公开(公告)号：US09276146B2

公开(公告)日：2016-03-01

申请号：US14400691

申请日：2013-04-12

Applicant: Robert Bosch GmbH

Inventor： Ingo Herrmann ,  Christoph Schelling

IPC: H01L31/0352 ,  G01J5/20 ,  H01L27/146 ,  H01L31/103 ,  G01J5/04 ,  G01J5/02 ,  H01L27/144 ,  H01L31/02 ,  H01L31/028 ,  H01L31/18

CPC classification number: H01L31/035281 ,  G01J5/0225 ,  G01J5/023 ,  G01J5/024 ,  G01J5/046 ,  G01J5/20 ,  H01L27/1443 ,  H01L27/14649 ,  H01L31/02005 ,  H01L31/028 ,  H01L31/103 ,  H01L31/1804 ,  Y02E10/50

Abstract: An infrared sensor device includes at least one sensor element formed in a semiconductor substrate, an SOI wafer that defines a gap below and around the sensor element, and a suspension device that is configured to suspend the sensor element in the SOI wafer. The sensor element is substantially arranged below the suspension device, thereby achieving a high sensitivity, low thermal capacity, low thermal coupling to the substrate and a high image refresh rate.

Abstract translation: 红外线传感器装置包括形成在半导体衬底中的至少一个传感器元件，限定传感器元件下方和周围的间隙的SOI晶片，以及悬置装置，其将传感器元件悬置在SOI晶片中。 传感器元件基本上布置在悬挂装置下方，从而实现高灵敏度，低热容量，对基板的低热耦合和高图像刷新率。

公开(公告)号：US09274003B2

公开(公告)日：2016-03-01

申请号：US14071306

申请日：2013-11-04

Applicant: Robert Bosch GmbH

Inventor： Ingo Herrmann ,  Christoph Schelling

IPC: G01J5/00 ,  G01J5/10 ,  G01J5/20 ,  G01J5/08

CPC classification number: G01J5/10 ,  G01J5/0853 ,  G01J5/20

Abstract: An image pixel apparatus for detecting electromagnetic radiation includes an absorption structure device configured to absorb the electromagnetic radiation and to take it up as a quantity of heat. At least one plasmonic resonance structure device of the apparatus is configured to forward the electromagnetic radiation to the absorption structure device. A detection device that has at least one detection element is configured to detect the electromagnetic radiation by way of changes in an electrical property of the at least one detection element that are caused by the quantity of heat taken up.

Abstract translation: 用于检测电磁辐射的图像像素装置包括吸收结构装置，其被配置为吸收电磁辐射并且以一定的热量将其吸收。 装置的至少一个等离子体激元共振结构装置被配置为将电磁辐射转发到吸收结构装置。 具有至少一个检测元件的检测装置被配置为通过由所吸收的热量引起的至少一个检测元件的电特性的变化来检测电磁辐射。

公开(公告)号：US20150375991A1

公开(公告)日：2015-12-31

申请号：US14764259

申请日：2014-01-03

Applicant: ROBERT BOSCH GMBH

Inventor： Christoph Schelling ,  Jochen Zoellin

IPC: B81B3/00

CPC classification number: B81B3/0072 ,  B81B2201/0257 ,  B81B2203/0118 ,  B81B2203/0127 ,  B81B2203/0163 ,  B81B2203/0307 ,  B81B2203/04

Abstract: A diaphragm structure of a micromechanical component includes: a diaphragm integrated via at least one spring element into a layered structure, the diaphragm spanning a cavern, so that at least one section of the diaphragm edge extends up to and beyond the edge area of the cavern; and an anchoring structure formed in the overlap area between the diaphragm and the cavern edge area. The anchoring structure includes at least one anchor element structured out of the layered structure above the cavern edge area, and one through opening for the anchor element formed in the edge area of the diaphragm, so that there is a clearance between the anchor element and the through opening which allows for a mechanical stress relaxation of the diaphragm.

Abstract translation: 微机械部件的隔膜结构包括：通过至少一个弹簧元件整合成分层结构的隔膜，所述隔膜跨越洞穴，使得隔膜边缘的至少一个部分延伸到并超出洞穴的边缘区域 ; 以及形成在隔膜和洞穴边缘区域之间的重叠区域中的锚定结构。 锚定结构包括至少一个由洞穴边缘区域上方的层状结构构成的锚定元件，以及形成在隔膜的边缘区域中的锚定元件的一个通孔，使得锚固元件和 通过开口，其允许隔膜的机械应力松弛。

公开(公告)号：US20150372216A1

公开(公告)日：2015-12-24

申请号：US14744664

申请日：2015-06-19

Applicant: Robert Bosch GmbH

Inventor： Christoph Schelling ,  Fabian Utermoehlen ,  Ingo Herrmann

IPC: H01L37/02 ,  H01L31/0224 ,  H01L31/18 ,  H01L31/09

CPC classification number: H01L37/02 ,  G01J5/10 ,  G01J2005/0077 ,  H01L27/14649 ,  H01L31/0224 ,  H01L31/035272 ,  H01L31/09 ,  H01L31/103 ,  H01L31/18

Abstract: A thermodiode element for a photosensor of a thermocamera usable for infrared radiation measurement includes a semiconductor substrate that has a first layer, and a second layer adjoining the first layer. The first layer has a base doping zone, and the second layer has a side doping zone that is the same doping type as the base doping zone. The second layer also has a further doping zone that is arranged as an island in the side doping zone and that has a doping type that is opposite to the doping type of the base doping zone. The base doping zone is further arranged in the first layer so as to adjoin the further doping zone.

Abstract translation: 用于可用于红外辐射测量的热电偶的光电传感器的热电偶元件包括具有第一层的半导体衬底和与第一层邻接的第二层。 第一层具有基极掺杂区，第二层具有与基底掺杂区相同的掺杂类型的侧掺杂区。 第二层还具有另外的掺杂区，其在侧掺杂区中被布置为岛，并且具有与基极掺杂区的掺杂类型相反的掺杂类型。 基底掺杂区进一步布置在第一层中，以便与另外的掺杂区相邻。

公开(公告)号：US20140103779A1

公开(公告)日：2014-04-17

申请号：US14053752

申请日：2013-10-15

Applicant: Robert Bosch GmbH

Inventor： Christoph Schelling ,  Theresa Lutz

IPC: H02N1/00 ,  B81C1/00 ,  B81B3/00

CPC classification number: H02N1/00 ,  B81B3/0027 ,  B81B3/0086 ,  B81B2201/0257 ,  B81C1/0038 ,  H04R19/01 ,  Y10T29/49117

Abstract: A microelectromechanical component and a method for producing a microelectromechanical component includes a charge-storing layer that has improved long-term stability. The charge-storing layer is completely enclosed by dielectric layers such that there is a high potential barrier between the charge-storing layer and the dielectric layers. During normal operation, it is not possible to overcome this high potential barrier and, as a result, the stored charge carriers are maintained over a very long period of time.

Abstract translation: 微电子机械部件和微电子部件的制造方法包括具有提高的长期稳定性的电荷存储层。 电荷存储层被电介质层完全封闭，使得在电荷存储层和电介质层之间存在高电势势垒。 在正常操作期间，不可能克服这个高电势势垒，结果，存储的电荷载体保持很长的时间。

公开(公告)号：US20140084408A1

公开(公告)日：2014-03-27

申请号：US14032340

申请日：2013-09-20

Applicant: Robert Bosch GmbH

Inventor： Georg Bischopink ,  Silvia Kronmueller ,  Christoph Schelling

IPC: H01L27/142 ,  H01L31/18

CPC classification number: H01L27/142 ,  H01L24/19 ,  H01L27/14649 ,  H01L31/0475 ,  H01L31/1876 ,  Y02E10/50

Abstract: A semiconductor device includes a carrier substrate having at least one conductor track, at least one converter element structured at least partly from a further semiconductor substrate, and conductive structures formed on a respective converter element. The at least one converter element is electrically linked to the at least one conductor track via at least one at least partly conductive supporting element arranged between a contact side of the carrier substrate and an inner side of the converter element. The inner side is oriented toward the carrier substrate. The at least one converter element is arranged on the contact side of the carrier substrate such that the inner side of the converter element is kept spaced apart from the contact side of the carrier substrate. The at least one converter element and the conductive structures formed thereon are completely embedded into at least one insulating material.

Abstract translation: 半导体器件包括具有至少一个导体轨道的载体衬底，至少一个由另一个半导体衬底构成的转换器元件，以及形成在相应的转换元件上的导电结构。 所述至少一个转换器元件经由布置在所述载体基板的接触侧和所述转换器元件的内侧之间的至少一个至少部分导电的支撑元件电连接到所述至少一个导体轨道。 内侧朝向载体基板。 所述至少一个转换器元件布置在所述载体衬底的接触侧上，使得所述转换器元件的内侧与所述载体衬底的接触侧保持间隔开。 至少一个转换器元件和其上形成的导电结构完全嵌入到至少一个绝缘材料中。

公开(公告)号：US20140035168A1

公开(公告)日：2014-02-06

申请号：US13954649

申请日：2013-07-30

Applicant: Robert Bosch GmbH

Inventor： Christoph Schelling ,  David Borowsky

IPC: H01L23/00 ,  H05K3/40 ,  H05K1/11

CPC classification number: H01L23/564 ,  B81B7/007 ,  B81C2201/019 ,  B81C2203/035 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/30 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/11462 ,  H01L2224/1147 ,  H01L2224/1181 ,  H01L2224/11825 ,  H01L2224/13011 ,  H01L2224/13022 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/13664 ,  H01L2224/13669 ,  H01L2224/27462 ,  H01L2224/2747 ,  H01L2224/2781 ,  H01L2224/27825 ,  H01L2224/29011 ,  H01L2224/29022 ,  H01L2224/29035 ,  H01L2224/29124 ,  H01L2224/29147 ,  H01L2224/29155 ,  H01L2224/29166 ,  H01L2224/29181 ,  H01L2224/29186 ,  H01L2224/29562 ,  H01L2224/2957 ,  H01L2224/29644 ,  H01L2224/29647 ,  H01L2224/29664 ,  H01L2224/29669 ,  H01L2224/32227 ,  H01L2224/73103 ,  H01L2224/73203 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/8183 ,  H01L2224/83193 ,  H01L2224/83203 ,  H01L2224/8383 ,  H01L2224/9211 ,  H01L2924/00013 ,  H01L2924/1461 ,  H05K1/111 ,  H05K3/4007 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/01074 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/01015 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01005 ,  H01L2924/01027 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2224/81205

Abstract: A bonding pad for thermocompression bonding of a carrier material to a further carrier material includes a base layer and a top layer. The base layer is made of metal, is deformable, and is connected to the carrier material. The metal is nickel-based. The top layer is metallic and is connected directly to the base layer. The top layer is arranged at least on a side of the base layer which faces away from the carrier material. The top layer has a smaller layer thickness than the base layer. In at least one embodiment, the top layer has a greater oxidation resistance than the base layer.

Abstract translation: 用于将载体材料热压接合到另外的载体材料的接合焊盘包括基层和顶层。 基层由金属制成，可变形，并与载体材料连接。 金属为镍基。 顶层是金属的，并直接连接到基层。 顶层至少布置在基层的远离载体材料的一侧上。 顶层具有比基层更薄的层厚度。 在至少一个实施方案中，顶层具有比基层更高的抗氧化性。

公开(公告)号：US20130257420A1

公开(公告)日：2013-10-03

申请号：US13851392

申请日：2013-03-27

Applicant: ROBERT BOSCH GMBH

Inventor： Hubert Benzel ,  Christoph Schelling

IPC: G01P3/487

CPC classification number: G01P3/487 ,  G01R33/0052 ,  H01L21/78 ,  H01L2224/48463 ,  H01L2224/73265 ,  H01L2924/10156 ,  Y10T29/49128

Abstract: A sensor includes a body having a sensor surface and an oblique surface. A sensor element is arranged on the sensor surface and configured to pick up a direction component of a directional measurement variable. At least one contact-making surface configured to make contact with the sensor element is arranged on the oblique surface. The oblique surface is at an angle with respect to a lattice structure of carrier material of the sensor and is oriented in a different direction than the sensor surface.

Abstract translation: 传感器包括具有传感器表面和倾斜表面的主体。 传感器元件布置在传感器表面上并且被配置为拾取方向测量变量的方向分量。 构造成与传感器元件接触的至少一个接触制作表面布置在倾斜表面上。 倾斜表面相对于传感器的载体材料的格子结构成一角度并且在与传感器表面不同的方向上定向。

公开(公告)号：US20240425351A1

公开(公告)日：2024-12-26

申请号：US18738435

申请日：2024-06-10

Applicant: Robert Bosch GmbH

Inventor： Christoph Schelling ,  Jochen Reinmuth

IPC: B81B3/00 ,  G01L9/00

Abstract: A microelectromechanical device for capacitive fluid pressure measurement. The microelectromechanical device has a first electrode and a second electrode forming a counter-electrode. The device has a cavity formed between a first boundary layer and a second boundary layer or a substrate, in which cavity the first electrode is arranged and movably mounted, wherein the first boundary layer and/or the second boundary layer can be deflected by a fluid pressure and wherein the first boundary layer and/or the second boundary layer is or are coupled to the first electrode by a first coupling element for transmitting a deflection movement to the movably mounted first electrode. A microelectromechanical pressure sensor, a microelectromechanical microphone, and a microelectromechanical combination sensor element, are also disclosed.

公开(公告)号：US20240405749A1

公开(公告)日：2024-12-05

申请号：US18699043

申请日：2022-10-05

Applicant: Robert Bosch GmbH

Inventor： Christoph Schelling

IPC: H03H9/64 ,  H03H9/05 ,  H03H9/54

Abstract: A high-frequency filter device. The high-frequency filter device includes a signal input, which is designed to receive a high-frequency signal. The high-frequency filter device also includes a plurality of filter units, which are designed to filter the high-frequency signal received by the signal input. The high-frequency filter device also includes at least one switch unit, which can be actuated by a switch signal in order to modify a filter characteristic of the high-frequency filter device by connecting the filter units. The high-frequency filter device includes a signal output, which is designed to output the filtered high-frequency signal.