Lithography system and operation method thereof

    公开(公告)号:US12025923B2

    公开(公告)日:2024-07-02

    申请号:US18151163

    申请日:2023-01-06

    IPC分类号: G03F7/00 H05G2/00

    摘要: A method includes shooting a primary droplet and a satellite droplet from a droplet generator along a common initial direction; applying a force to the primary droplet and the satellite droplet, wherein after applying the force, the primary droplet has a first deflection toward a first direction different than the common initial direction, and the satellite droplet has a second deflection toward a second direction different than the common initial direction, wherein the second deflection of the satellite droplet is greater than the first deflection of the primary droplet; and generating an extreme ultraviolet (EUV) light using an excitation laser hitting the primary droplet with the first deflection.

    Radiation source supply system for lithographic tools

    公开(公告)号:US11809084B2

    公开(公告)日:2023-11-07

    申请号:US17874204

    申请日:2022-07-26

    IPC分类号: G03F7/00 G03F7/20

    摘要: Embodiments described herein provide a lithographic system having two or more lithographic tools connected to a radiation source using two or more variable attenuation units. In some embodiments, the variable attenuation unit reflects a portion of the received light beam to the lithographic tool attached thereto and transmits a remaining portion of the received light beam to the lithographic tools downstream. In some embodiments, the radiation source includes two or more laser sources to provide laser beams with an enhanced power level and which can prevent operation interruption due to laser source maintenances and repair.

    Radiation source supply system for lithographic tools

    公开(公告)号:US11435669B2

    公开(公告)日:2022-09-06

    申请号:US17233090

    申请日:2021-04-16

    IPC分类号: G03F7/20

    摘要: Embodiments described herein provide a lithographic system having two or more lithographic tools connected to a radiation source using two or more variable attenuation units. In some embodiments, the variable attenuation unit reflects a portion of the received light beam to the lithographic tool attached thereto and transmits a remaining portion of the received light beam to the lithographic tools downstream. In some embodiments, the radiation source includes two or more laser sources to provide laser beams with an enhanced power level and which can prevent operation interruption due to laser source maintenances and repair.

    Substrate measuring device and a method of using the same

    公开(公告)号:US11409200B2

    公开(公告)日:2022-08-09

    申请号:US17374647

    申请日:2021-07-13

    IPC分类号: G03F9/00 G03F7/20 G03F1/42

    摘要: Embodiments of the present disclosure provide a substrate measuring device in a lithography projection apparatus that provides multiple light sources having different wavelengths. In some embodiments, a lithography projection apparatus includes a substrate measuring system disposed proximate to a substrate stage, the substrate measuring system further including an emitter including multiple light sources configured to provide multiple beams of light, each of at least some of the multiple beams of light having a different wavelength, at least one optical fiber, wherein each of respective portions of the at least one optical fiber is configured to pass a respective one of the multiple beams of light, and a receiver positioned to collected light emitted from the emitter and reflected off of a substrate disposed on the substrate stage.

    System and method for lens heating control

    公开(公告)号:US11287751B2

    公开(公告)日:2022-03-29

    申请号:US16942575

    申请日:2020-07-29

    IPC分类号: G03F7/20 G02B7/02

    摘要: Embodiments of the present disclosure provide a system and method for stabilizing optical lens temperatures, including detecting infrared radiation emitted from one or more optical lens, generating an infrared sensor signal based upon the detected infrared radiation, directing emission of light from one or more infrared light sources to the one or more optical lenses, and regulating the emission of the light from the one or more infrared light sources based on the infrared sensor signal for adjusting the temperature of the one or more optical lens.

    Photolithography apparatus and method for handling wafer

    公开(公告)号:US11187997B2

    公开(公告)日:2021-11-30

    申请号:US17013267

    申请日:2020-09-04

    摘要: A method for adhering a reticle onto a top surface of a chuck is provided in accordance with some embodiments of the present disclosure. The method includes sliding a reticle relative to a chuck along a first direction, such that a plurality of fibers over a top surface of the chuck are inclined away from an imaginary line normal to the top surface of the chuck by sliding the reticle relative to the chuck along the first direction; performing a photolithography process using the reticle; and after performing the photolithography process, sliding the reticle relative to the chuck along a second direction opposite to the first direction, such that the fibers are moved back toward the imaginary line by sliding the reticle relative to the chuck along the second direction.