公开(公告)号：US09793103B2

公开(公告)日：2017-10-17

申请号：US13915176

申请日：2013-06-11

申请人： LG CHEM, LTD.

发明人： Hyun Jee Yoo ,  Dong Han Kho ,  Jang Soon Kim ,  Hyo Soon Park ,  Jong Wan Hong ,  Hyo Sook Joo

IPC分类号： H01L21/02 ,  C09J5/06 ,  C09J163/00 ,  C09J133/14 ,  C09J133/02 ,  C08K5/13 ,  C08L61/06 ,  C08L61/12 ,  C08L61/20 ,  C08L63/00 ,  C09J133/06 ,  C08L33/06 ,  C08G59/62 ,  H01L21/683 ,  C09J7/02

CPC分类号： H01L21/02002 ,  C08G59/621 ,  C08K5/13 ,  C08L33/066 ,  C08L33/068 ,  C08L61/06 ,  C08L61/12 ,  C08L61/20 ,  C08L63/00 ,  C08L2666/02 ,  C09J5/06 ,  C09J7/20 ,  C09J133/066 ,  C09J133/068 ,  C09J163/00 ,  C09J2201/36 ,  C09J2201/60 ,  C09J2203/326 ,  C09J2433/00 ,  C09J2463/00 ,  H01L21/6836 ,  Y10T428/269 ,  Y10T428/287 ,  Y10T428/2891 ,  Y10T428/31515

摘要： Provided are an epoxy composition, an adhesive film, a dicing die bonding film and a semiconductor device using the same. Specifically, the epoxy composition and a use thereof are provided, wherein the epoxy composition has a gel content of 5˜20%, measured under certain conditions. The epoxy composition according to the present invention, as an adhesive agent, shows excellent elastic properties, when prepared to have a low glass transition temperature, exhibiting good adhesion at high temperature and having minimal occurrence of burrs during processing. According to the present invention, it is therefore possible to prevent defects owing to die cut shift, during a wire bonding or molding process at high temperature, and obtain a highly reliable semiconductor device owing to the excellent adhesiveness and workability of the adhesive agent.

公开(公告)号：US09790399B2

公开(公告)日：2017-10-17

申请号：US14336172

申请日：2014-07-21

申请人： AXALTA COATING SYSTEMS IP CO., LLC

发明人： Leen Tanghe ,  Jozef Huybrechts ,  Ann Vaes

IPC分类号： C09D177/12 ,  C08K5/52 ,  C08K5/13 ,  C09D133/12 ,  C09D167/00 ,  C08G18/62 ,  C09D175/02 ,  C09D175/04 ,  C08G18/38 ,  C08G18/40 ,  C08K5/524

CPC分类号： C09D177/12 ,  C08G18/3821 ,  C08G18/4063 ,  C08G18/6225 ,  C08K5/13 ,  C08K5/52 ,  C08K5/524 ,  C09D133/12 ,  C09D167/00 ,  C09D175/02 ,  C09D175/04 ,  C08L75/02

摘要： A curable clear coat component for use in a two-component clear coat coating composition system is provided. The curable clear coat component comprises A) a polyaspartic acid ester or a hydroxyl functional binder or a combination of both, and B) an antioxidant component comprising B1) a sterically hindered phenol antioxidant, and B2) an organophosphite antioxidant.

公开(公告)号：US20170260333A1

公开(公告)日：2017-09-14

申请号：US15600992

申请日：2017-05-22

申请人： SABIC Global Technologies B.V.

发明人： Robert R. Gallucci ,  James A. Mahood ,  Roy R. Odle ,  Stephen S. Dimond

IPC分类号： C08G73/10 ,  C08K5/13

CPC分类号： C08G73/1071 ,  C08G73/1046 ,  C08G73/1053 ,  C08K5/13 ,  C08L79/08

摘要： This disclosure relates to polyetherimide compositions whose residual phenolic monomers exhibit little or no estradiol binding activity. Also disclosed are methods for making the disclosed polyetherimides and articles of manufacture comprising the disclosed polyetherimides.

公开(公告)号：US09745443B2

公开(公告)日：2017-08-29

申请号：US14708715

申请日：2015-05-11

申请人： TDK CORPORATION

发明人： Yutaka Shimizu ,  Tsuyoshi Sugiyama ,  Hiroshi Shutoh ,  Masaaki Yamashita

IPC分类号： B32B27/38 ,  B32B27/26 ,  B32B27/20 ,  C08G59/50 ,  C08K3/22 ,  C08K5/18 ,  C08K5/13 ,  C08L63/00

CPC分类号： C08K3/22 ,  C08K5/13 ,  C08K5/18 ,  C08K2003/222 ,  C08L63/00

摘要： An inorganic filler-containing epoxy resin cured product contains a magnesium oxide powder and has a maximum thermogravimetric mass loss rate ΔRmax of −0.20 mass percent/° C. or more within a temperature range of 300° C. to 500° C. The filling factor of the magnesium oxide powder in the inorganic filler-containing epoxy resin cured product is 45% to 63% by volume.

公开(公告)号：US20170240768A1

公开(公告)日：2017-08-24

申请号：US15435353

申请日：2017-02-17

申请人： Eastman Chemical Company

发明人： Jamie Sue Dziczkowski ,  Kenneth Douglas Chaffin

IPC分类号： C09D167/02 ,  C09D5/02

CPC分类号： C09D167/02 ,  C08G63/199 ,  C08K5/06 ,  C08K5/13 ,  C08L67/02 ,  C08L2312/04 ,  C08L2666/34 ,  C09D5/022 ,  C09D5/027 ,  C09D167/00 ,  C08L67/00

摘要： The present invention provides emulsions comprising curable polyesters and certain surfactants. The emulsions are useful as coatings binders in waterborne thermosetting coating compositions and can be used in conjunction with cross-linking compounds reactive with curable polyesters. Also provided are shaped or formed articles coated with the waterborne thermosetting coating compositions of the invention.

公开(公告)号：US20170240713A1

公开(公告)日：2017-08-24

申请号：US15589362

申请日：2017-05-08

申请人： KURARAY CO., LTD.

发明人： Koichiro ISOUE ,  Yoshiaki ASANUMA

IPC分类号： C08J5/18 ,  H01L31/048 ,  B32B17/10 ,  C08K5/103 ,  C08K5/11

CPC分类号： C08J5/18 ,  B32B17/10036 ,  B32B17/10605 ,  B32B17/10678 ,  B32B17/10688 ,  B32B17/10761 ,  B32B17/10871 ,  B32B2307/202 ,  B32B2307/412 ,  C08F6/26 ,  C08F16/38 ,  C08J2329/14 ,  C08K5/10 ,  C08K5/103 ,  C08K5/11 ,  C08K5/13 ,  C08L29/14 ,  H01L31/0481 ,  Y02E10/50

摘要： Provided is a polyvinyl acetal film which, when used as an intermediate film for a laminated glass, can provide a laminated glass that exhibits a low degree of yellowness and excellent surface appearance, and which is thus useful as a sealing material or intermediate film that can prolong the life of a laminated glass provided with a solar cell or a functional unit. Further, the content of corrosion-causing substance in the polyvinyl acetal film is low, so that the polyvinyl acetal film permits high-temperature lamination and thus ensures excellent productivity. Also provided are a solar cell module and a laminated glass prepared using the polyvinyl acetal film. A plasticized polyvinyl acetal film which comprises 15 to 60 parts by mass of a plasticizer having a total number of 28 or more of carbon atoms and oxygen atoms constituting a molecule based on 100 parts by mass of a polyvinyl acetal resin, and which has an acid value of 5.0 meq/kg or less.

公开(公告)号：US09738817B2

公开(公告)日：2017-08-22

申请号：US14433901

申请日：2013-10-10

申请人： Avery Dennison Corporation

发明人： Michael Zajaczkowski ,  Michael T. Waterman ,  Kyle R. Heimbach ,  Eric L. Bartholomew ,  Brandon S. Miller

IPC分类号： C08F2/50 ,  C08F2/46 ,  C08G61/04 ,  C09J7/02 ,  C09J4/06 ,  C09J123/02 ,  C09J133/00 ,  C08L23/02 ,  C08L33/00 ,  C09J133/08 ,  C09J4/00 ,  C08K5/13 ,  C08K5/3442 ,  C09J133/14 ,  C09J5/06

CPC分类号： C09J7/38 ,  C08F2222/1013 ,  C08F2222/102 ,  C08F2222/1026 ,  C08K5/13 ,  C08K5/3442 ,  C08L23/02 ,  C08L33/00 ,  C09J4/00 ,  C09J4/06 ,  C09J5/06 ,  C09J7/26 ,  C09J123/02 ,  C09J133/00 ,  C09J133/064 ,  C09J133/08 ,  C09J133/14 ,  C09J2205/114 ,  C09J2205/31 ,  C09J2400/243 ,  C09J2433/00 ,  C09J2453/00 ,  C08F2220/1858 ,  C08F218/08 ,  C08F220/06 ,  C08F2230/085 ,  C08F265/06

摘要： Cure in place pressure sensitive adhesive compositions are described that comprise one or more of a bodying component, a structural diluent, a radical diluent as well as additives such as crosslinkers, external catalysts, photoinitiators and stabilizers/process aids. The bodying component can be acrylic or non-acrylic.

公开(公告)号：US20170232719A1

公开(公告)日：2017-08-17

申请号：US15474105

申请日：2017-03-30

申请人： SOLUTIA INC.

发明人： JUN LU

IPC分类号： B32B27/22 ,  B32B27/08 ,  B32B27/30 ,  C08K5/12 ,  C08L29/14 ,  C08J5/18 ,  C08K5/101 ,  B32B7/02 ,  C08K5/00

CPC分类号： B32B27/22 ,  B32B7/02 ,  B32B17/10036 ,  B32B17/1055 ,  B32B17/10605 ,  B32B17/10761 ,  B32B27/08 ,  B32B27/30 ,  B32B27/306 ,  B32B27/42 ,  B32B2250/02 ,  B32B2250/03 ,  B32B2250/246 ,  B32B2307/412 ,  B32B2307/418 ,  B32B2307/546 ,  B32B2307/558 ,  B32B2307/56 ,  B32B2329/06 ,  B32B2419/00 ,  B32B2457/12 ,  B32B2605/08 ,  B32B2605/18 ,  C08J5/18 ,  C08J2329/14 ,  C08K5/0016 ,  C08K5/101 ,  C08K5/11 ,  C08K5/12 ,  C08K5/13 ,  C08L29/04 ,  C08L29/14 ,  C08L2205/02 ,  C08L2205/025 ,  Y10T428/24983

摘要： An interlayer comprised of a blend of thermoplastic resins and at least one high refractive index having improved acoustic and optical quality is disclosed. The use of a blend thermoplastic resins and a high refractive index plasticizer improves transparency and acoustic properties without sacrificing other characteristics of the interlayer.

公开(公告)号：US20170226238A1

公开(公告)日：2017-08-10

申请号：US15500941

申请日：2015-09-11

申请人： ExxonMobil Chemical Patents Inc.

发明人： Leming Gu ,  Stephen T. Dalpe ,  Mauritz Kelchtermans ,  Sunny Jacob ,  John A. Clark ,  Michael F. McDonald ,  Torri L. Rose

IPC分类号： C08F8/22

CPC分类号： C08F8/22 ,  C08F2810/50 ,  C08K5/13 ,  C08K5/134 ,  C08K5/3435 ,  C08F210/12 ,  C08F210/10 ,  C08F236/08 ,  C08L23/28

摘要： This invention relates to a method of preparing a brominated elastomer having a stabilized Mooney viscosity. The method includes polymerizing isomonoolefins and at least one polymerizable unit to obtain an elastomer/polymer; brominating the elastomer/polymer to form a brominated elastomer effluent; neutralizing the brominated elastomer effluent to form a neutralized effluent; volatizing off the hydrocarbon solvent; and recovering a brominated elastomer. In at least one point of the process, preferably prior to any significant temperature change in the brominated polymer, a Mooney stabilizer is added into the system. Portions of the Mooney stabilizer may be added at multiple points into the process.

公开(公告)号：US20170210964A1

公开(公告)日：2017-07-27

申请号：US15329566

申请日：2015-07-22

申请人： SHIN-ETSU CHEMICAL CO., LTD.

发明人： Takanori ITO ,  Akihiro ENDO ,  Yasuhisa ISHIHARA

IPC分类号： C09K5/14 ,  C08K3/24 ,  C08G77/50 ,  C08K3/22

CPC分类号： C09K5/14 ,  C08G77/50 ,  C08K3/22 ,  C08K3/24 ,  C08K5/13 ,  C08K2003/2227 ,  C08K2201/001 ,  C08L83/04

摘要： Provided are: a thermally conductive silicone composition which, while having low hardness, exhibits excellent re-workability and excellent long-term stability; and a thermally conductive silicone moulded article obtained by moulding said composition into a sheet shape. The thermally conductive silicone composition includes: an organopolysiloxane (a) which has, in at least molecular side chains, alkenyl groups bonded to silicon atoms, and in which the number of alkenyl groups in molecular side chains is 2-9; an organohydrogenpolysiloxane (b) in which at least both terminals are closed by hydrogen atoms directly bonded to silicon atoms; a thermally conductive filler (c); a platinum group metal-based curing catalyst (d); and an organic antioxidant and/or an inorganic antioxidant as an antioxidant (e). When (L) represents the average number of siloxane bonds in component (a) between silicon atoms having, directly bonded thereto, alkenyl groups in molecular side chains, and (L′) represents the average polymerization degree of component (b), L′/L=0.6-2.3 is satisfied.