Method for controlling the amount of trim of a gate structure of a field effect transistor
    62.
    发明授权
    Method for controlling the amount of trim of a gate structure of a field effect transistor 失效
    用于控制场效应晶体管的栅极结构的微调量的方法

    公开(公告)号:US06448165B1

    公开(公告)日:2002-09-10

    申请号:US09746397

    申请日:2000-12-21

    申请人: Bin Yu Haihong Wang

    发明人: Bin Yu Haihong Wang

    IPC分类号: H01L213205

    摘要: For fabricating a field effect transistor within an active device area of a semiconductor substrate, a layer of gate dielectric material is deposited on the semiconductor substrate. A layer of gate electrode material is deposited on the layer of gate dielectric material, and the gate electrode material is a semiconductor material. At least one of an N-type dopant or a P-type dopant or a neutral dopant is implanted into the layer of gate electrode material such that the at least one of an N-type dopant or a P-type dopant or a neutral dopant has a dopant concentration in the layer of gate electrode material. A layer of photo-resist material, a layer of BARC (bottom anti-reflective coating) material, and the layer of gate electrode material are patterned to form a gate structure of the field effect transistor. The gate structure is comprised of the remaining gate electrode material, and the BARC (bottom anti-reflective coating) material remains on the gate structure. The BARC (bottom anti-reflective coating) material is then stripped from the gate structure using an etching reactant that etches both of the BARC (bottom anti-reflective coating) material and the gate electrode material. An etch rate of the gate electrode material in the etching reactant increases with an increase of the dopant concentration of the at least one of an N-type dopant or a P-type dopant or a neutral dopant within the gate electrode material. Sidewalls of the gate structure are trimmed by a trim length during the step of stripping the BARC (bottom anti-reflective coating) material from the gate structure. Thus, the dopant concentration of the at least one of an N-type dopant or a P-type dopant or a neutral dopant in the gate electrode material is adjusted to control the trim length of the gate structure.

    摘要翻译: 为了在半导体衬底的有源器件区域内制造场效应晶体管,在半导体衬底上沉积一层栅介质材料。 栅极材料层沉积在栅极介电材料层上,栅电极材料是半导体材料。 N型掺杂剂或P型掺杂剂或中性掺杂剂中的至少一种注入到栅电极材料层中,使得N型掺杂剂或P型掺杂剂或中性掺杂剂中的至少一种 在栅极材料层中具有掺杂剂浓度。 将一层光致抗蚀剂材料,一层BARC(底部抗反射涂层)材料和该栅极电极材料层图案化以形成该场效应晶体管的栅极结构。 栅极结构由剩余的栅电极材料组成,并且BARC(底部抗反射涂层)材料保留在栅极结构上。 然后使用蚀刻BARC(底部抗反射涂层)材料和栅电极材料的蚀刻反应物,从栅极结构剥离BARC(底部抗反射涂层)材料。 蚀刻反应物中的栅电极材料的蚀刻速率随着栅极电极材料中的N型掺杂剂或P型掺杂剂或中性掺杂剂中的至少一种的掺杂剂浓度的增加而增加。 在从栅极结构剥离BARC(底部抗反射涂层)材料的步骤期间,栅极结构的侧壁被修剪长度。 因此,调整栅电极材料中的N型掺杂剂或P型掺杂剂或中性掺杂剂中的至少一种的掺杂剂浓度以控制栅极结构的修整长度。

    System and method for highly reliable data replication
    63.
    发明授权
    System and method for highly reliable data replication 有权
    用于高度可靠数据复制的系统和方法

    公开(公告)号:US08209283B1

    公开(公告)日:2012-06-26

    申请号:US12378819

    申请日:2009-02-19

    申请人: Haihong Wang

    发明人: Haihong Wang

    IPC分类号: G06F17/30

    摘要: Data replication includes generating replication data that is part of a replicated file system to be sent over a communication channel to a destination replication device; adding additional verification information to at least a portion of the replication data to prevent data corruption; and sending the replication data and the additional verification information over the communication channel to the destination replication device. The replication data with additional verification information is sent over the communication channel using a reliable protocol that allows the replication data to be verified by the reliable protocol at the destination replication device. The reliable protocol is a protocol capable of detecting most but not all data corruption introduced by the communication channel. The additional verification information includes information for verifying that replication data sent using the reliable protocol does not include data corruption that was introduced by the communication channel and undetected by the reliable protocol.

    摘要翻译: 数据复制包括生成作为通过通信通道发送到目标复制设备的复制文件系统的一部分的复制数据; 向至少一部分复制数据添加其他验证信息,以防止数据损坏; 以及通过所述通信信道将所述复制数据和所述附加验证信息发送到所述目的地复制设备。 具有附加验证信息的复制数据通过通信通道使用可靠协议来发送,该协议允许复制数据由目的地复制设备上的可靠协议进行验证。 可靠的协议是能够检测通信信道引入的大多数但不是全部数据损坏的协议。 附加验证信息包括用于验证使用可靠协议发送的复制数据不包括由通信信道引入且不被可靠协议所检测到的数据损坏的信息。

    Fully silicided gate structure for FinFET devices
    64.
    发明授权
    Fully silicided gate structure for FinFET devices 有权
    FinFET器件的全硅化栅极结构

    公开(公告)号:US08008136B2

    公开(公告)日:2011-08-30

    申请号:US11379435

    申请日:2006-04-20

    IPC分类号: H01L21/00 H01L21/84

    摘要: A method may include forming a gate electrode over a fin structure, depositing a first metal layer on a top surface of the gate electrode, performing a first silicide process to convert a portion of the gate electrode into a metal-silicide compound, depositing a second metal layer on a top surface of the metal-silicide compound, and performing a second silicide process to form a fully-silicided gate electrode.

    摘要翻译: 一种方法可以包括在鳍结构上形成栅电极,在栅电极的顶表面上沉积第一金属层,执行第一硅化工艺以将栅电极的一部分转化为金属硅化物, 在金属硅化物化合物的顶表面上的金属层,并且执行第二硅化物处理以形成全硅化物栅电极。

    Reversed T-shaped finfet
    65.
    发明授权
    Reversed T-shaped finfet 失效
    反转T形finfet

    公开(公告)号:US07541267B1

    公开(公告)日:2009-06-02

    申请号:US11765611

    申请日:2007-06-20

    IPC分类号: H01L21/28

    摘要: A method includes forming a first rectangular mesa from a layer of semiconducting material and forming a first dielectric layer around the first mesa. The method further includes forming a first rectangular mask over a first portion of the first mesa leaving an exposed second portion of the first mesa and etching the exposed second portion of the first mesa to produce a reversed T-shaped fin from the first mesa.

    摘要翻译: 一种方法包括从半导体材料层形成第一矩形台面并在第一台面周围形成第一介电层。 该方法还包括在第一台面的第一部分上形成第一矩形掩模,离开第一台面的暴露的第二部分并蚀刻第一台面的暴露的第二部分以从第一台面产生反向的T形翅片。

    Tri-gate and gate around MOSFET devices and methods for making same
    67.
    发明授权
    Tri-gate and gate around MOSFET devices and methods for making same 有权
    围绕MOSFET器件的三栅极和栅极及其制造方法

    公开(公告)号:US07259425B2

    公开(公告)日:2007-08-21

    申请号:US10348911

    申请日:2003-01-23

    IPC分类号: H01L29/72

    摘要: A triple gate metal-oxide semiconductor field-effect transistor (MOSFET) includes a fin structure, a first gate formed adjacent a first side of the fin structure, a second gate formed adjacent a second side of the fin structure opposite the first side, and a top gate formed on top of the fin structure. A gate around MOSFET includes multiple fins, a first sidewall gate structure formed adjacent one of the fins, a second sidewall gate structure formed adjacent another one of the fins, a top gate structure formed on one or more of the fins, and a bottom gate structure formed under one or more of the fins.

    摘要翻译: 三栅极金属氧化物半导体场效应晶体管(MOSFET)包括翅片结构,邻近翅片结构的第一侧形成的第一栅极,与第一侧相对的翅片结构的第二侧附近形成的第二栅极,以及 形成在鳍结构顶部的顶门。 MOSFET周围的栅极包括多个散热片,邻近其中一个翅片形成的第一侧壁栅极结构,邻近另一个鳍片形成的第二侧壁栅极结构,形成在一个或多个翅片上的顶部栅极结构,以及底部栅极 在一个或多个翅片下形成的结构。

    Double gate semiconductor device having a metal gate
    68.
    发明授权
    Double gate semiconductor device having a metal gate 有权
    具有金属栅极的双栅极半导体器件

    公开(公告)号:US07256455B2

    公开(公告)日:2007-08-14

    申请号:US10720166

    申请日:2003-11-25

    摘要: A semiconductor device may include a substrate, an insulating layer formed on the substrate and a conductive fin formed on the insulating layer. The conductive fin may include a number of side surfaces and a top surface. The semiconductor device may also include a source region formed on the insulating layer adjacent a first end of the conductive fin and a drain region formed on the insulating layer adjacent a second end of the conductive fin. The semiconductor device may further include a metal gate formed on the insulating layer adjacent the conductive fin in a channel region of the semiconductor device.

    摘要翻译: 半导体器件可以包括衬底,形成在衬底上的绝缘层和形成在绝缘层上的导电鳍。 导电翅片可以包括多个侧表面和顶表面。 半导体器件还可以包括形成在与导电鳍片的第一端相邻的绝缘层上的源极区域和形成在与导电鳍片的第二端相邻的绝缘层上的漏极区域。 半导体器件还可以包括在半导体器件的沟道区域中形成在与绝缘层相邻的导电鳍片上的金属栅极。

    Narrow-body damascene tri-gate FinFET
    69.
    发明授权
    Narrow-body damascene tri-gate FinFET 有权
    窄体镶嵌三栅极FinFET

    公开(公告)号:US07186599B2

    公开(公告)日:2007-03-06

    申请号:US10754540

    申请日:2004-01-12

    IPC分类号: H01L21/00 H01L21/84

    摘要: A method of forming a fin field effect transistor includes forming a fin and forming a source region on a first end of the fin and a drain region on a second end of the fin. The method further includes forming a dummy gate with a first semi-conducting material in a first pattern over the fin and forming a dielectric layer around the dummy gate. The method also includes removing the first semi-conducting material to leave a trench in the dielectric layer corresponding to the first pattern, thinning a portion of the fin exposed within the trench, and forming a metal gate within the trench.

    摘要翻译: 形成鳍状场效应晶体管的方法包括:在鳍片的第一端上形成翅片并形成源极区域,在鳍片的第二端部形成漏极区域。 该方法还包括在鳍上形成具有第一图案的第一半导体材料的虚拟栅极,并在虚拟栅极周围形成介电层。 该方法还包括去除第一半导体材料以在对应于第一图案的电介质层中留下沟槽,使在沟槽内暴露的鳍片的一部分变薄,并在沟槽内形成金属栅极。

    Germanium MOSFET devices and methods for making same
    70.
    发明授权
    Germanium MOSFET devices and methods for making same 有权
    锗MOSFET器件及其制造方法

    公开(公告)号:US07148526B1

    公开(公告)日:2006-12-12

    申请号:US10348758

    申请日:2003-01-23

    IPC分类号: H01L29/72

    摘要: A double gate germanium metal-oxide semiconductor field-effect transistor (MOSFET) includes a germanium fin, a first gate formed adjacent a first side of the germanium fin, and a second gate formed adjacent a second side of the germanium fin opposite the first side. A triple gate MOSFET includes a germanium fin, a first gate formed adjacent a first side of the germanium fin, a second gate formed adjacent a second side of the germanium fin opposite the first side, and a top gate formed on top of the germanium fin. An all-around gate MOSFET includes a germanium fin, a first sidewall gate structure formed adjacent a first side of the germanium fin, a second sidewall gate structure formed adjacent a second side of the germanium fin, and additional gate structures formed on and around the germanium fin.

    摘要翻译: 双栅极锗金属氧化物半导体场效应晶体管(MOSFET)包括锗翅片,邻近锗翅片的第一侧形成的第一栅极和与第一侧相对的锗翅片第二侧附近形成的第二栅极 。 三栅极MOSFET包括锗翅片,与锗翅片的第一侧相邻形成的第一栅极,与第一侧相对的锗翅片的第二侧附近形成的第二栅极和形成在锗翅片顶部上的顶栅极 。 全栅极MOSFET包括锗翅片,邻近锗翅片的第一侧形成的第一侧壁栅极结构,邻近锗翅片的第二侧形成的第二侧壁栅极结构,以及形成在锗翅片上和周围的附近的栅极结构 锗鳍