Invention Grant
- Patent Title: Double gate semiconductor device having a metal gate
- Patent Title (中): 具有金属栅极的双栅极半导体器件
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Application No.: US10720166Application Date: 2003-11-25
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Publication No.: US07256455B2Publication Date: 2007-08-14
- Inventor: Shibly S. Ahmed , Haihong Wang , Bin Yu
- Applicant: Shibly S. Ahmed , Haihong Wang , Bin Yu
- Applicant Address: US CA Sunnyvale
- Assignee: Advanced Micro Devices, Inc.
- Current Assignee: Advanced Micro Devices, Inc.
- Current Assignee Address: US CA Sunnyvale
- Agency: Harrity Snyder LLP
- Main IPC: H01L27/12
- IPC: H01L27/12 ; H01L29/786 ; H01L29/76

Abstract:
A semiconductor device may include a substrate, an insulating layer formed on the substrate and a conductive fin formed on the insulating layer. The conductive fin may include a number of side surfaces and a top surface. The semiconductor device may also include a source region formed on the insulating layer adjacent a first end of the conductive fin and a drain region formed on the insulating layer adjacent a second end of the conductive fin. The semiconductor device may further include a metal gate formed on the insulating layer adjacent the conductive fin in a channel region of the semiconductor device.
Public/Granted literature
- US20040110097A1 Double gate semiconductor device having a metal gate Public/Granted day:2004-06-10
Information query
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