C. Fan

IPC: H04W72/00 ,  H04W56/00 ,  H04W4/06 ,  H04W48/10 ,  H04W72/08 ,  H04W36/00

Abstract: This disclosure relates to techniques for supporting narrowband device-to-device wireless communication, including possible techniques for 1) handing off from one master to another and 2) relaying shifted device-to-device synchronization signals in an off grid radio system. The techniques herein may allow for a successor master device to take over a master role, including by transmitting synchronization signals. The techniques herein may allow for a repeater device to expand the boundary of a device-to-device communication group by transmitting synchronization signals that are shifted relative to synchronization signals transmitted by a master device.

公开(公告)号：US20180213382A1

公开(公告)日：2018-07-26

申请号：US15876582

申请日：2018-01-22

Applicant: Apple Inc.

Inventor： Tarik Tabet ,  Lydi Smaini ,  Ronald W. Dimpflmaier ,  Matthias Sauer ,  Venkateswara Rao Manepalli

IPC: H04W4/80 ,  H04W8/00 ,  H04W72/12 ,  H04W76/14 ,  H04L29/08

CPC classification number: H04W4/80 ,  H04L67/04 ,  H04L67/1068 ,  H04L67/12 ,  H04W4/70 ,  H04W8/005 ,  H04W72/121 ,  H04W76/14

Abstract: This disclosure relates to techniques for supporting narrowband device-to-device wireless communication, including possible techniques for performing discovery in an off grid radio system. A wireless device may obtain synchronization with a peer-to-peer communication group. The wireless device may determine the location of the wireless device within the peer-to-peer communication group based at least in part on signal strength of a synchronization signal used to obtain the synchronization. The wireless device may perform peer-to-peer discovery in the peer-to-peer communication group, such that time and frequency resources used by the wireless device to perform the peer-to-peer discovery are determined based at least in part on the location of the first wireless device within the peer-to-peer communication group.

公开(公告)号：US20180092109A1

公开(公告)日：2018-03-29

申请号：US15711061

申请日：2017-09-21

Applicant: Apple Inc.

Inventor： Farouk Belghoul ,  Paul V. Flynn ,  Louie J. Sanguinetti ,  Bernd W. Adler ,  Christian W. Mucke ,  Joseph Hakim ,  Ronald W. Dimpflmaier ,  Matthias Sauer ,  Tushar R. Shah ,  Daniel R. Borges ,  Rafael L. Rivera-Barreto ,  Cesar Perez

IPC: H04W72/12 ,  H04W16/14 ,  H04W72/04 ,  H04W72/08 ,  H04B7/06

CPC classification number: H04W72/1215 ,  H04B7/0632 ,  H04W16/14 ,  H04W24/10 ,  H04W72/0446 ,  H04W72/085 ,  H04W74/06 ,  H04W74/0816 ,  H04W88/06

Abstract: A wireless communication device (UE) includes a cellular processor configured to conduct wireless communications according to a first radio access technology (RAT) in a first frequency band and in a second frequency band, wherein the first RAT is a cellular RAT, the first frequency band is in an unlicensed spectrum, and the second frequency band is in a licensed spectrum. In some embodiments, the apparatus includes a wireless local area network (WLAN) processor configured to conduct wireless communications according to a second RAT in the first frequency band. In some embodiments, the cellular processor and the WLAN processor are configured to couple to a common antenna for communications in the first frequency band. In some embodiments, the cellular processor may notify the WLAN processor when it is scanning and/or when it is assigned secondary component carriers in the first frequency band. In some embodiments, the WLAN processor may notify the cellular processor when it is transmitting. In some embodiments, the WLAN processor and/or the cellular processor may perform one or more actions in response to such notifications to improve coexistence in the first frequency band.

公开(公告)号：US20170196016A1

公开(公告)日：2017-07-06

申请号：US15387904

申请日：2016-12-22

Applicant: Apple Inc.

Inventor： Tarik Tabet ,  Awais M. Hussain ,  Lydi Smaini ,  Moustafa M. Elsayed ,  Syed Aon Mujtaba ,  Matthias Sauer ,  Ronald W. Dimpflmaier ,  Bernd W. Adler ,  Christian W. Mucke

IPC: H04W72/08 ,  H04W72/04

CPC classification number: H04W28/24 ,  H04L5/0005 ,  H04L5/0044 ,  H04W8/22 ,  H04W52/0235 ,  Y02D70/1224 ,  Y02D70/1242 ,  Y02D70/1262 ,  Y02D70/1264 ,  Y02D70/142 ,  Y02D70/144 ,  Y02D70/146 ,  Y02D70/164 ,  Y02D70/168 ,  Y02D70/21 ,  Y02D70/23 ,  Y02D70/26

Abstract: A user equipment (UE) device may communicate according to a new device category satisfying specified QoS (quality of service) requirements while also satisfying specified link budget requirements, and/or additional optimization requirements. The UE device may communicate with a cellular base station according to a first mode of operation associated with the new device category, and may switch to communicating with the cellular base station according to a second mode of operation associated with a second (pre-existing) device category in response to the link budget requirements exceeding a specified value and the quality of service requirements not being sensitive. The UE device may also switch to communicating with the cellular base station according to a third mode of operation associated with a third (pre-existing) device type in response to the link budget requirement not exceeding the specified value, or the QoS requirements being sensitive and a downlink throughput requirement exceeding a specified throughput value.

公开(公告)号：US20150216053A1

公开(公告)日：2015-07-30

申请号：US14165982

申请日：2014-01-28

Applicant: Apple Inc.

Inventor： Matthias Sauer

IPC: H05K1/18 ,  H01L25/065 ,  H01L23/31

CPC classification number: H01L25/0657 ,  H01L23/3128 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06568 ,  H01L2924/0002 ,  H01L2924/15192 ,  H01L2924/19106 ,  H05K1/141 ,  H05K1/182 ,  H05K3/284 ,  H05K2201/09063 ,  H05K2203/1316 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An integrated circuit package may have a package substrate with a surface to which an integrated circuit die is soldered. A first set of contacts on the package substrate may mate with contacts on the integrated circuit die. Solder may be used to connect the integrated circuit die to the first set of contacts. A covering material such as a plastic mold cap may be used to cover the integrated circuit die and the first set of contacts. The mold cap may have a rectangular shape or other footprint. A rectangular ring-shaped border region or a border region of other shapes may surround the mold cap and may be free of mold cap material. A second set of contacts on the package substrate may be formed on the surface in the border region.

Abstract translation: 集成电路封装可以具有封装衬底，其具有集成电路管芯被焊接到的表面。 封装衬底上的第一组触点可与集成电路芯片上的触点配合。 焊料可用于将集成电路管芯连接到第一组触点。 可以使用诸如塑料模具盖的覆盖材料来覆盖集成电路管芯和第一组触点。 模具帽可以具有矩形形状或其他足迹。 矩形环形边框区域或其他形状的边界区域可以围绕模具盖并且可以没有模具盖材料。 封装基板上的第二组触点可以形成在边界区域的表面上。