Organic light emitting display with single crystalline silicon TFT and method of fabricating the same
    71.
    发明授权
    Organic light emitting display with single crystalline silicon TFT and method of fabricating the same 有权
    具有单晶硅TFT的有机发光显示器及其制造方法

    公开(公告)号:US07816678B2

    公开(公告)日:2010-10-19

    申请号:US12175778

    申请日:2008-07-18

    摘要: Provided is an organic light emitting display, in which a semiconductor circuit unit of 2T-1C structure including a switching transistor and a driving transistor formed of single crystalline silicon is formed on a plastic substrate. A method of fabricating the single crystalline silicon includes: growing a single crystalline silicon layer to a predetermined thickness on a crystal growth plate; depositing a buffer layer on the single crystalline silicon layer; forming a partition layer at a predetermined depth in the single crystalline silicon layer by, e.g., implanting hydrogen ions in the single crystalline silicon layer from an upper portion of an insulating layer; attaching a substrate to the buffer layer; and releasing the partition layer of the single crystalline silicon layer by heating the partition layer from the crystal growth plate to obtain a single crystalline silicon layer of a predetermined thickness on the substrate.

    摘要翻译: 提供一种有机发光显示器,其中在塑料基板上形成包括开关晶体管和由单晶硅形成的驱动晶体管的2T-1C结构的半导体电路单元。 制造单晶硅的方法包括:在晶体生长板上生长单晶硅层至预定厚度; 在单晶硅层上沉积缓冲层; 通过例如从绝缘层的上部注入单晶硅层中的氢离子,在单晶硅层中形成预定深度的分隔层; 将衬底附接到缓冲层; 以及通过从晶体生长板加热分隔层来释放单晶硅层的分隔层,以在基板上获得预定厚度的单晶硅层。

    Semiconductor device including single crystal silicon layer
    72.
    发明授权
    Semiconductor device including single crystal silicon layer 有权
    半导体器件包括单晶硅层

    公开(公告)号:US07772711B2

    公开(公告)日:2010-08-10

    申请号:US11430117

    申请日:2006-05-09

    IPC分类号: H01L27/11

    摘要: A semiconductor device including a substrate, a P-MOS single crystal TFT formed on the substrate, and an N-MOS single crystal TFT formed on the P-MOS single crystal TFT. The source region of the P-MOS single crystal TFT and the source region of the N-MOS single crystal TFT may be connected to each other. The P-MOS single crystal TFT and the N-MOS single crystal TFT may share a common gate. Also, the P-MOS single crystal TFT may include a single crystal silicon layer with a crystal plane of (100) and a crystal direction of . The N-MOS single crystal TFT may include a single crystal silicon layer having the same crystal direction as the single crystal silicon layer of the P-MOS single crystal TFT and having a tensile stress greater than the single crystal silicon layer of the P-MOS single crystal TFT.

    摘要翻译: 包括基板,形成在基板上的P-MOS单晶TFT的半导体器件和形成在P-MOS单晶TFT上的N-MOS单晶TFT。 P-MOS单晶TFT的源极区域和N-MOS单晶TFT的源极区域可以彼此连接。 P-MOS单晶TFT和N-MOS单晶TFT可以共用公共栅极。 此外,P-MOS单晶TFT可以包括具有(100)的晶面并且晶体方向<100的单晶硅层。 N-MOS单晶TFT可以包括与P-MOS单晶TFT的单晶硅层相同的晶体方向的单晶硅层,其拉应力大于P-MOS的单晶硅层 单晶TFT。

    Si nanowire substrate
    73.
    发明授权
    Si nanowire substrate 有权
    Si纳米线基板

    公开(公告)号:US07714330B2

    公开(公告)日:2010-05-11

    申请号:US11889471

    申请日:2007-08-14

    IPC分类号: H01L29/04

    摘要: A silicon nanowire substrate having a structure in which a silicon nanowire film having a fine line-width is formed on a substrate, a method of manufacturing the same, and a method of manufacturing a thin film transistor using the same. The method of manufacturing the silicon nanowire substrate includes preparing a substrate, forming an insulating film on the substrate, forming a silicon film on the insulating film, patterning the insulating film and the silicon film into a strip shape, reducing the line-width of the insulating film by undercut etching at least one lateral side of the insulating film, and forming a self-aligned silicon nanowire film on an upper surface of the insulating film by melting and crystallizing the silicon film.

    摘要翻译: 具有其中在衬底上形成具有细线宽度的硅纳米线膜的结构的硅纳米线衬底,其制造方法以及使用其制造薄膜晶体管的方法。 制造硅纳米线基板的方法包括:准备基板,在基板上形成绝缘膜,在绝缘膜上形成硅膜,将绝缘膜和硅膜图形化成带状,减小线宽 通过对绝缘膜的至少一个侧面进行底切蚀刻来绝缘膜,并且通过使硅膜熔化和结晶,在绝缘膜的上表面上形成自对准硅纳米线膜。

    Semiconductor device including gate stack formed on inclined surface and method of fabricating the same
    74.
    发明申请
    Semiconductor device including gate stack formed on inclined surface and method of fabricating the same 有权
    包括在倾斜表面上形成的栅叠层的半导体器件及其制造方法

    公开(公告)号:US20100112763A1

    公开(公告)日:2010-05-06

    申请号:US12654866

    申请日:2010-01-07

    IPC分类号: H01L21/336

    摘要: A semiconductor device includes a transistor. The transistor includes a substrate having an inclined surface, a first upper surface extending from a lower portion of the inclined surface, and a second upper surface extending from an upper end of the inclined surface. A gate stack structure is formed on the inclined surface and includes a gate electrode. A first impurity region formed on one of the first and second upper surfaces contacts the gate stack structure. A second impurity region formed on the second upper surface contacts the gate stack structure. A channel between the first and second impurity regions is formed along the inclined surface in a crystalline direction.

    摘要翻译: 半导体器件包括晶体管。 晶体管包括具有倾斜表面的基板,从倾斜表面的下部延伸的第一上表面和从倾斜表面的上端延伸的第二上表面。 栅极堆叠结构形成在倾斜表面上并且包括栅电极。 形成在第一和第二上表面中的一个上的第一杂质区域接触栅极堆叠结构。 形成在第二上表面上的第二杂质区域接触栅堆叠结构。 第一和第二杂质区之间的通道在结晶方向上沿着倾斜表面形成。

    Semi-conductor-on-insulator structure, semiconductor devices using the same and method of manufacturing the same
    75.
    发明授权
    Semi-conductor-on-insulator structure, semiconductor devices using the same and method of manufacturing the same 有权
    半导体绝缘体上的结构,使用其的半导体器件及其制造方法

    公开(公告)号:US07557411B2

    公开(公告)日:2009-07-07

    申请号:US11397866

    申请日:2006-04-05

    摘要: Semiconductor-on-insulator (SOI) structures, semiconductor devices using the same and methods of manufacturing the same, and more particularly, to a structure with a single-crystalline (for example, germanium (x-Ge)) layer on an insulating layer, semiconductor devices using the same, and methods of manufacturing the same. The SOI structure may include a single-crystalline substrate formed of a first semiconductor material, a first insulating layer formed on the substrate and having at least one window exposing a portion of the substrate, a first epitaxial growth region formed on a surface of the substrate exposed by the window and formed of at least one of the first semiconductor material and a second semiconductor material, and a first single-crystalline layer formed on the first insulating layer and the first epitaxial growth region and formed of the second semiconductor material, and crystallized using a surface of the first epitaxial growth region as a seed layer for crystallization.

    摘要翻译: 绝缘体上半导体(SOI)结构,使用其的半导体器件及其制造方法,更具体地说,涉及在绝缘层上具有单晶(例如锗(x-Ge))层的结构 ,使用其的半导体器件及其制造方法。 SOI结构可以包括由第一半导体材料形成的单晶衬底,形成在衬底上的第一绝缘层,并且具有暴露衬底的一部分的至少一个窗口,形成在衬底表面上的第一外延生长区域 由窗口露出并由第一半导体材料和第二半导体材料中的至少一个形成,以及形成在第一绝缘层和第一外延生长区上并由第二半导体材料形成的第一单晶层,并且晶化 使用第一外延生长区域的表面作为晶种层进行结晶。

    Nonvolatile memory transistor having poly-silicon fin, stacked nonvolatile memory device having the transistor, method of fabricating the transistor, and method of fabricating the device
    76.
    发明申请
    Nonvolatile memory transistor having poly-silicon fin, stacked nonvolatile memory device having the transistor, method of fabricating the transistor, and method of fabricating the device 失效
    具有多晶硅鳍片的非易失性存储晶体管,具有该晶体管的堆叠式非易失性存储器件,该晶体管的制造方法以及该器件的制造方法

    公开(公告)号:US20080191247A1

    公开(公告)日:2008-08-14

    申请号:US12007037

    申请日:2008-01-04

    摘要: A nonvolatile memory transistor having a poly-silicon fin, a stacked nonvolatile memory device having the transistor, a method of fabricating the transistor, and a method of fabricating the device are provided. The device may include an active fin protruding upward from a semiconductor substrate. At least one first charge storing pattern on a top surface and sidewalls of the active fin may be formed. At least one first control gate line on a top surface of the at least one first charge storing pattern may be formed. The at least one first control gate line may intersect over the active fin. An interlayer dielectric layer may be formed on the at least one first control gate line. A poly-silicon fin may be formed on the interlayer dielectric layer. At least one second charge storing pattern on a top surface and sidewalls of the poly-silicon fin may be formed. At least one second control gate line on a top surface of the at least one second charge storing pattern may be formed, and the at least one second control gate line may intersect over the poly-silicon fin.

    摘要翻译: 提供了具有多晶硅鳍片的非易失性存储晶体管,具有该晶体管的堆叠非易失性存储器件,该晶体管的制造方法以及该器件的制造方法。 该器件可以包括从半导体衬底向上突出的活性鳍片。 可以形成顶表面上的至少一个第一电荷存储图案和有源鳍片的侧壁。 可以形成至少一个第一电荷存储图案的顶表面上的至少一个第一控制栅极线。 至少一个第一控制栅极线可以在有源鳍上交叉。 层间绝缘层可以形成在至少一个第一控制栅极线上。 多晶硅鳍可以形成在层间介电层上。 可以形成多晶硅鳍片的顶表面和侧壁上的至少一个第二电荷存储图案。 可以形成至少一个第二电荷存储图案的顶表面上的至少一个第二控制栅极线,并且所述至少一个第二控制栅极线可以在多晶硅鳍上相交。

    Microlens, an image sensor including a microlens, method of forming a microlens and method for manufacturing an image sensor
    77.
    发明申请
    Microlens, an image sensor including a microlens, method of forming a microlens and method for manufacturing an image sensor 失效
    微透镜,包括微透镜的图像传感器,形成微透镜的方法和用于制造图像传感器的方法

    公开(公告)号:US20080038862A1

    公开(公告)日:2008-02-14

    申请号:US11819386

    申请日:2007-06-27

    IPC分类号: H01L21/64 H01L31/0232

    摘要: A microlens, an image sensor including the microlens, a method of forming the microlens and a method of manufacturing the image sensor are provided. The microlens includes a polysilicon pattern, having a cylindrical shape, formed on a substrate, and a round-type shell portion enclosing the polysilicon pattern. The microlens may further include a filler material filling an interior of the shell portion, or a second shell portion covering the first shell portion. The method of forming a microlens includes forming a silicon pattern on a semiconductor substrate having a lower structure, forming a capping film on the semiconductor substrate over the silicon pattern, annealing the silicon pattern and the capping film altering the silicon pattern to a polysilicon pattern having a cylindrical shape and the capping film to a shell portion for a round-type microlens, and filling an interior of the shell portion with a lens material through an opening between the semiconductor substrate and an edge of the shell portion. The image sensor includes a microlens formed by a similar method and a photodiode having a cylindrical shape.

    摘要翻译: 提供微透镜,包括微透镜的图像传感器,形成微透镜的方法和制造图像传感器的方法。 微透镜包括形成在基板上的具有圆柱形状的多晶硅图案和包围多晶硅图案的圆形外壳部分。 微透镜还可以包括填充壳体部分的内部的填充材料或覆盖第一壳体部分的第二壳体部分。 形成微透镜的方法包括在具有较低结构的半导体衬底上形成硅图案,在硅图案上的半导体衬底上形成覆盖膜,使硅图案和覆盖膜退火,将硅图案改变为具有 圆筒形,并且封盖膜用于圆形微透镜的外壳部分,并且通过半导体基板和外壳部分的边缘之间的开口用透镜材料填充外壳部分的内部。 图像传感器包括通过类似方法形成的微透镜和具有圆柱形状的光电二极管。

    Semiconductor device and methods thereof
    79.
    发明申请
    Semiconductor device and methods thereof 有权
    半导体器件及其方法

    公开(公告)号:US20070246802A1

    公开(公告)日:2007-10-25

    申请号:US11702624

    申请日:2007-02-06

    IPC分类号: H01L23/58 H01L21/469

    摘要: A semiconductor device and method thereof. The example method may include forming a semiconductor device, including forming a first layer on a substrate, the first layer including aluminum nitride (AlN), forming a second layer by oxidizing a surface of the first layer and forming a third layer on the second layer, the first, second and third layers each being highly oriented with respect to one of a plurality crystallographic planes. The example semiconductor device may include a substrate including a first layer, the first layer including aluminum nitride (AlN), a second layer formed by oxidizing a surface of the first layer and a third layer formed on the second layer, the first, second and third layers each being highly oriented with respect to one of a plurality crystallographic planes.

    摘要翻译: 半导体器件及其方法。 示例性方法可以包括形成半导体器件,包括在衬底上形成第一层,第一层包括氮化铝(AlN),通过氧化第一层的表面并在第二层上形成第三层来形成第二层 ,第一层,第二层和第三层各自相对于多个晶面之一高度取向。 示例性半导体器件可以包括:衬底,其包括第一层,第一层包括氮化铝(AlN),通过氧化第一层的表面形成的第二层和形成在第二层上的第三层,第一层,第二层和第二层 第三层各自相对于多个晶面之一高度取向。