公开(公告)号：US20230171935A1

公开(公告)日：2023-06-01

申请号：US17456813

申请日：2021-11-29

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： David Allen Moore ,  Jonathon Hughes

IPC: H05K13/08 ,  G06T7/73 ,  G06T7/00

CPC classification number: H05K13/081 ,  H05K13/083 ,  G06T7/73 ,  G06T7/001 ,  G06T2207/30141

Abstract: In some examples, a system derives a first representation of an assembly of components based on a first source of information, and derives a second representation of the assembly of components based on a second source of information that is of a different type than the first source of information, where the second representation includes any or a combination of an indication of a source of a respective component of the assembly of components, or placement location information of a component in the assembly. The system compares the first representation to the second representation to identify a deviation between the first representation and the second representation, the deviation corresponding to an alteration of the assembly of components.

公开(公告)号：US20180199480A1

公开(公告)日：2018-07-12

申请号：US15860735

申请日：2018-01-03

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Masahiro TANIGUCHI ,  Masahiro KIHARA ,  Satoshi FURUICHI ,  Toshihiko NAGAYA

IPC: H05K13/08 ,  H05K13/04 ,  H05K3/30

CPC classification number: H05K13/08 ,  H05K13/0815 ,  H05K13/083

Abstract: A method includes a component mounting step of mounting components on a board; a positional deviation amount acquisition step of acquiring a positional deviation amount of each of the components mounted on the board, from a corresponding normal position; and a correction value calculation step of calculating a feedback correction value for correcting a mounting operation in the component mounting step, based on the acquired positional deviation amount. In the correction value calculation step, the feedback correction value is calculated based on the positional deviation amount of each of the components mounted in each of a plurality of division areas on the board, for each of the plurality of division areas, and in the component mounting step, the mounting operation is corrected by using the feedback correction value of the plurality of division areas in which the components are mounted.

公开(公告)号：US20180192522A1

公开(公告)日：2018-07-05

申请号：US15848034

申请日：2017-12-20

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： MASAHIRO TANIGUCHI ,  SATOSHI FURUICHI ,  MASAHIRO KIHARA ,  TOSHIHIKO NAGAYA

IPC: H05K3/30

CPC classification number: H05K3/30 ,  H05K13/0417 ,  H05K13/083

Abstract: A component mounting system includes a plurality of component supply devices (tape feeders) each of which supplies components from a component supply position and a component mounter that sucks the components from the component supply position of each of the plurality of component supply devices with a plurality of nozzles (suction nozzles) to install the components onto a board. A suction position correction value for correcting a suction position shift from a regular suction position when each of the nozzles sucks the components from the component supply position is calculated. The suction position is corrected based on the suction position correction value to suck the components. A suction position shift amount from the regular suction position is calculated. A feeder evaluation value, which is a sum of the suction position correction value and the suction position shift amount, is calculated for each of the plurality of component supply devices.

公开(公告)号：US09818236B2

公开(公告)日：2017-11-14

申请号：US14425424

申请日：2012-09-28

Applicant: FUJI MACHINE MFG. CO., LTD.

Inventor： Daisuke Nakayama

IPC: G01N37/00 ,  G07C3/14 ,  H05K13/08 ,  G05B19/418

CPC classification number: G07C3/146 ,  G05B19/41875 ,  G05B2219/32222 ,  H05K13/08 ,  H05K13/083 ,  Y02P90/22

Abstract: A production line monitoring device that identifies a cause of a production defect, reduces the amount of analysis data and computation, and performs real-time processing, is provided. The production line monitoring device includes a defect indication detection unit that detects an indication of a production defect of a production line, and a defect cause identification unit that identifies a cause of the production defect. The defect indication detection unit collects measurement information measured by an inspection apparatus for each reference that identifies a position on products, and detects an indication of the production defect from the change with time of the measurement information at the references. The defect cause identification unit performs stratified analysis based on production information related to the reference when the defect indication detection unit detects an indication of a production defect, and identifies a cause of a production defect from a result of the analysis.

公开(公告)号：US09733134B2

公开(公告)日：2017-08-15

申请号：US14862954

申请日：2015-09-23

Applicant: International Business Machines Corporation

Inventor： Stephen Michael Hugo ,  Matthew Stephen Kelly

IPC: H02H5/04 ,  G01K13/00 ,  H05K13/04 ,  H05K13/08 ,  B23K1/00 ,  B23K1/008 ,  B23K1/015 ,  H05K3/34 ,  G01K3/00

CPC classification number: G01K13/00 ,  B23K1/0016 ,  B23K1/008 ,  B23K1/015 ,  G01K3/005 ,  H05K3/34 ,  H05K13/0465 ,  H05K13/08 ,  H05K13/082 ,  H05K13/083 ,  H05K2203/04 ,  H05K2203/162

Abstract: A method includes providing a printed circuit board (“PCB”) supporting a solderable component, and supporting a first fuse on the PCB, where the first fuse includes a first temperature-sensitive element that measurably changes in response to exposure to ambient thermal conditions exceeding a first threshold temperature. The PCB, the solderable component, and the first fuse define an apparatus. The method includes performing a PCB assembly manufacturing process, and then testing the first fuse to determine whether, during the PCB assembly manufacturing process, the first fuse was exposed to ambient thermal conditions exceeding a first threshold temperature. The first threshold temperature is a minimum temperature where the PCB assembly manufacturing process is to be carried out, a maximum temperature at which the PCB assembly manufacturing process is to occur, or a first intermediate temperature between the minimum and maximum temperatures.

公开(公告)号：US09661795B2

公开(公告)日：2017-05-23

申请号：US14414737

申请日：2012-07-26

Applicant: Jun Iisaka ,  Toshiya Ito

Inventor： Jun Iisaka ,  Toshiya Ito

IPC: H05K13/04 ,  F21V17/06 ,  F21V19/00 ,  H05K13/08 ,  H05K3/30 ,  F21Y101/00

CPC classification number: H05K13/04 ,  F21V17/06 ,  F21V19/003 ,  F21Y2101/00 ,  F21Y2115/10 ,  H05K3/303 ,  H05K13/08 ,  H05K13/0812 ,  H05K13/083 ,  Y10T29/53178

Abstract: A mounting system which mounts an LED element on a board and mounts a lens so as to cover the LED element, in which control devices which control operations of operating machines include an LED element mounting unit which mounts the LED element in a predetermined mounting position, a deviation amount acquisition unit which acquires a deviation amount between a mounting position and the predetermined mounting position of the LED element, a first lens mounting unit which mounts the lens on the board using a position of the LED element mounted on the board as a reference, when the deviation amount is smaller than a threshold value, and a second lens mounting unit which mounts the lens in a preset position on the board, regardless of the position of the LED element mounted on the board, when the deviation amount is equal to or greater than the threshold value.

公开(公告)号：US09465385B2

公开(公告)日：2016-10-11

申请号：US14109560

申请日：2013-12-17

Applicant: CKD Corporation

Inventor： Yosuke Kamioka ,  Manabu Okuda ,  Shingo Suzuki

IPC: G06F19/00 ,  G05B19/418 ,  H05K13/08

CPC classification number: G05B19/41875 ,  G05B2219/32209 ,  G05B2219/37217 ,  H05K13/08 ,  H05K13/0817 ,  H05K13/083 ,  Y02P90/22

Abstract: In a monitoring system, when there is an evaluation that a product is defective, in a solder print inspecting device that is subject to monitoring, that information is sent to a mobile terminal possessed by an operator. The operator who views the notification performs, through the mobile terminal, a checking task for evaluating whether or not the evaluation result regarding the printed substrate that has been evaluated as a defective product is correct. Depending on the evaluation result, an operating instruction is sent to the solder print inspecting device, which has temporarily stopped the printed substrate. If correction information instructing that the defective-product evaluation be corrected to a non-defective-product evaluation is sent from a mobile terminal to the solder print inspecting device, the solder print inspecting device corrects the defective-product evaluation to a non-defective-product evaluation, and releases the temporary stop of the printed substrate.

Abstract translation: 在监视系统中，当评估产品有缺陷时，在要进行监视的焊料印刷检查装置中，将该信息发送给操作者拥有的移动终端。 查看通知的操作者通过移动终端执行用于评估关于已被评估为缺陷产品的打印基板的评估结果是否正确的检查任务。 根据评估结果，将操作指令发送到已经暂时停止印刷基板的焊料印刷检查装置。 如果从移动终端向焊接印刷检查装置发送指示将缺陷品评价修正为无缺陷品评价的修正信息，则焊料印刷检查装置将缺陷品评价校正为无缺陷品评价， 产品评估，并释放印刷基板的临时停止。

公开(公告)号：US20160011061A1

公开(公告)日：2016-01-14

申请号：US14862954

申请日：2015-09-23

Applicant: International Business Machines Corporation

Inventor： Stephen Michael Hugo ,  Matthew Stephen Kelly

IPC: G01K13/00 ,  H05K3/34

CPC classification number: G01K13/00 ,  B23K1/0016 ,  B23K1/008 ,  B23K1/015 ,  G01K3/005 ,  H05K3/34 ,  H05K13/0465 ,  H05K13/08 ,  H05K13/082 ,  H05K13/083 ,  H05K2203/04 ,  H05K2203/162

Abstract: A method includes providing a printed circuit board (“PCB”) supporting a solderable component, and supporting a first fuse on the PCB, where the first fuse includes a first temperature-sensitive element that measurably changes in response to exposure to ambient thermal conditions exceeding a first threshold temperature. The PCB, the solderable component, and the first fuse define an apparatus. The method includes performing a PCB assembly manufacturing process, and then testing the first fuse to determine whether, during the PCB assembly manufacturing process, the first fuse was exposed to ambient thermal conditions exceeding a first threshold temperature. The first threshold temperature is a minimum temperature where the PCB assembly manufacturing process is to be carried out, a maximum temperature at which the PCB assembly manufacturing process is to occur, or a first intermediate temperature between the minimum and maximum temperatures.

Abstract translation: 一种方法包括提供支撑可焊接部件的印刷电路板（“PCB”），并且在PCB上支撑第一熔丝，其中第一熔丝包括第一温度敏感元件，其响应于暴露于超过环境热条件的可测量的变化 第一阈值温度。 PCB，可焊接部件和第一熔丝限定了一种装置。 该方法包括执行PCB组件制造过程，然后测试第一熔丝以确定在PCB组装制造过程中，第一熔断器是否暴露于超过第一阈值温度的环境热条件下。 第一阈值温度是要进行PCB组件制造过程的最低温度，将要发生PCB组件制造过程的最高温度，或者在最小和最大温度之间的第一中间温度。

公开(公告)号：US20140200700A1

公开(公告)日：2014-07-17

申请号：US14109560

申请日：2013-12-17

Applicant: CKD Corporation

Inventor： Yosuke Kamioka ,  Manabu Okuda ,  Shingo Suzuki

IPC: G05B19/418

CPC classification number: G05B19/41875 ,  G05B2219/32209 ,  G05B2219/37217 ,  H05K13/08 ,  H05K13/0817 ,  H05K13/083 ,  Y02P90/22

Abstract: In a monitoring system, when there is an evaluation that a product is defective, in a solder print inspecting device that is subject to monitoring, that information is sent to a mobile terminal possessed by an operator. The operator who views the notification performs, through the mobile terminal, a checking task for evaluating whether or not the evaluation result regarding the printed substrate that has been evaluated as a defective product is correct. Depending on the evaluation result, an operating instruction is sent to the solder print inspecting device, which has temporarily stopped the printed substrate. If correction information instructing that the defective-product evaluation be corrected to a non-defective-product evaluation is sent from a mobile terminal to the solder print inspecting device, the solder print inspecting device corrects the defective-product evaluation to a non-defective-product evaluation, and releases the temporary stop of the printed substrate.

Abstract translation: 在监视系统中，当评估产品有缺陷时，在要进行监视的焊料印刷检查装置中，将该信息发送给操作者拥有的移动终端。 查看通知的操作者通过移动终端执行用于评估关于已被评估为缺陷产品的打印基板的评估结果是否正确的检查任务。 根据评估结果，将操作指令发送到已经暂时停止印刷基板的焊料印刷检查装置。 如果从移动终端向焊接印刷检查装置发送指示将缺陷品评价修正为无缺陷品评价的修正信息，则焊料印刷检查装置将缺陷品评价校正为无缺陷品评价， 产品评估，并释放印刷基板的临时停止。

公开(公告)号：US08544168B2

公开(公告)日：2013-10-01

申请号：US13320811

申请日：2010-10-07

Applicant: Kenichi Kaida ,  Kenichiro Ishimoto

Inventor： Kenichi Kaida ,  Kenichiro Ishimoto

IPC: H05K3/34

CPC classification number: H05K13/0486 ,  H05K13/0413 ,  H05K13/083 ,  Y10T29/49004 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49144 ,  Y10T29/53022 ,  Y10T29/53178

Abstract: It is an objective to provide a part-mounting method that, even when parts are extremely small, makes it possible to mount the parts at a repair-requiring location without fail, to thus enhance a percentage of a non-defective substrate. In a part-mounting method, inspection is made as to whether or not a parts-missing location exists on a substrate Pb reloaded between a solder printer 2 and a first part-mounting machine 4A after having undergone manual repair by an operator OP, or the like, in connection with a repair-requiring location found through inspection performed after mounting of parts Pt, by use of an inspection camera 15A of a first part-mounting machine 4A. When a parts-missing location on the substrate Pb is found, the parts-missing location is identified. Subsequently, a mounting head 14A of the first part-mounting machine 4A and a mounting head 14B of a second part-mounting machine 4B mount a part Pt at the parts-missing location on the thus-identified substrate Pb.

Abstract translation: 目的是提供一种零件安装方法，即使当零件非常小时，也可以将零件安装在修理需要位置而不会失败，从而提高无缺陷基板的百分比。 在部件安装方法中，检查在操作者OP经过手动修理之后，在焊料打印机2和第一部件安装机器4A之间重新装载的基板Pb上是否存在零件缺失位置，或者 通过使用第一部件安装机4A的检查照相机15A，结合通过在部件Pt安装之后进行的检查而发现的修理需要位置。 当找到衬底Pb上的零件缺失位置时，识别零件缺失位置。 接下来，第一部件安装机4A的安装头14A和第二部件安装机4B的安装头14B将如此识别的基板Pb上的零件缺失位置上的部分Pt安装在一起。