Abstract:
Apparatus, reactors, and methods for heating substrates are disclosed. The apparatus comprises a stage comprising a body and a surface having an area to support a substrate, a shaft coupled to the stage, a first heating element disposed within a central region of the body of the stage, and at least second and third heating elements disposed within the body of the stage, the at least second and third heating elements each partially surrounding the first heating element and wherein the at least second and third heating elements are circumferentially adjacent to each other.
Abstract:
In a first aspect, a method is provided for adjusting tension of a belt of a semiconductor device manufacturing tool. The first method includes (1) coupling an elastic element between a pulley coupled to the belt and a fixed surface of the semiconductor device manufacturing tool; and (2) compressing or decompressing the elastic element so as to adjust at least one of a height and a tilt of the pulley and a tension of the belt coupled to the pulley. Numerous other aspects are provided.
Abstract:
Aspects of the invention include a method and apparatus for processing a substrate using a multi-chamber processing system (e.g., a cluster tool) adapted to process substrates in one or more batch and/or single substrate processing chambers to increase the system throughput. In one embodiment, a system is configured to perform a substrate processing sequence that contains batch processing chambers only, or batch and single substrate processing chambers, to optimize throughput and minimize processing defects due to exposure to a contaminating environment. In one embodiment, a batch processing chamber is used to increase the system throughput by performing a process recipe step that is disproportionately long compared to other process recipe steps in the substrate processing sequence that are performed on the cluster tool. In another embodiment, two or more batch chambers are used to process multiple substrates using one or more of the disproportionately long processing steps in a processing sequence. Aspects of the invention also include an apparatus and method for delivering a precursor to a processing chamber so that a repeatable ALD or CVD deposition process can be performed.
Abstract:
A gas valve for pulsing a gas comprises a housing having an inlet port, an outlet port, a membrane, and an actuator, wherein the actuator selectively engages the membrane with the inlet port. In one embodiment, a plurality of the gas valves are coupled together to form an apparatus for synchronized pulsing of a plurality of individual gases.
Abstract:
A lid for a semiconductor device processing apparatus is provided. The lid includes a cover having an opening and may include (1) a wall formed around the opening, the wall adapted to prevent fluid present on the lid from entering a body of the processing apparatus through the opening; (2) an outer door adapted to prevent fluid from entering the body of the processing apparatus through the opening of the cover; (3) an inner door coupled to the outer door and adapted to prevent fluid from exiting the body of the processing apparatus through the opening of the cover; and/or (4) a rinsing mechanism adapted to rinse a top surface of the cover. Numerous other aspects are provided.
Abstract:
Embodiments of the invention are generally directed to a cyclical layer deposition system, which includes a processing chamber, at least one load lock chamber connected to the processing chamber, a plurality of gas ports disposed on the processing chamber. The gas ports are configured to transmit one or more gas streams into the processing chamber. The system further includes a plurality of vacuum ports disposed on the processing chamber between the gas ports. The vacuum ports are configured to transmit the gas streams out of the processing chamber.
Abstract:
The invention provides a removable first edge ring configured for pin and recess/slot coupling with a second edge ring disposed on the substrate support. In one embodiment, a first edge ring includes a plurality of pins, and a second edge ring includes one or more alignment recesses and one or more alignment slots for mating engagement with the pins. Each of the alignment recesses and alignment slots are at least as wide as the corresponding pins, and each of the alignment slots extends in the radial direction a length that is sufficient to compensate for the difference in thermal expansion between the first edge ring and the second edge ring.
Abstract:
A substrate support assembly for supporting a substrate during processing is provided. In one embodiment, a support assembly includes a support plate supported by a second plate. The support plate has a first side and a second side. The second side of the support has a recess formed therein. The second plate includes a boss extending from the second plate which mates with the recess of the support plate. Other embodiments include a flange that extends from the support plate that supports a shadow ring and a plurality of sleeves extending from the support plate for guiding lift pins.
Abstract:
Provided herewith is a chamber for depositing a film on a substrate comprising a process compartment; a purge compartment, a purge ring located on the chamber body to separate the two compartments, a heater, and a shadow ring covering the periphery of the substrate. Alternatively, the chamber may further comprise a shield interconnected with the shadow ring. Still provided is a method for depositing a film of uniformity on a substrate in such a chamber. The method comprises the steps of positioning the substrate in a process compartment; flowing a process gas into the process compartment; flowing a purge gas in a purge compartment; and exhausting the process and purge gas from the chamber, thereby depositing a film of uniformity on the substrate.
Abstract:
A fastening device which prevents rotational and vertical displacement of a purge ring caused by purge gas exiting the purge ring or caused by other processing conditions. The fastening device comprises a clamp which releasably holds the purge ring together with the wafer support. A pin is inserted into a bore through the purge ring, wafer support and the clamp to releasably secure the clamp in place. Slots may be formed in the purge ring to guide placement of the clamp.