公开(公告)号：US10367252B2

公开(公告)日：2019-07-30

申请号：US15234918

申请日：2016-08-11

Applicant: Apple Inc.

Inventor： Rex T. Ehman ,  Jayesh Nath ,  Carlo Di Nallo ,  James G. Horiuchi ,  Erik G. de Jong ,  Jason C. Sauers ,  Makiko K. Brzezinski ,  Siwen Yong ,  Lijun Zhang ,  Yi Jiang ,  Zheyu Wang ,  Mario Martinis ,  Eduardo Da Costa Bras Lima ,  Xu Han ,  Mattia Pascolini ,  Trevor J. Ness

IPC: H01Q1/48 ,  H01Q1/27 ,  H01Q1/22 ,  H01Q1/50 ,  H01Q9/04 ,  H04B5/00 ,  H01Q1/24 ,  H01Q7/00 ,  H01Q9/14

Abstract: An electronic device such as a wristwatch may have a housing with metal portions such as metal sidewalls. The housing may form an antenna ground for an antenna. An antenna resonating element for the antenna may be formed from a stack of capacitively coupled component layers such as a display layer, touch sensor layer, and near-field communications antenna layer at a front face of the device. An additional antenna may be formed from a peripheral resonating element that runs along a peripheral edge of the device and the antenna ground. A rear face antenna may be formed using a wireless power receiving coil as a radio-frequency antenna resonating element or may be formed from metal antenna traces on a plastic support for light-based components.

公开(公告)号：US10285643B2

公开(公告)日：2019-05-14

申请号：US15700808

申请日：2017-09-11

Applicant: Apple Inc.

Inventor： Ryan C. Perkins ,  Trevor J. Ness ,  Tobias J. Harrison-Noonan ,  William H. Greenbaum ,  Tyler S. Bushnell ,  Guocheng Shao ,  Guanyi Gao ,  Christopher M. Werner ,  Phil M. Hobson

IPC: G06F1/16 ,  H05K5/00 ,  H05K7/00 ,  A61B5/00

Abstract: An assembly for a consumer product, such as a wristwatch or other wearable electronic device, can securely retain a cover member against a housing of the product. A retaining member from within the housing can engage and secure the cover member to provide a fluid barrier. The cover member can include a window or other components of a sensor device. The parts can be easily disassembled without causing permanent damage.

公开(公告)号：US10247670B2

公开(公告)日：2019-04-02

申请号：US16114003

申请日：2018-08-27

Applicant: Apple Inc.

Inventor： Trevor J. Ness ,  Chin San Han ,  David I. Nazzaro ,  Marcelo M. Lamego ,  Naoto Matsuyuki ,  Wolf Oetting

IPC: A61B5/04 ,  G01N21/55 ,  G01N21/47 ,  A61B5/00 ,  A61B5/021 ,  A61B5/024 ,  A61B5/08 ,  A61B5/145

Abstract: An electronic device includes one or more light emitters for emitting light toward an object and one or more light detectors for collecting light exiting the object. A reflective coating, surface, or surface finish can be applied adjacent to the area to which light is emitted and/or through which light exits in order to increase the light collected by the light detector. The reflective coating can be oriented so as to reflect light back into the object.

公开(公告)号：US20190074724A1

公开(公告)日：2019-03-07

申请号：US16122799

申请日：2018-09-05

Applicant: Apple Inc.

Inventor： Michael B. Wittenberg ,  Makiko K. Brzezinski ,  Stefan A. Kowalski ,  Christopher S. Graham ,  Morgan T. McClure ,  Erik G. de Jong ,  Trevor J. Ness ,  Peter J. Kardassakis ,  Jayesh Nath ,  Adam T. Clavelle ,  Rex Tyler Ehman

IPC: H02J50/12 ,  H02J50/40 ,  H01Q21/00

Abstract: Embodiments disclosed herein describe a wireless power receiving system for an electronic device includes: a first inductor coil configured to receive power primarily at a first frequency and from magnetic fields propagating in a first direction; and a second inductor coil configured to receive power primarily at a second frequency and from magnetic fields propagating in a second direction, wherein the first frequency is different than the second frequency.

公开(公告)号：US10207387B2

公开(公告)日：2019-02-19

申请号：US14714876

申请日：2015-05-18

Applicant: Apple Inc.

Inventor： Naoto Matsuyuki ,  Bin Yi ,  Dezheng Qu ,  Jairam Manjunathaiah ,  Scott M. Nathanson ,  Trevor J. Ness ,  David I. Nazzaro ,  Raul A. Molina

IPC: B24B37/04 ,  B29C70/74 ,  C03C25/005 ,  B29C70/88 ,  B24B37/025 ,  B24B37/02

Abstract: A method for co-finishing surfaces bonds a first structure formed of a first material and having a first surface in an aperture defined in a second structure formed of a second material and having a second surface such that there is an offset between the first surface and the second surface. The first surface and the second surface are co-lapped to reduce the offset. The first surface and second surface are co-polished to further reduce the offset. The first surface and second surfaces may then be flush. Edges of the first surface may be chamfered to mitigate damage during co-lapping and/or co-polishing. Fill material may be positioned in gaps between the first and second structures to mitigate damage during co-lapping and/or co-polishing.

公开(公告)号：US10108231B2

公开(公告)日：2018-10-23

申请号：US15264544

申请日：2016-09-13

Applicant: Apple Inc.

Inventor： Erik G. de Jong ,  Ryan C. Perkins ,  Trevor J. Ness

IPC: G06F1/16 ,  G01L1/14 ,  F16J15/06

Abstract: An elastomeric gasket is disclosed for use in a portable electronic device. The gasket encapsulates flexible circuits which are used to measure force exerted on a cover glass of the device. The gasket reduces the number of layers of material and thus reduces the risk that outside contaminants and liquids may penetrate the gasket layers and enter the portable electronic device and thereby damage the components of the device.

公开(公告)号：US10071539B2

公开(公告)日：2018-09-11

申请号：US14864618

申请日：2015-09-24

Applicant: Apple Inc.

Inventor： Naoto Matsuyuki ,  Trevor J. Ness ,  David I. Nazzaro

IPC: H04M1/02 ,  B32B18/00 ,  B28B1/00 ,  C04B35/645 ,  B28B7/00

CPC classification number: B32B18/00 ,  B28B1/002 ,  B28B1/008 ,  B28B7/0088 ,  C04B35/645 ,  C04B2235/602 ,  C04B2235/6022 ,  C04B2235/6023 ,  C04B2235/9615 ,  C04B2237/343 ,  C04B2237/348 ,  H04M1/0202 ,  H04M1/0266

Abstract: A ceramic structure and methods for making the ceramic structure are disclosed. Multiple parts may be molded; the parts may be molded from the same or different ceramic materials. The parts may be formed in the same mold and may be adjacent to and/or attached to one another as a result of molding. The parts may be placed in a sintering furnace and sintered simultaneously. Simultaneously sintering the parts forms a unitary structure from the parts.

公开(公告)号：US20170316657A1

公开(公告)日：2017-11-02

申请号：US15650906

申请日：2017-07-15

Applicant: Apple Inc.

Inventor： Erik G. de Jong ,  Fletcher R. Rothkopf ,  Trevor J. Ness

IPC: G08B5/22 ,  G06K7/14 ,  A45C11/00 ,  G06F1/16 ,  H04M1/04

CPC classification number: A45C11/00 ,  A45C2011/002 ,  A45C2011/003 ,  G06F1/1628 ,  G06F1/1677 ,  G06K7/1413 ,  G08B5/22 ,  H04M1/04

Abstract: A connectible component is connected to a housing. A sensor of the housing is utilized to detect an identity element of the at connectible component. The connectible component is identified utilizing the at least one sensor. In some implementations, identification of the connectible component may identify whether or not a connectible component is connected to the housing. In other implementations, identification of the connectible component may identify the type of connectible component that is connected. In such implementations, the housing may house an electronic device and the electronic device may be configured based on the type of connectible component that is connected.

公开(公告)号：US20160217661A1

公开(公告)日：2016-07-28

申请号：US15023931

申请日：2013-09-29

Applicant: APPLE INC.

Inventor： Erik G. de Jong ,  Fletcher R. Rothkopf ,  Trevor J. Ness

IPC: G08B5/22 ,  G06K7/14

Abstract: A connectible component is connected to a housing. A sensor of the housing is utilized to detect an identity element of the at connectible component. The connectible component is identified utilizing the at least one sensor. In some implementations, identification of the connectible component may identify whether or not a connectible component is connected to the housing. In other implementations, identification of the connectible component may identify the type of connectible component that is connected. In such implementations, the housing may house an electronic device and the electronic device may be configured based on the type of connectible component that is connected.

Abstract translation: 可连接部件连接到外壳。 壳体的传感器用于检测可连接部件的识别元件。 使用至少一个传感器识别可连接部件。 在一些实现中，可连接组件的识别可以标识可连接组件是否连接到外壳。 在其他实现中，可连接组件的标识可以标识所连接的可连接组件的类型。 在这种实施方式中，壳体可以容纳电子设备，并且可以基于所连接的可连接组件的类型来配置电子设备。

公开(公告)号：US20140190930A1

公开(公告)日：2014-07-10

申请号：US13935250

申请日：2013-07-03

Applicant: Apple Inc.

Inventor： Sean A. Mayo ,  James H. Foster ,  Trevor J. Ness ,  Shankar S. Pennathur

IPC: H05K3/28

CPC classification number: H05K3/284 ,  H05K1/0209 ,  H05K3/288 ,  H05K2201/0108 ,  H05K2201/10106 ,  H05K2203/107 ,  H05K2203/1316 ,  H05K2203/1476

Abstract: The described embodiments relate generally to electronic devices and more particularly to methods for selectively encapsulating circuit boards and other electronic components contained within electronic devices. A first encapsulation layer can be limited to specific regions of a circuit board using a variety of processes including molding, laser ablation, etching, milling, and the like. Secondary assembly steps can then take place in the regions where the encapsulation layer is removed. In some embodiments, secondary encapsulants having various thermal, electrical, and optical characteristics can fill openings left in the first encapsulation layer to aid in the operation of underlying components.

Abstract translation: 所描述的实施例一般涉及电子设备，更具体地涉及用于选择性地封装电子设备中包含的电路板和其它电子元件的方法。 第一封装层可以使用包括模制，激光烧蚀，蚀刻，研磨等在内的各种工艺限于电路板的特定区域。 然后可以在去除封装层的区域中进行二次组装步骤。 在一些实施例中，具有各种热，电和光特性的次级密封剂可以填充留在第一封装层中的开口以帮助底层部件的操作。