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公开(公告)号：US20190394913A1
公开(公告)日：2019-12-26
申请号：US16559759
申请日：2019-09-04
Inventor： RYOUJI EGUCHI , TOSHIHIKO NAGAYA
IPC: H05K13/00 , G05B19/402
Abstract: There is provided an inspection apparatus which inspects a board on which a mounting apparatus mounts a component, including a detecting unit (an inspection process unit and an inspection camera) that detects inspection information including a positional deviation amount of the component which is mounted on the board, a determining unit that determines whether the detected positional deviation amount falls within a predetermined first range, a transmission unit that transmits the detected positional deviation amount to the mounting apparatus; and a determination unit that determines whether to transmit the detected positional deviation amount to the mounting apparatus. In addition, in a case where it is determined that the positional deviation amount falls within the first range and it is determined that a predetermined condition is satisfied, the determination unit suspends transmission of the positional deviation amount to the mounting apparatus.
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公开(公告)号：US20190090393A1
公开(公告)日：2019-03-21
申请号：US16123122
申请日：2018-09-06
Inventor： TETSUYA TANAKA , MASAHIKO AKASAKA , KOJI SAKURAI , TOSHIHIKO NAGAYA
Abstract: There is provided a component mounting method for mounting an electronic component provided with a connecting pin on a board having a through-hole, including inserting the pin of the electronic component into an inner hole filled with solder paste at a first electrode provided in the through-hole to execute a component mounting operation of lowering the pin to a predetermined mounting height position and pulling up the pin once inserted and lowered into the inner hole in the component mounting operation to a preset intermediate height position.
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公开(公告)号：US20180192522A1
公开(公告)日：2018-07-05
申请号：US15848034
申请日：2017-12-20
Inventor： MASAHIRO TANIGUCHI , SATOSHI FURUICHI , MASAHIRO KIHARA , TOSHIHIKO NAGAYA
IPC: H05K3/30
CPC classification number: H05K3/30 , H05K13/0417 , H05K13/083
Abstract: A component mounting system includes a plurality of component supply devices (tape feeders) each of which supplies components from a component supply position and a component mounter that sucks the components from the component supply position of each of the plurality of component supply devices with a plurality of nozzles (suction nozzles) to install the components onto a board. A suction position correction value for correcting a suction position shift from a regular suction position when each of the nozzles sucks the components from the component supply position is calculated. The suction position is corrected based on the suction position correction value to suck the components. A suction position shift amount from the regular suction position is calculated. A feeder evaluation value, which is a sum of the suction position correction value and the suction position shift amount, is calculated for each of the plurality of component supply devices.
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Patent Agency Ranking
公开(公告)号：US20180098466A1
公开(公告)日：2018-04-05
申请号：US15648555
申请日：2017-07-13
Inventor： RYOUJI EGUCHI , TOSHIHIKO NAGAYA
IPC: H05K13/00 , H05K13/08 , H05K13/04 , G05B19/402
CPC classification number: H05K13/0015 , G05B19/402 , G05B2219/45031 , H05K13/0815
Abstract: There is provided an inspection apparatus which inspects a board on which a mounting apparatus mounts a component, including a detecting unit (an inspection process unit and an inspection camera) that detects inspection information including a positional deviation amount of the component which is mounted on the board, a determining unit that determines whether the detected positional deviation amount falls within a predetermined first range, a transmission unit that transmits the detected positional deviation amount to the mounting apparatus; and a determination unit that determines whether to transmit the detected positional deviation amount to the mounting apparatus. In addition, in a case where it is determined that the positional deviation amount falls within the first range and it is determined that a predetermined condition is satisfied, the determination unit suspends transmission of the positional deviation amount to the mounting apparatus.
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公开(公告)号：US20200225637A1
公开(公告)日：2020-07-16
申请号：US16833721
申请日：2020-03-30
Inventor： SATOSHI FURUICHI , MASAHIRO KIHARA , TOSHIHIKO NAGAYA , MASAHIRO TANIGUCHI
IPC: G05B19/402 , G05B19/4063
Abstract: A mounting board manufacturing system includes: a component placer including a placing head and a placing head mover that moves the placing head to a target position for placing the component on the board; an inspector that inspects a placement position of the component by imaging the board; a correction value calculator that calculates a correction value for correcting the target position; a target position calculator that calculates the target position using the correction value; and a correction value changer that changes a latest correction value used immediately before stopping an operation of the component placer to a correction value different from the latest correction value when the operation is resumed.
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6.发明申请公开(公告)号：US20190254174A1
公开(公告)日：2019-08-15
申请号：US16268519
申请日：2019-02-06
Inventor： TETSUYA TANAKA , MASAHIKO AKASAKA , KOJI SAKURAI , TOSHIHIKO NAGAYA
CPC classification number: H05K3/3447 , B23K1/0016 , B23K1/203 , B23K2101/42 , H05K3/3484 , H05K3/3489 , H05K13/0409 , H05K2203/0126 , H05K2203/0139
Abstract: In component mounting for mounting a pin connecting component having a pin on a board having a through-hole electrode, a solder paste is printed on the through-hole electrode through a screen mask having an opening corresponding to the through-hole electrode, a flux is transferred onto the pin by holding the pin connecting component and immersing the pin into a flux tank filled with the flux, and the pin onto which the flux is transferred is inserted into the through-hole electrode on which the solder paste is printed to mount the pin connecting component on the board.
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公开(公告)号：US20190064765A1
公开(公告)日：2019-02-28
申请号：US16057848
申请日：2018-08-08
Inventor： SATOSHI FURUICHI , MASAHIRO KIHARA , TOSHIHIKO NAGAYA , MASAHIRO TANIGUCHI
IPC: G05B19/402 , G05B19/4063
Abstract: There is provided a mounting board manufacturing system including: a component placer including a placing head having a holding tool that holds a component and places the component on a board, and a placing head mover that moves the placing head to a target position for placing the component held by the holding tool at a component placement position of the board; an inspector that inspects a placement position of the component placed on the board by imaging the board on which the component is placed by the component placer; a correction value calculator that calculates a correction value for correcting the target position using an inspection result, and updates the correction value using a new inspection result when the new inspection result is obtained; a target position calculator that calculates the target position using the correction value; and a correction value changer that changes a latest correction value used immediately before stopping an operation of the component placer to a correction value different from the latest correction value when the operation is resumed after the component placer stops the operation and the component is to be placed by the component placer.
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公开(公告)号：US20170174438A1
公开(公告)日：2017-06-22
申请号：US15351587
申请日：2016-11-15
Inventor： GOUKI CHIBA , TOSHIHIKO NAGAYA
IPC: B65G43/02
CPC classification number: B65G43/02 , B65G23/44 , B65G2203/0275 , B65G2203/041 , H05K13/0061 , H05K13/0812
Abstract: An electronic component mounter having a mounting head includes: a board transporter (transport mechanism) that transports a board with a transport belt supporting the board; a recognizer (a board recognition camera or a height sensor) that is provided in the mounting head and recognizes a state of a front surface of the transport belt; and a determiner (wear determiner) that determines a degradation state (wear degree) of the transport belt based on the state of the front surface of the transport belt recognized by the recognizer.
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