Method of producing polyamide fine particles, and polyamide fine particles

    公开(公告)号:US11807717B2

    公开(公告)日:2023-11-07

    申请号:US17955169

    申请日:2022-09-28

    Inventor: Itaru Asano

    CPC classification number: C08G69/16 C08G69/08 C08G69/26 C08G69/46 C08J3/12

    Abstract: A method produces polyamide fine particles by polymerizing a polyamide monomer (A) in the presence of a polymer (B) at a temperature equal to or higher than the crystallization temperature of a polyamide to be obtained, wherein the polyamide monomer (A) and the polymer (B) are homogeneously dissolved at the start of polymerization, and polyamide fine particles are precipitated after the polymerization. Polyamide fine particles have a number average particle size of 0.1 to 100 μm, a sphericity of 90 or more, a particle size distribution index of 3.0 or less, a linseed oil absorption of 100 mL/100 g or less, and a crystallization temperature of 150° C. or more. In particular, a polyamide having a high crystallization temperature includes fine particles having a smooth surface, a narrow particle size distribution, and high sphericity.

    Integrally molded body
    86.
    发明授权

    公开(公告)号:US11794385B2

    公开(公告)日:2023-10-24

    申请号:US16641447

    申请日:2018-08-24

    Abstract: The following configuration is adopted for the purpose of solving reduction in strength and rigidity at a weldline which is a problem of an injection molding body, and enabling free design such as thin wall molding or complex shape molding of the injection molding body. That is, there is provided



    an integrally molded body in which a substrate for reinforcement (a) having a discontinuous fiber (a1) and a resin (a2) and an injection molding body (b) having a discontinuous fiber (b1) and a resin (b2) are integrated, the substrate for reinforcement (a) covering a part or all of a weldline of the injection molding body (b) to be integrated with the injection molding body (b),
    the ratio of thickness Ta of the substrate for reinforcement (a) to thickness T of a weldline part of the integrally molded body satisfying relational expression:
    in a case of Ea≠Ebw,

    Ta/T≤((Ebw−√(Ea·Ebw))/(Ebw−Ea))

    in a case of Ea=Ebw,

    Ta/T≤0.5

    wherein, Ta: Thickness of substrate for reinforcement (a),
    T: Thickness of weldline part of integrally molded body,
    Ea: Flexural modulus of substrate for reinforcement (a) in width direction of weldline, and
    Ebw: Flexural modulus of weldline of injection molding body (b) in width direction of weldline.

    DISPLAY DEVICE AND PRODUCTION METHOD FOR DISPLAY DEVICE

    公开(公告)号:US20230335697A1

    公开(公告)日:2023-10-19

    申请号:US18028659

    申请日:2021-10-05

    Abstract: LED display devices emit light in all directions. Therefore, light is absorbed by peripheral insulating films for insulation of wiring, protective films, partition walls, and the like, and the light-extraction efficiency of a display becomes reduced, resulting in insufficient luminance. According to the present invention, such a problem is solved. This display device comprises at least: a metal wiring; a cured film; and a plurality of light-emitting elements. Each of the light-emitting elements is equipped with a pair of electrode terminals on one surface thereof. The pair of electrode terminals are connected to a plurality of strands of the metal wiring extending in the cured film. The plurality of strands of the metal wiring are configured to maintain electrical insulating properties due to the cured film. The cured film is obtained by curing a resin composition containing a resin (A). The transmittance of the cured film with respect to light having a wavelength of 450 nm is 80-100% at a thickness standard of 5 μm of the cured film.

Patent Agency Ranking