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公开(公告)号：US09793033B2
公开(公告)日：2017-10-17
申请号：US14920999
申请日：2015-10-23
Applicant: KOA Corporation
Inventor： Hiroyuki Fukao
IPC: H01C3/10 , H01C1/14 , H01C17/242 , H01C3/12 , H01C7/10 , H01C17/065 , H01C17/245
CPC classification number: H01C1/14 , H01C3/10 , H01C3/12 , H01C7/1006 , H01C17/065 , H01C17/242 , H01C17/245
Abstract: There is provided a resistor in which a first resistive part of a resistive element that electrically conducts between a pair of electrodes formed on either end of an insulating substrate has a meandering pattern meandering on the substrate surface and a swelling pattern that has a form in which a part of the meandering pattern swells out from the stroke width of the meandering pattern, a second resistive part that is electrically connected in series to the first resistive part is shorter than the entire length of the first resistive part, and has a wider width than the stroke width of the meandering pattern, and a trimming groove is formed in at least either the swelling pattern or the second resistive part. This can improve resistance accuracy and provide a high voltage resistor with high withstand voltage property.
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公开(公告)号：US20170221614A1
公开(公告)日：2017-08-03
申请号：US15304989
申请日：2015-04-09
Applicant: KOA CORPORATION
Inventor： Kosuke ARAI , Tadahiko YOSHIOKA
CPC classification number: H01C17/28 , H01C1/01 , H01C1/14 , H01C1/16 , H01C17/006 , H01C17/24 , H01C17/245 , Y10T29/49082 , Y10T29/49101
Abstract: Provided is a method for producing a resistor, including a step of forming a through-hole in a sheet-like conductive material; a step of fitting a resistive element piece into the through-hole and thus forming joint portions where end surfaces of the resistive element piece are joined to respective side surfaces of the conductive material exposed by the through-hole; and stamping a region including the joint portions from the conductive material, thereby forming a resistor including a resistive element and a pair of electrodes.
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公开(公告)号：US20170162302A1
公开(公告)日：2017-06-08
申请号：US15316672
申请日：2015-06-08
Applicant: KOA CORPORATION
Inventor： Satoshi Chiku
CPC classification number: H01C1/148 , G01R19/00 , G01R19/32 , H01C1/14 , H01C1/144 , H01C7/06 , H01C7/10 , H01C7/13 , H01C17/28
Abstract: Provided is a current detection resistor, which has a jumper function and a low resistance resistor function at the same time. The resistor is a metal plate resistor, which comprises a resistor body consisting of a metal material and a pair of electrodes consisting of a metal material having higher conductivity than the resistor body, wherein the resistor body is bonded between the electrodes. The pair of electrodes comprises a first electrode and a second electrode longer than the first electrode, wherein a slit is formed in the second electrode so that a portion of the second electrode becomes a terminal for voltage detection. The end of the slit does not reach the resistor body. The first electrode and the second electrode are respectively provided with mounting portions connecting to wiring patterns, and the resistor body is formed in the vicinity of the mounting portion of the first electrode.
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公开(公告)号：US20170125142A1
公开(公告)日：2017-05-04
申请号：US15301578
申请日：2015-04-06
Applicant: KOA CORPORATION
Inventor： Keishi NAKAMURA , Kenji KAMEKO
Abstract: In a metal plate resistor, the bonded surface between the resistance body and the electrode can be prevented from peeling off. The metal plate resistor comprises a resistance body; an electrode consisting of metal material having a higher conductivity than the resistance body, and the electrode bonded with the resistance body; a recessed portion formed in an end face of the electrode on a side bonded with the resistance body; and a fixation hole formed in the electrode for inserting a bolt; wherein an end portion of the resistance body is fitted into the recessed portion in the electrode. The recessed portion is provided with wall portions on both sides in a width direction of the resistance body, and in a direction substantially perpendicular to a penetration direction of the fixation hole. The recessed portion is opened to an end face and a first surface of the electrode.
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公开(公告)号：US09625494B2
公开(公告)日：2017-04-18
申请号：US14423907
申请日：2013-08-21
Applicant: KOA CORPORATION
Inventor： Keishi Nakamura , Koichi Hirasawa , Kenji Kameko
Abstract: Provided is a current detection resistor that is small and that inhibits influence of the skin effect due to high frequency current. The resistor includes a resistor body (11) and at least a pair of electrodes (12), wherein the resistor body (11) is configured in a pillar-shape having diameter of 4 mm or less disposed between the electrodes. Each of the electrodes (12) is made to be longer in the direction in which the electrodes are placed and longer than twice the distance between the electrodes, which sandwich the resistor body. Further, each of electrodes (12) is square pillar-shaped, and the resistor body is fixed to roughly to center of the electrode in cross-section.
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Patent Agency Ranking
公开(公告)号：US09437352B2
公开(公告)日：2016-09-06
申请号：US14383961
申请日：2013-03-25
Applicant: KOA CORPORATION
Inventor： Kenji Kameko , Koichi Hirasawa
CPC classification number: H01C1/14 , H01C1/142 , H01C1/144 , H01C17/283
Abstract: Provided is a resistor for current detection, wherein connection failure etc. due to electro-migration is prevented from being generated in state that the resistor is mounted on a mounting board. The resistor has a resistance body (11) and electrodes (12). The electrode (12) includes first electrode portion (12a) connected to the resistance body (11) and second electrode portion (12b) formed on the first electrode portion (12a). The second electrode portion (12b) consists of material having higher resistivity than the first electrode portion (12a) and solder, which is used for mounting the resistor on the mounting board.
Abstract translation: 提供了一种用于电流检测的电阻器，其中防止在电阻器安装在安装板上的状态下由于电迁移而导致的连接故障等。 电阻器具有电阻体（11）和电极（12）。 电极（12）包括连接到电阻体（11）的第一电极部分（12a）和形成在第一电极部分（12a）上的第二电极部分（12b）。 第二电极部分（12b）由电阻率高于第一电极部分（12a）的电阻和用于将电阻器安装在安装板上的焊料构成。
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公开(公告)号：US20160163433A1
公开(公告)日：2016-06-09
申请号：US14905459
申请日：2014-07-09
Applicant: KOA CORPORATION
Inventor： Yuya TAKEUE , Todaro UEGANE , Kentaro MATSUMOTO
CPC classification number: H01C17/28 , H01C17/006 , H01C17/06 , H01C17/22 , H01C17/242
Abstract: The invention is to provide a chip-resistor manufacturing method in which chipping can be restrained from occurring in an intersection portion between each primary segmentation groove and each secondary segmentation groove. Primary segmentation grooves 21 each having an uneven depth are formed in one surface of a large substrate 20. Pairs of surface electrodes 3 extending across the primary segmentation grooves 21, resistive elements 5 each striding between the surface electrodes 3 paired with each other, etc. are formed in the one surface of the large substrate 20. Then, primary segmentation is performed on the large substrate 20 along the primary segmentation grooves 21 so as to open the surface side where the surface electrodes 3, the resistive elements 5, etc. are formed. Thus, a plurality of strip-like substrates 30 are obtained from the large substrate 20. During the primary segmentation, each primary segmentation groove 21 begins to break from electrode formation regions which are small in groove depth but strong, and then breaks in intersection portions which are large in groove depth but brittle. Accordingly, it is possible to perform primary segmentation on the primary segmentation groove 21 without applying a large load to the intersection portions which are low in strength. Thus, it is possible to prevent chipping from occurring in the intersection portions.
Abstract translation: 本发明是提供一种芯片电阻器制造方法，其中可以抑制在每个主分割槽和每个二次分割槽之间的交叉部分发生碎裂。 每个具有不均匀深度的主分割槽21形成在大基板20的一个表面中。一对表面电极3延伸穿过主分割凹槽21，电阻元件5各自跨越彼此配对的表面电极3等。 形成在大基板20的一个表面上。然后，沿着主分割槽21对大基板20进行主分割，以便打开表面电极3，电阻元件5等的表面侧 形成。 因此，从大基板20获得多个条状基板30.在主分割期间，每个主分割凹槽21开始从凹槽深度小但较强的电极形成区域断裂，然后在交叉部分中断 其深度大，但脆。 因此，可以对主分割槽21进行主分割，而不对强度低的交点进行大的负载。 因此，可以防止在交叉部分发生切屑。
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公开(公告)号：US20150048923A1
公开(公告)日：2015-02-19
申请号：US14383961
申请日：2013-03-25
Applicant: KOA CORPORATION
Inventor： Kenji Kameko , Koichi Hirasawa
IPC: H01C1/14
CPC classification number: H01C1/14 , H01C1/142 , H01C1/144 , H01C17/283
Abstract: Provided is a resistor for current detection, wherein connection failure etc. due to electro-migration is prevented from being generated in state that the resistor is mounted on a mounting board. The resistor has a resistance body (11) and electrodes (12). The electrode (12) includes first electrode portion (12a) connected to the resistance body (11) and second electrode portion (12b) formed on the first electrode portion (12a). The second electrode portion (12b) consists of material having higher resistivity than the first electrode portion (12a) and solder, which is used for mounting the resistor on the mounting board.
Abstract translation: 提供了一种用于电流检测的电阻器，其中防止在电阻器安装在安装板上的状态下由于电迁移而导致的连接故障等。 电阻器具有电阻体（11）和电极（12）。 电极（12）包括连接到电阻体（11）的第一电极部分（12a）和形成在第一电极部分（12a）上的第二电极部分（12b）。 第二电极部分（12b）由电阻率高于第一电极部分（12a）的电阻和用于将电阻器安装在安装板上的焊料构成。
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公开(公告)号：US20240328870A1
公开(公告)日：2024-10-03
申请号：US18573823
申请日：2022-05-30
Applicant: KOA CORPORATION
Inventor： Susumu TOYODA , Keishi NAKAMURA
Abstract: Provided is a temperature sensor which can enhance strength more easily. The temperature sensor comprises a resin film and a titanium metal foil laminated on the resin film. The titanium metal foil constitutes a conductive pattern. In an example, the titanium metal foil is subjected to a surface modification on a surface facing the resin film. In an example, a thickness of the titanium metal foil is within a range of 3-10 μm. In an example, the resin film contains a thermoplastic resin, and a thickness of the resin film is within a range of 20-80 μm.
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公开(公告)号：US12027291B2
公开(公告)日：2024-07-02
申请号：US17769855
申请日：2020-09-24
Applicant: KOA CORPORATION
Inventor： Yasushi Akahane , Nobuhiko Tamada
IPC: H01C1/14
CPC classification number: H01C1/14
Abstract: A chip component comprises: an insulating substrate on which a resistor serving as a functional element is formed; a pair of internal electrodes (front electrodes, end surface electrodes, and back electrodes) that is formed to cover both end portions of the insulating substrate and connected to the resistor; a barrier layer that is formed on a surface of each of the internal electrodes and mainly composed of nickel; and an external connection layer that is formed on a surface of the barrier layer and mainly composed of tin, and the barrier layer is composed of alloy plating (Ni—P) including nickel and phosphorus, which is formed by electrolytic plating, and a content ratio of phosphorus relative to nickel is set in a range of 0.5% to 5% so that the barrier layer has magnetism.
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