-
公开(公告)号:US11011210B2
公开(公告)日:2021-05-18
申请号:US16592734
申请日:2019-10-03
Applicant: UNITED MICROELECTRONICS CORP.
Inventor: Po-Kai Hsu , Hung-Yueh Chen , Kun-I Chou , Jing-Yin Jhang , Hui-Lin Wang , Yu-Ping Wang
Abstract: A memory layout structure, which is provided with multiple source lines between active areas, each source line has multiple branches electrically connecting with the active areas at opposite sides in alternating arrangement. Multiple word lines traverse through the active areas to form transistors. Multiple storage units are disposed between the word lines on the active areas in staggered array arrangement, and multiple bit lines electrically connect with all storage units on a corresponding active area, wherein each storage cell includes one of the storage unit, two of the transistors respectively at both sides of the storage unit, and two branches of the source line.
-
公开(公告)号:US20210135092A1
公开(公告)日:2021-05-06
申请号:US16698924
申请日:2019-11-27
Applicant: UNITED MICROELECTRONICS CORP.
Inventor: Hui-Lin Wang , Po-Kai Hsu , Jing-Yin Jhang , Hung-Yueh Chen , Yu-Ping Wang , Jia-Rong Wu , Rai-Min Huang , Ya-Huei Tsai , I-Fan Chang
Abstract: A semiconductor device includes a first magnetic tunneling junction (MTJ) and a second MTJ on a substrate and a dummy MTJ between the first MTJ and the second MTJ, in which a bottom surface of the dummy MTJ is not connected to any metal. Preferably, the semiconductor device further includes a first metal interconnection under the first MTJ, a second metal interconnection under the second MTJ, and a first inter-metal dielectric (IMD) layer around the first metal interconnection and the second metal interconnection and directly under the dummy MTJ.
-
53.
公开(公告)号:US20210126191A1
公开(公告)日:2021-04-29
申请号:US16689100
申请日:2019-11-20
Applicant: UNITED MICROELECTRONICS CORP.
Inventor: Hui-Lin Wang , Po-Kai Hsu , Hung-Yueh Chen , Chen-Yi Weng , Si-Han Tsai , Jing-Yin Jhang , Yu-Ping Wang
Abstract: A method of fabricating a semiconductor device includes the steps of: providing a semiconductor structure including a memory region and a logic region. The semiconductor structure includes a first interlayer dielectric and at least one magnetoresistive random access memory (MRAM) cell disposed on the first interlayer dielectric, and the MRAM cell is disposed in the memory region; depositing a second interlayer dielectric covering the first interlayer dielectric and the at least one MRAM cell; depositing a mask layer conformally covering the second interlayer dielectric; perform a planarization process to remove the mask layer in the memory region; after the step of performing the planarization process, removing the mask layer in the logic region.
-
公开(公告)号:US20210065750A1
公开(公告)日:2021-03-04
申请号:US16592734
申请日:2019-10-03
Applicant: UNITED MICROELECTRONICS CORP.
Inventor: Po-Kai Hsu , Hung-Yueh Chen , Kun-I Chou , Jing-Yin Jhang , Hui-Lin Wang , Yu-Ping Wang
Abstract: A memory layout structure, which is provided with multiple source lines between active areas, each source line has multiple branches electrically connecting with the active areas at opposite sides in alternating arrangement. Multiple word lines traverse through the active areas to form transistors. Multiple storage units are disposed between the word lines on the active areas in staggered array arrangement, and multiple bit lines electrically connect with all storage units on a corresponding active area, wherein each storage cell includes one of the storage unit, two of the transistors respectively at both sides of the storage unit, and two branches of the source line.
-
公开(公告)号:US10930704B2
公开(公告)日:2021-02-23
申请号:US16812354
申请日:2020-03-08
Applicant: UNITED MICROELECTRONICS CORP.
Inventor: Rai-Min Huang , Hung-Yueh Chen , Ya-Huei Tsai , Yu-Ping Wang
IPC: H01L27/22 , H01L23/532 , H01L43/02 , H01L23/522 , H01L23/528 , G11C11/16
Abstract: A magnetic memory cell includes a substrate, a transistor, a first dielectric layer disposed on the substrate, a landing pad in the first dielectric layer, a second dielectric layer covering the first dielectric layer and the landing pad, a memory stack in the second dielectric layer, and a source line in the first dielectric layer. The first dielectric layer covers the transistor. The landing pad is situated in a first horizontal plane and is coupled to a drain region of the transistor. The memory stack has a bottom electrode connected to the landing pad and a top electrode electrically connected to a bit line. The source line is situated in a second horizontal plane and is connected to a source region of the transistor. The second horizontal plane and the first horizontal plane are not coplanar.
-
公开(公告)号:US20250048936A1
公开(公告)日:2025-02-06
申请号:US18919382
申请日:2024-10-17
Applicant: United Microelectronics Corp.
Inventor: Hui-Lin Wang , Po-Kai Hsu , Chen-Yi Weng , Jing-Yin Jhang , Yu-Ping Wang , Hung-Yueh Chen
Abstract: A semiconductor device includes: a substrate comprising a magnetic tunneling junction (MTJ) region and a logic region, a MTJ on the MTJ region, a top electrode on the MTJ, a connecting structure on the top electrode, and a first metal interconnection on the logic region. Preferably, the first metal interconnection includes a via conductor on the substrate and a trench conductor, in which a bottom surface of the trench conductor is lower than a bottom surface of the connecting structure.
-
公开(公告)号:US20250040149A1
公开(公告)日:2025-01-30
申请号:US18916730
申请日:2024-10-16
Applicant: UNITED MICROELECTRONICS CORP.
Inventor: Ya-Huei Tsai , Rai-Min Huang , Yu-Ping Wang , Hung-Yueh Chen
Abstract: A layout pattern for magnetoresistive random access memory (MRAM) includes a substrate having a first active region, a second active region, and a word line connecting region between the first active region and the second active region, a first gate pattern extending along a first direction from the first active region to the second active region, a second gate pattern extending along the first direction from the first active region to the second active region, a first magnetic tunneling junction (MTJ) between the first gate pattern and the second pattern and within the word line connecting region, and a second MTJ between the first gate pattern and the second gate pattern in the first active region. Preferably, top surfaces of the first MTJ and the second MTJ are coplanar.
-
公开(公告)号:US12150315B2
公开(公告)日:2024-11-19
申请号:US18395649
申请日:2023-12-25
Applicant: UNITED MICROELECTRONICS CORP.
Inventor: Ya-Huei Tsai , Rai-Min Huang , Yu-Ping Wang , Hung-Yueh Chen
Abstract: A layout pattern for magnetoresistive random access memory (MRAM) includes a substrate having a first active region, a second active region, and a word line connecting region between the first active region and the second active region, a first gate pattern extending along a first direction from the first active region to the second active region, a second gate pattern extending along the first direction from the first active region to the second active region, a first magnetic tunneling junction (MTJ) between the first gate pattern and the second pattern and within the word line connecting region, and a second MTJ between the first gate pattern and the second gate pattern in the first active region. Preferably, top surfaces of the first MTJ and the second MTJ are coplanar.
-
公开(公告)号:US11950513B2
公开(公告)日:2024-04-02
申请号:US17857185
申请日:2022-07-05
Applicant: UNITED MICROELECTRONICS CORP.
Inventor: Hui-Lin Wang , Wei Chen , Po-Kai Hsu , Yu-Ping Wang , Hung-Yueh Chen
CPC classification number: H10N50/01 , H01F10/3254 , H01F10/329 , H10N50/80
Abstract: A method for fabricating a semiconductor device includes the steps of: forming a first inter-metal dielectric (IMD) layer on a substrate; forming a first metal interconnection and a second metal interconnection in the first IMD layer; forming a channel layer on the first metal interconnection and the second metal interconnection; forming a magnetic tunneling junction (MTJ) stack on the channel layer; and removing the MTJ stack to form a MTJ.
-
公开(公告)号:US11944016B2
公开(公告)日:2024-03-26
申请号:US17692203
申请日:2022-03-11
Applicant: UNITED MICROELECTRONICS CORP.
Inventor: Hung-Chan Lin , Yu-Ping Wang , Hung-Yueh Chen
Abstract: A magnetoresistive random access memory, including a substrate, a conductive plug in the substrate, wherein the conductive plug has a notched portion on one side of the upper edge of the conductive plug, and a magnetic memory cell with a bottom electrode electrically connecting with the conductive plug, a magnetic tunnel junction on the bottom electrode and a top electrode on the magnetic tunnel junction, wherein the bottom surface of the magnetic memory cell and the top surface of the conductive plug completely align and overlap each other.
-
-
-
-
-
-
-
-
-