知搜-全球专利检索

  1. Login
  2. Sign Up

Search Results

4 records (took 0.04 seconds)

    SOLDER ASSEMBLY TEMPERATURE MONITORING PROCESS
    2.
    发明申请
    SOLDER ASSEMBLY TEMPERATURE MONITORING PROCESS 有权
    焊接组装温度监测过程

    公开(公告)号：US20140198424A1

    公开(公告)日：2014-07-17

    申请号：US13739994

    申请日：2013-01-11

    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

    Inventor： Stephen Michael Hugo ,  Matthew Stephen Kelly

    IPC: H02H5/04 ,  H05K13/04

    CPC classification number: G01K13/00 ,  B23K1/0016 ,  B23K1/008 ,  B23K1/015 ,  G01K3/005 ,  H05K3/34 ,  H05K13/0465 ,  H05K13/08 ,  H05K13/082 ,  H05K13/083 ,  H05K2203/04 ,  H05K2203/162

    Abstract: An apparatus according to the invention may include one or more fuses placed on a printed circuit board on which an printed circuit board assembly is formed. Each fuse changes in response to ambient thermal conditions beyond a threshold temperature. The change can be detected with a testing apparatus such as in in-circuit tester after a process such as a solder assembly process to determine whether the process was performed within the desire temperature range. Fuses may be positioned at different locations on the printed circuit board to provide localized and differentiated temperature measurements. An array of fuses may be designed to change at a progressing sequence of ambient temperatures to enable trends in the process temperature to be recorded. Temperature data may be recorded and linked to an identifier on the apparatus such as a product serial number.

    Abstract translation: 根据本发明的装置可以包括放置在其上形成印刷电路板组件的印刷电路板上的一个或多个熔丝。 每个保险丝响应于超过阈值温度的环境热条件而变化。 可以在诸如焊接组装工艺的过程之后用诸如在线测试仪中的测试装置来检测变化，以确定该过程是否在期望的温度范围内执行。 保险丝可以位于印刷电路板上的不同位置，以提供局部和区别的温度测量。 可以设计一系列保险丝以在环境温度的进行顺序上改变以使记录过程温度的趋势。 可以记录温度数据并将其链接到设备上的标识符，例如产品序列号。

    SOLDER ASSEMBLY TEMPERATURE MONITORING PROCESS
    4.
    发明申请
    SOLDER ASSEMBLY TEMPERATURE MONITORING PROCESS 有权
    焊接组装温度监测过程

    公开(公告)号：US20160011061A1

    公开(公告)日：2016-01-14

    申请号：US14862954

    申请日：2015-09-23

    Applicant: International Business Machines Corporation

    Inventor： Stephen Michael Hugo ,  Matthew Stephen Kelly

    IPC: G01K13/00 ,  H05K3/34

    CPC classification number: G01K13/00 ,  B23K1/0016 ,  B23K1/008 ,  B23K1/015 ,  G01K3/005 ,  H05K3/34 ,  H05K13/0465 ,  H05K13/08 ,  H05K13/082 ,  H05K13/083 ,  H05K2203/04 ,  H05K2203/162

    Abstract: A method includes providing a printed circuit board (“PCB”) supporting a solderable component, and supporting a first fuse on the PCB, where the first fuse includes a first temperature-sensitive element that measurably changes in response to exposure to ambient thermal conditions exceeding a first threshold temperature. The PCB, the solderable component, and the first fuse define an apparatus. The method includes performing a PCB assembly manufacturing process, and then testing the first fuse to determine whether, during the PCB assembly manufacturing process, the first fuse was exposed to ambient thermal conditions exceeding a first threshold temperature. The first threshold temperature is a minimum temperature where the PCB assembly manufacturing process is to be carried out, a maximum temperature at which the PCB assembly manufacturing process is to occur, or a first intermediate temperature between the minimum and maximum temperatures.

    Abstract translation: 一种方法包括提供支撑可焊接部件的印刷电路板（“PCB”），并且在PCB上支撑第一熔丝，其中第一熔丝包括第一温度敏感元件，其响应于暴露于超过环境热条件的可测量的变化 第一阈值温度。 PCB，可焊接部件和第一熔丝限定了一种装置。 该方法包括执行PCB组件制造过程，然后测试第一熔丝以确定在PCB组装制造过程中，第一熔断器是否暴露于超过第一阈值温度的环境热条件下。 第一阈值温度是要进行PCB组件制造过程的最低温度，将要发生PCB组件制造过程的最高温度，或者在最小和最大温度之间的第一中间温度。

Patent Agency Ranking