公开(公告)号：US20110235224A1

公开(公告)日：2011-09-29

申请号：US13040891

申请日：2011-03-04

Applicant: Kyouichi KASHIMA ,  Yoshitaka Fukushima ,  Masahiro Ono ,  Tetsuro Hirano

Inventor： Kyouichi KASHIMA ,  Yoshitaka Fukushima ,  Masahiro Ono ,  Tetsuro Hirano

IPC: H02H3/00

CPC classification number: H02J7/0016

Abstract: A circuit device connected between a neighboring pair of terminals in a semiconductor integrated circuit is protected from electrostatic damage due to a surge voltage when the surge voltage is applied between the neighboring pair of terminals. The semiconductor integrated circuit is formed to include terminals P0-P14, MOS transistors MN0-MN15 in diode connection, protection diode circuits HD0-HD14, MOS transistors T1-T14 for discharging electricity from batteries, a battery voltage detection control circuit and a clamp circuit for overvoltage protection. Each of the MOS transistors T1-T14 for discharging electricity from the batteries is connected between each neighboring pair of the terminals P0-P14 through wirings. Each of the MOS transistors MN1-MN14 in diode connection is connected between each neighboring pair of the terminals.

Abstract translation: 当在相邻的一对端子之间施加浪涌电压时，连接在半导体集成电路中的相邻的一对端子之间的电路装置被防止由于浪涌电压引起的静电损伤。 半导体集成电路形成为包括端子P0-P14，二极管连接的MOS晶体管MN0-MN15，保护二极管电路HD0-HD14，用于从电池放电的MOS晶体管T1-T14，电池电压检测控制电路和钳位电路 用于过电压保护。 用于从电池放电的MOS晶体管T1-T14中的每一个通过布线连接在每个相邻的一对端子P0-P14之间。 二极管连接的MOS晶体管MN1〜MN14中的每一个连接在每个相邻的一对端子之间。

公开(公告)号：US07985078B2

公开(公告)日：2011-07-26

申请号：US12644571

申请日：2009-12-22

Applicant: Kentaro Kumazawa ,  Masahiro Ono ,  Yoshihiro Tomura

Inventor： Kentaro Kumazawa ,  Masahiro Ono ,  Yoshihiro Tomura

IPC: H01R12/00

CPC classification number: H01R13/52 ,  H05K1/142 ,  H05K3/284 ,  H05K3/361 ,  H05K2201/10977

Abstract: The electrode junction structure includes: a glass substrate; a plurality of flexible substrates, in a planar view, arranged to cross over an edge of the glass substrate and arranged to have a space from each other along the edge; an adhesive for joining the glass substrate and each flexible substrate; and a sealing resin for covering junction portions between the glass substrate and each flexible substrate, wherein an edge of the sealing resin is formed so that the edge of the sealing resin has, in the planar view, a consecutive waveform portion in which a convex portion and a concave portion alternate with an imaginary line as a center axis, the imaginary line being parallel to the edge of the glass substrate and locating outer than the edge of the glass substrate, and wherein the convex portions are formed to be located on the flexible substrates.

Abstract translation: 电极结结构包括：玻璃基板; 多个柔性基板在平面图中布置成跨过玻璃基板的边缘并且被布置成沿着边缘彼此具有空间; 用于接合玻璃基板和每个柔性基板的粘合剂; 以及密封树脂，用于覆盖玻璃基板和每个柔性基板之间的接合部分，其中形成密封树脂的边缘，使得密封树脂的边缘在平面图中具有连续的波形部分，其中凸部 并且与假想线交替的凹部作为中心轴，所述假想线平行于所述玻璃基板的边缘并位于所述玻璃基板的边缘的外侧，并且其中所述凸部形成为位于所述柔性 底物。

公开(公告)号：US20110172212A1

公开(公告)日：2011-07-14

申请号：US13051248

申请日：2011-03-18

Applicant: Atsushi SAITOU ,  Shigeyuki Kikumoto ,  Masahiro Ono ,  Ryo Matsui ,  Masashi Yamamoto ,  Tomohiro Sawa ,  Shigeru Suzuki ,  Mikiro Yanaka

Inventor： Atsushi SAITOU ,  Shigeyuki Kikumoto ,  Masahiro Ono ,  Ryo Matsui ,  Masashi Yamamoto ,  Tomohiro Sawa ,  Shigeru Suzuki ,  Mikiro Yanaka

IPC: A61K31/4178 ,  C07D403/12 ,  C07D403/14 ,  A61K31/4184 ,  C07D233/64 ,  A61K31/417 ,  C07D403/06 ,  A61K31/5513 ,  C07D401/12 ,  A61K31/4439 ,  C07D401/14 ,  A61K31/4725 ,  C07D471/04 ,  A61K31/437 ,  A61K31/454 ,  A61K31/4709 ,  C07D413/14 ,  A61K31/5377 ,  C07D405/14 ,  A61P29/00 ,  A61P35/04 ,  A61P31/12 ,  A61P31/18

CPC classification number: C07D403/12 ,  C07D263/64 ,  C07D401/14 ,  C07D403/14 ,  C07D405/14 ,  C07D413/14 ,  C07D417/14 ,  C07D471/04

Abstract: Novel amine compounds which are represented by the following formula (1) and efficacious against diseases such as a viral infectious disease with HIV, rheumatism, and cancer metastasis; typically, A1 and A2 represent a hydrogen atom or a substitutable monocyclic or polycyclic heteroaromatic ring and W represents a substitutable benzene ring or any group represented by the following formula (10) or (11): where X represents O, CH2, C(═O), NR11, or CHR35 and D represents a group represented by the following formula (6): [Formula 4] -Q-Y—B  (6) where Q represents a single bond, NR12, or a group represented by the formula (13): and Y represents a group represented by the following formula (7): [Formula 6] —(CR18R19)m3- or —(CR20R21)m4-z-(CR22R23)m5-  (7) where z represents a substitutable monocyclic or polycyclic aromatic ring; and B represents —NR25R26; and R1 to R26 in the above formulae represent a hydrogen atom, an alkyl group, an alkenyl group, or an alkynyl group.

Abstract translation: 由下式（1）表示的新型胺化合物，对HIV，风湿病，癌症转移等病毒感染性疾病有效; 通常，A1和A2表示氢原子或可取代的单环或多环杂芳环，W表示可取代的苯环或由下式（10）或（11）表示的任何基团：其中X表示O，CH 2，C（= O），NR 11或CHR 35，D表示由下式（6）表示的基团：[式4] -QY-B（6）其中Q表示单键，NR12或由式（13）表示的基团 ）：Y表示由下式（7）表示的基团：[式6] - （CR18R19）m3-或 - （CR20R21）m4-z-（CR22R23）m5-（7）其中z表示可取代的单环或 多环芳环; B代表-NR25R26; 上式中的R 1至R 26表示氢原子，烷基，烯基或炔基。

公开(公告)号：US07768795B2

公开(公告)日：2010-08-03

申请号：US11660515

申请日：2005-08-31

Applicant: Daisuke Sakurai ,  Masahiro Ono ,  Kazuhiro Nishikawa

Inventor： Daisuke Sakurai ,  Masahiro Ono ,  Kazuhiro Nishikawa

IPC: H01R12/16

CPC classification number: H01L25/18 ,  G11C5/04 ,  H01L23/5386 ,  H01L23/5387 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/92 ,  H01L24/96 ,  H01L25/0652 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/24137 ,  H01L2224/32145 ,  H01L2224/73267 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/01078 ,  H01L2924/15331 ,  H05K1/185 ,  H05K1/189 ,  H05K3/4614

Abstract: Electronic circuit device (100) is structured so that a substrate module unit that are formed by stacking substrate modules made of a first resin sheet with electronic component (190) embedded thereinto is inserted into housing (150) including connecting terminal (120), control circuit (130), and first wiring pattern (140), where the substrate modules are connected to each other electrically and mechanically. This electronic circuit device (100) dispenses with a mother substrate. Further, with slimming down of a substrate module, a substrate module unit with a large number of substrate modules stacked can be loaded in a limited packaging space, thus mounting greater storage capacity and higher functionality.

Abstract translation: 电子电路装置100被构造成使得通过将由第一树脂片制成的基板模块与嵌入其中的电子部件（190）组成的基板模块单元插入到包括连接端子（120）的壳体（150）中，控制 电路（130）和第一布线图案（140），其中基板模块彼此电连接和机械连接。 该电子电路装置（100）分配母基板。 此外，通过减少衬底模块，可以将具有大量衬底模块的衬底模块单元堆叠在有限的封装空间中，从而安装更大的存储容量和更高的功能。

公开(公告)号：US07762819B2

公开(公告)日：2010-07-27

申请号：US11918121

申请日：2006-07-06

Applicant: Masato Mori ,  Yoshihiko Yagi ,  Masahiro Ono ,  Yoshihiro Tomura ,  Kunio Hibino ,  Yasushi Nakagiri ,  Akihiro Miyashita ,  Kunio Sakurai

Inventor： Masato Mori ,  Yoshihiko Yagi ,  Masahiro Ono ,  Yoshihiro Tomura ,  Kunio Hibino ,  Yasushi Nakagiri ,  Akihiro Miyashita ,  Kunio Sakurai

IPC: H01R12/00

CPC classification number: H05K3/368 ,  H05K1/0271 ,  H05K1/144 ,  H05K1/145 ,  H05K2201/042 ,  H05K2201/09036 ,  H05K2201/09163 ,  H05K2201/2018

Abstract: A substrate connecting member connects two circuit boards connected together while maintaining high reliability of the junctions between itself and the circuit boards even if the circuit boards are warped by temperature change of an impact load. The substrate connecting member includes a frame member made of an insulating resin; slit grooves formed in at least one of the inner and outer surfaces of frame side portions composing the frame member, the slit grooves being formed throughout the entire length of the frame side portions in the direction perpendicular to the thickness direction of the frame side portions; and connection conductor portions having connection terminals provided on the top and bottom surfaces, respectively, of the frame side portions in the thickness direction and connecting conductors each connecting connection terminals.

Abstract translation: 衬底连接构件连接两个连接在一起的电路板，同时保持其自身和电路板之间的接合部的高可靠性，即使电路板由于冲击负载的温度变化而翘曲。 基板连接构件包括由绝缘树脂制成的框架构件; 狭缝槽形成在构成框架构件的框架侧部的至少一个内表面和外表面中，狭缝槽沿与框架侧部的厚度方向垂直的方向在框架侧部分的整个长度上形成; 以及连接导体部分，其具有分别设置在厚度方向上的框架侧部分的顶表面和底表面上的连接端子和连接连接端子的连接导体。

公开(公告)号：US20100020497A1

公开(公告)日：2010-01-28

申请号：US12065177

申请日：2006-02-20

Applicant: Haruo Hayakawa ,  Masahiro Ono ,  Seiji Yamaguchi ,  Yoshihiro Uda ,  Kazuhiro Shinchi ,  Satoru Tomekawa ,  Kiyoshi Nakanishi ,  Kosuke Kubota ,  Atsushi Katagiri ,  Motohisa Kotani ,  Kazuhiro Konishi ,  Eiji Nishimura ,  Takeo Matsuki

Inventor： Haruo Hayakawa ,  Masahiro Ono ,  Seiji Yamaguchi ,  Yoshihiro Uda ,  Kazuhiro Shinchi ,  Satoru Tomekawa ,  Kiyoshi Nakanishi ,  Kosuke Kubota ,  Atsushi Katagiri ,  Motohisa Kotani ,  Kazuhiro Konishi ,  Eiji Nishimura ,  Takeo Matsuki

IPC: H05K7/20 ,  H05K7/00

CPC classification number: H05K3/284 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H05K1/0203 ,  H05K1/0218 ,  H05K1/0274 ,  H05K7/20463 ,  H05K9/0047 ,  H05K9/0086 ,  H05K2201/0209 ,  H05K2201/0215 ,  H05K2201/10128 ,  H05K2201/10515 ,  H05K2201/2054 ,  H05K2203/1316 ,  H05K2203/1322 ,  H01L2224/0401

Abstract: It is intended to provide a substrate structure ensuring a shielding property and a heat discharge property of a resin part that collectively covers a plurality of electronic components and capable of downsizing, thinning, and a reduction in number of components. The substrate structure 20 of the first embodiment is provided with a substrate 21, a plurality of electronic components 22 mounted along the substrate 21, and a resin part 25 that covers the electronic components 22 and is in close contact with the substrate 21. In the substrate structure 20, the resin part 25 is provided with a reinforcing heat discharge layer 26 covering the electronic components 22 and having a heat conductivity and a reinforcing property and a shield layer 27 covering the reinforcing heat discharge layer 26, and a surface o28 of the shield layer 27 is formed into a predetermined shape corresponding to a surface structure of the display device 30 adjacent to the resin part 25.

Abstract translation: 旨在提供确保共同覆盖多个电子部件并能够减小，减薄和减少部件数量的树脂部件的屏蔽性和散热性的基板结构。 第一实施例的基板结构20设置有基板21，沿着基板21安装的多个电子部件22和覆盖电子部件22并与基板21紧密接触的树脂部25。 基板结构体20中，树脂部25设置有覆盖电子部件22并具有导热性和增强性的加强放热层26和覆盖加强放热层26的屏蔽层27以及覆盖加强放热层26的表面o28 屏蔽层27形成为与显示装置30的与树脂部25相邻的表面结构对应的规定形状。

公开(公告)号：US20100003191A1

公开(公告)日：2010-01-07

申请号：US12517159

申请日：2007-10-26

Applicant: Masahiro Ono

Inventor： Masahiro Ono

IPC: A61K51/04 ,  C07D307/77

CPC classification number: C07D307/83 ,  A61K51/0419 ,  C07D209/36

Abstract: The present invention provides a composition for diagnosing amyloid-related diseases, comprising a compound represented by general formula (I): wherein X represents O or the like; R1, R3, R4, R5, R6, R8 and R9 represent a hydrogen atom or the like; R2 represents a halogen atom or the like; and R7 represents a dimethylamino group or the like; or the compound labeled with a radionuclide, or a pharmaceutically acceptable salt of the compound or the labeled compound. The compound represented by general formula (I) has all of the following properties: high binding specificity to amyloid β protein, high permeability through the blood-brain barrier, and rapid clearance from sites without senile plaques in the brain.

Abstract translation: 本发明提供了一种用于诊断淀粉样蛋白相关疾病的组合物，其包含由通式（I）表示的化合物：其中X表示O等; R1，R3，R4，R5，R6，R8和R9表示氢原子等; R2表示卤素原子等; 并且R 7表示二甲基氨基等; 或用放射性核素标记的化合物或化合物或标记化合物的药学上可接受的盐。 由通式（I）表示的化合物具有以下特性：对淀粉样β蛋白的高结合特异性，通过血脑屏障的高通透性，以及在脑中没有老年斑的位置的快速清除。

公开(公告)号：US07613010B2

公开(公告)日：2009-11-03

申请号：US10985325

申请日：2004-11-10

Applicant: Masahiro Ono ,  Shigeru Kondo ,  Kazuhiro Nishikawa ,  Yoshihiko Yagi ,  Kazuto Nishida

Inventor： Masahiro Ono ,  Shigeru Kondo ,  Kazuhiro Nishikawa ,  Yoshihiko Yagi ,  Kazuto Nishida

IPC: H05K1/11

CPC classification number: H05K1/183 ,  H01L23/5385 ,  H01L25/0652 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/06572 ,  H01L2924/09701 ,  H01L2924/15156 ,  H01L2924/15192 ,  H01L2924/1627 ,  H01L2924/181 ,  H01L2924/3025 ,  H05K1/0284 ,  H05K1/141 ,  H05K1/144 ,  H05K1/145 ,  H05K3/3442 ,  H05K3/368 ,  H05K3/403 ,  H05K2201/09036 ,  H05K2201/10446 ,  H05K2201/10636 ,  H05K2201/10674 ,  H05K2203/1572 ,  Y02P70/611 ,  H01L2924/00012

Abstract: A stereoscopically connected structure is made up of a first circuit board and a second circuit board which are mounted with other electronic components, and a relay board having a recess which is mounted with an electronic component and is provided with a lead-out wiring extending from the electronic component, and also having a land part to be connected with the lead-out wiring on one of the surfaces of the relay board that face the first circuit board and second circuit board. Thus the relay board can mount the electronic component thereon as well as connect the first circuit board and the second circuit board, thereby achieving high density mounting.

Abstract translation: 立体连接的结构由安装有其他电子部件的第一电路板和第二电路板构成，以及具有安装有电子部件的凹部的中继板，并且设置有从 电子部件，并且还具有与继电器板的面对第一电路板和第二电路板的一个表面上的引出布线连接的焊盘部分。 因此，继电器板可以在其上安装电子部件，并且连接第一电路板和第二电路板，从而实现高密度安装。

公开(公告)号：US20090269946A1

公开(公告)日：2009-10-29

申请号：US12421518

申请日：2009-04-09

Applicant: Masahiro Ono ,  Masayuki Okamoto

Inventor： Masahiro Ono ,  Masayuki Okamoto

IPC: H01R12/00

CPC classification number: H01R13/025 ,  H01R12/79 ,  H01R12/88

Abstract: A connector to be surface mounted on a wiring board has a base having an opening to be inserted with a tip portion of a flexible printed circuit board at a front surface, and having a plurality of insertion holes passing from the front surface to a rear surface juxtaposed at a predetermined pitch, a connection terminal arranged in a projecting manner with a substantially T-shaped operating piece having at one end a movable contacting point that comes into pressure contact with joints juxtaposed at the tip portion of the flexible printed circuit board, the connection terminal having one end that becomes a fixed contacting point inserted to the insertion hole from the rear surface side, and an operating lever in which a cam portion is fitted into a turning recessed portion arranged at an upper side of the connection terminal to act as a turning supporting point, the cam portion driving an operation receiving portion positioned at the other end of the operating piece. A position regulation contacting portion that contacts a position regulating portion arranged at the upper side of the connection terminal when the operating lever is turned and a locking operation is completed is arranged at a lower surface of the operating lever.

Abstract translation: 要表面安装在布线板上的连接器具有基部，该基部具有在前表面插入柔性印刷电路板的前端部的开口，并且具有从前表面到后表面的多个插入孔 以预定间距并列设置的连接端子，其以大致T形的操作件突出地布置，其一端具有与柔性印刷电路板的尖端部分处并列的接头压力接触的可动接触点， 连接端子，其一端成为从后表面侧插入到插入孔中的固定接触点;以及操作杆，其中凸轮部分配合到布置在连接端子的上侧的转向凹部中，以用作 转动支撑点，所述凸轮部分驱动位于所述操作件的另一端的操作接收部。 当操作杆转动并且锁定操作完成时，位置调节接触部分接触位于连接端子上侧的位置限制部分，并设置在操作杆的下表面。

公开(公告)号：US20080102701A1

公开(公告)日：2008-05-01

申请号：US11719035

申请日：2005-11-22

Applicant: Hiroyuki Suzuki ,  Kiyoshi Nakanishi ,  Ken Muramatsu ,  Tooru Saitou ,  Noriaki Amano ,  Masahiro Ono ,  Shigeru Kondou

Inventor： Hiroyuki Suzuki ,  Kiyoshi Nakanishi ,  Ken Muramatsu ,  Tooru Saitou ,  Noriaki Amano ,  Masahiro Ono ,  Shigeru Kondou

IPC: H01R13/648 ,  H05K1/11

CPC classification number: H01R13/658 ,  H01L23/552 ,  H01L2924/0002 ,  H01L2924/16195 ,  H01R12/52 ,  H01L2924/00

Abstract: A first printed board on which a ground pattern is provided and an electronic part is mounted and a second printed board on which a ground pattern is provided and an electronic part is mounted are oppositely arranged, and circuits of the first printed board and the second printed board are connected by a connector with a frame-like shield. In the connector with a shield, a frame body is formed of an insulator such as a resin, a connection terminal is provided inside the frame body, and a conductor is provided on the entire outer periphery of the frame body. In the conductor, the shield is formed by both the ground pattern of the first printed board and the ground pattern of the second printed board. The frame body shields the electronic parts.

Abstract translation: 设有接地图案的第一印刷电路板和安装有电子部件的第一印刷电路板和设置有接地图案并且安装有电子部件的第二印刷电路板相对布置，并且第一印刷电路板和第二印刷电路 板由具有框架状屏蔽的连接器连接。 在具有屏蔽的连接器中，框架体由诸如树脂的绝缘体形成，在框体内部设置有连接端子，并且在框体的整个外周设有导体。 在导体中，屏蔽由第一印刷电路板的接地图案和第二印刷电路板的接地图案形成。 框架体屏蔽电子部件。