摘要:
A method of manufacturing an inorganic substrate coated with a thin silica type glass layer of 2H to 9H pencil hardness, said method comprising the steps of: coating an inorganic substrate with a cyclic dihydrogenpolysiloxane and/or a hydrogenpolysiloxane represented by a specific unit formula, and curing it; an inorganic substrate coated with a thin silica type glass layer; a coating agent for an inorganic substrate that is composed of a cyclic dihydrogenpolysiloxane and/or a hydrogenpolysiloxane represented by a specific unit formula; and a semiconductor device having an inorganic substrate coated with a thin silica type glass layer.
摘要:
A silicone-based pressure-sensitive adhesive composition comprising (A) a condensation-reaction product obtained by subjecting a diorganopolysiloxane having silanol groups on both molecular terminals and 2 or more silicon-bonded alkenyl groups located in side molecular chains in one molecule (a) and organopolysiloxane resin having one or more hydrolyzable groups in one molecule (b) to a condensation reaction in the presence of catalyst (c), (B) an organohydrogenpolysiloxane, (C) a diorganopolysiloxane having silicon-bonded alkenyl groups on both molecular terminals, (D) an organopolysiloxane resin and (E) a platinum catalyst.
摘要:
This invention relates to a cosmetics characterized in that it contains a gelling agent comprising an organopolysiloxane having a silicon-bonded organic group represented by general formula: R1—X—CO—NH—[X—N(—CO—X—R1)]p—X— (1) (wherein R1 designates a group containing metal salt of a carboxylic acid represented by formula —COO− (Mn+)1/n (where M is a metal that has a valence of 1 or higher); X's designate the same or different C2 to C14 bivalent hydrocarbon groups; and p designates an integer from 0 to 10.). Preferably, the organosiloxane has an optionally substituted C9 or more univalent hydrocarbon group. Adding the gelling agent makes it possible to provide a cosmetic possessing superior temporal stability, water retention properties, sensory feel, gloss, curl retention, and cleansing power.
摘要:
A thermally conductive silicone rubber composition comprising: (A) an organopolysiloxane with the exception of below-given components (C) and (E); (B) a thermally conductive filler; (C) a specific organopolysiloxane; (D) a curing agent; (E) a resin-like organopolysiloxane; and (F) a silane compound showing no affinity to aforementioned component (A), wherein component (E) is contained in an amount of 2 to 10 mass % per sum of components (A) and (E), and wherein said component (F) is contained in an amount sufficient for coating 1 to 70% of the entire surface of component (B) determined from the contents of component (B) and the BET specific surface area of aforementioned component (B), demonstrates good handleability and possesses appropriate thixotropicity even when it contains a large amount of thermally conductive filler and when cured is capable of forming a thermally conductive silicone rubber characterized by good adhesive properties and elongation characteristics even without the use of a reinforcing filler.
摘要:
A thermally conductive silicone rubber composition comprising: (A) an organopolysiloxane with the except of below-given components (C) and (E); (B) a thermally conductive filler; (C) a specific organopolysiloxane; (D) a curing agent; and (E) an organopolysiloxane composed of the following units: SiO4/2, R1R22SiO1/2, and R23SiO1/2 (wherein R1 is a univalent hydrocarbon group with an aliphatic, unsaturated bonds, R2 may designate the same or different univalent hydrocarbon groups that do not have aliphatic, unsaturated bonds.), said component (E) being used in an amount of 2 to 10 mass % per sum of components (A) and (E), demonstrates high flowability and good handling characteristics in spite of having a large content of thermally conductive filler and that demonstrates good adhesive properties and elongation and tensile strength in spite of the absence of reinforcing filler.
摘要:
A novel polyether-modified organopolysiloxane and a novel diorganopolysiloxane-polyether block copolymer are more resistant to oxidation than the heretofore existing polyoxyalkylene-modified organopolysiloxanes and are thus more resistant to producing allergenically antigenic oxidation products during elapsed time in storage. Methods of producing this novel polyether-modified organopolysiloxane and novel diorganopolysiloxane-polyether block copolymer are also provided, as well as cosmetic that the modified organopolysiloxane or diorganopolysiloxane-polyether block copolymer.
摘要:
A gelling agent comprising an organopolysiloxane having a silicon-bonded organic group represented by general formula: R1—X—CO—NH—[X—N(—CO—X—R1)]p—X— (1) (wherein R1 designates a group containing metal salt of a carboxylic acid represented by formula —COO− (Mn+)1/n (where M is a metal that has a valence of 1 or higher); X's designate the same or different C2 to C14 bivalent hydrocarbon groups; and p designates an integer from 0 to 10.). Preferably, the organosiloxane has an optionally substituted C9 or more univalent hydrocarbon group. And a gelatinous composition comprising:(A) 1 to 99 wt. % of aforementioned gelling agent; and (B) 99 to 1 wt. % of a compound selected from the group consisting of a silicone oil, a no-polar organic compound, or a low-polar organic compound, or mixtures thereof. The gelatinous composition has excellent thermal stability, temporal stability, and properties of thixotropic rheology.
摘要:
A method of manufacturing a purified product of a liquid medium-chain alkyl-modified polydimethylsiloxane that is free of a specific (unpleasant) odor and is practically odorless, the method comprising the steps of: [A] synthesizing a liquid medium-chain alkyl-modified polydimethylsiloxane by carrying out a hydrosilylation reaction between a hydrosilyl-containing polydimethylsiloxane and an α-olefin with 4 to 18 carbon atoms; and [B] subjecting a crude product of the liquid medium-chain alkyl-modified polydimethylsiloxane obtained in preceding step [A] to an odor-removing treatment by conducting a hydrogenation reaction which is carried out in the presence of a hydrogenation catalyst.
摘要:
A method of inhibiting or reducing discoloration of a diorganopolysiloxane composition comprising the steps of mixing: said composition with the following components in any order: i) a source of ferrous ions; and ii) 0.0001-0.05 wt. % per total weight of the composition of a bis(2-pyridylthio-1-oxide) non-ferrous salt per total weight of the composition.
摘要:
An insulating liquid die-bonding agent for bonding a semiconductor-chip-mounting member to an active surface of a semiconductor chip, said agent comprising: (A) a mixture of (a-1) an organopolysiloxane resin having alkenyl groups and (a-2) a linear-chain organopolysiloxane having in one molecule at least two alkenyl groups; (B) an organopolysiloxane having in one molecule at least two silicon-bonded hydrogen atoms; (C) an organic silicon compound having in one molecule at least one silicon-bonded alkoxy groups; (D) insulating spherical silicone rubber particles having an average diameter of 0.1 to 50 μm and having a type A durometer hardness according to JIS K 6253 equal to or below 80; and (E) a hydrosilylation-reaction catalyst, may not damage the active surface of the semiconductor chip, is well suited for screen printing, is resistant to the formation of voids on the interface between the semiconductor chip and the die-bonding agent, and does not lose its wire-bonding properties.
摘要翻译:一种用于将半导体芯片安装部件接合到半导体芯片的有源表面的绝缘液体芯片接合剂,所述试剂包括:(A)(a-1)具有烯基的有机聚硅氧烷树脂和(a- 2)在一个分子中具有至少两个烯基的直链有机聚硅氧烷; (B)在一个分子中具有至少两个与硅键合的氢原子的有机聚硅氧烷; (C)在一个分子中具有至少一个与硅键合的烷氧基的有机硅化合物; (D)绝缘球形硅橡胶颗粒,其平均直径为0.1至50μm,并且具有根据JIS K 6253等于或低于80的A型硬度计硬度; 和(E)氢化硅烷化反应催化剂不会损坏半导体芯片的活性表面,非常适合于丝网印刷,耐半导体芯片和芯片结合剂之间的界面上形成空隙,以及 不会失去其引线接合性能。