公开(公告)号：US20220303436A1

公开(公告)日：2022-09-22

申请号：US17635121

申请日：2020-07-08

Applicant: NINGBO SUNNY OPOTECH CO., LTD

Inventor： Zhongyu LUAN ,  Zhen HUANG ,  Li LIU ,  Hongfeng GAN ,  Tinghua LI ,  Xinxiang SUN

IPC: H04N5/225 ,  H05K1/18 ,  H05K3/30

Abstract: The present application relates to a photosensitive assembly, including a circuit board, a photosensitive chip and a metal wire. A first surface of the circuit board has a protrusion structure and a chip attachment area, and the protrusion structure is distributed in the chip attachment area. The photosensitive chip is attached to the first surface by an adhesive, and the adhesive is at least disposed between the top surface of the protrusion structure and the bottom surface of the photosensitive chip. The metal wire electrically connects the photosensitive chip and the circuit board in a wire bonding manner. The present application further provides a corresponding manufacturing method for a camera module and a photosensitive assembly. The present application can avoid or suppress the deformation of the photosensitive chip at a smaller cost of space size. The photosensitive assembly and the camera module of the present application can improve the structural strength of the circuit board. The photosensitive assembly and the camera module of the present application can improve the heat dissipation efficiency of the photosensitive chip.

公开(公告)号：US20220294943A1

公开(公告)日：2022-09-15

申请号：US17607958

申请日：2020-02-28

Applicant: NINGBO SUNNY OPOTECH CO., LTD.

Inventor： Mingzhu WANG ,  Takehiko TANAKA ,  Zhen HUANG ,  Zhenyu CHEN

IPC: H04N5/225 ,  G03B11/00

Abstract: Disclosed are a camera module and a photosensitive assembly thereof, an electronic device, and a manufacturing method. The photosensitive assembly includes a photosensitive chip, at least one resistance-capacitance device, an extended wiring layer, a filter element assembly, and a molded base. The filter element assembly includes a filter element and a bonding layer bonded around the filter element. The filter element assembly is attached to a top surface of the extended wiring layer, and the filter element of the filter element assembly corresponds to a light transmission hole of the extended wiring layer, so that external light is filtered by the filter element before reaching a photosensitive area of the photosensitive chip through the light transmission hole.

公开(公告)号：US20220279094A1

公开(公告)日：2022-09-01

申请号：US17631565

申请日：2020-07-01

Applicant: NINGBO SUNNY OPOTECH CO., LTD.

Inventor： Zhongyu LUAN ,  Zhen HUANG ,  Bin LU ,  Li LIU ,  Chengchang ZHENG ,  Tinghua LI

IPC: H04N5/225 ,  H05K1/18

Abstract: Disclosed are a molded circuit board and a camera module, and a manufacturing method thereof and an electronic device comprising the same. The molded circuit board includes a circuit board main body and a molded structure. The circuit board main body includes at least one circuit layer and at least one substrate layer, wherein the circuit layer and the substrate layer are stacked in a manner of being spaced apart. The molded structure includes a molded layer, wherein the molded layer is stacked on at least one surface of the circuit board main body to cover at least part of the substrate

公开(公告)号：US20220179288A1

公开(公告)日：2022-06-09

申请号：US17603183

申请日：2020-03-02

Applicant: NINGBO SUNNY OPOTECH CO., LTD.

Inventor： Zhen HUANG ,  Zhongyu LUAN ,  Zongchun YANG ,  Fengsheng XI ,  Chenxiang XU

IPC: G03B17/02 ,  G03B13/34 ,  H04N5/225 ,  B29D11/00

Abstract: Provided are a camera module, a molded photosensitive assembly and a manufacturing method thereof, and an electronic device. The molded photosensitive assembly is assembled with at least one optical lenses to form a camera module. The molded photosensitive assembly includes an imaging assembly, a molded base, and a filter member. The molded base includes a first molded portion and a second molded portion. The first molded portion embeds a part of the imaging assembly. The second molded portion is integrally formed on a first upper surface of the first molded portion, and the second molded portion has a second upper surface and a second outer side surface. A filter member is attached to the second upper surface of the second molded portion, and corresponds to a photosensitive path of the imaging assembly. The second upper surface of the second molded portion is higher than the first upper surface of the first molded portion, so as to define and form an outer space by a second outer side surface of the second molded portion and the first upper surface of the first molded portion.

公开(公告)号：US20220094822A1

公开(公告)日：2022-03-24

申请号：US17540642

申请日：2021-12-02

Applicant: Ningbo Sunny Opotech Co., Ltd.

Inventor： Mingzhu WANG ,  Zhenyu CHEN ,  Takehiko TANAKA ,  Zhongyu LUAN ,  Bojie ZHAO ,  Zhen HUANG ,  Nan GUO ,  Fengsheng XI ,  Heng JIANG ,  Zilong DENG

IPC: H04N5/225

Abstract: A camera module and its photosensitive assembly and manufacturing method thereof are provided. The photosensitive assembly includes a photosensitive element, a window circuit board and a packaging body integrally packaged the photosensitive element and the window circuit board to form an integrated body, wherein the window circuit board has at least one window for receiving the photosensitive element therein.

公开(公告)号：US20210329781A1

公开(公告)日：2021-10-21

申请号：US17323079

申请日：2021-05-18

Applicant: NINGBO SUNNY OPOTECH CO., LTD.

Inventor： Mingzhu WANG ,  Nan GUO ,  Feifan CHEN ,  Bojie ZHAO ,  Bo PENG ,  Zhen HUANG

IPC: H05K1/02 ,  H05K3/00 ,  G02B7/09 ,  H04N5/225 ,  H05K3/32 ,  H05K3/46

Abstract: A camera module with compression-molded circuit board is manufactured by compression-molding that can obtain properties such as high flatness, ultra-thin, fine wiring width and high integration.

公开(公告)号：US20210266436A1

公开(公告)日：2021-08-26

申请号：US17314723

申请日：2021-05-07

Applicant: Ningbo Sunny Opotech Co., Ltd.

Inventor： Mingzhu WANG ,  Duanliang CHENG ,  Fengsheng XI ,  Bojie ZHAO ,  Takehiko TANAKA ,  Zhen HUANG ,  Zhenyu CHEN ,  Nan GUO

IPC: H04N5/225 ,  H05K1/18 ,  H05K3/30

Abstract: The present invention provides a camera module and a molding circuit board assembly, circuit board and application thereof, the circuit board comprising a digital circuit unit, an analog circuit unit and a substrate. The digital circuit nit and the analog circuit unit are respectively formed on the substrate, and the digital circuit unit and the analog circuit unit are conductively connected to each other, wherein at least one part of the analog circuit unit has a safe distance from the digital circuit unit, so as to prevent an electromagnetic wave generated by a circuit of the digital circuit unit from interfering with an electrical signal transmitted and processed by the analog circuit unit, thereby improving the stability and reliability of the transmission and the processing of the electrical signal by the circuit board.

公开(公告)号：US20190020798A1

公开(公告)日：2019-01-17

申请号：US15780534

申请日：2016-12-01

Applicant: NINGBO SUNNY OPOTECH CO., LTD.

Inventor： Mingzhu WANG ,  Baozhong ZHANG ,  Zhen HUANG ,  Feifan CHEN ,  Nan GUO ,  Zhenyu CHEN ,  Ye WU

IPC: H04N5/225 ,  G02B7/04 ,  H05K3/30 ,  H05K3/34

Abstract: The present disclosure provides a camera module and an electrical bracket thereof. The electrical bracket is provided with a clear aperture. The electrical bracket not only has the functions of a conventional circuit board (conduction of the electrical signal of an electronic device such as a chip and a motor), but also has the effects of a conventional base to support an optical filter and serve as a motor base bracket.

公开(公告)号：US20180007244A1

公开(公告)日：2018-01-04

申请号：US15473565

申请日：2017-03-29

Applicant: NINGBO SUNNY OPOTECH CO., LTD.

Inventor： Mingzhu WANG ,  Zhenyu CHEN ,  Takehiko TANAKA ,  Zhongyu LUAN ,  Bojie ZHAO ,  Zhen HUANG ,  Nan GUO ,  Fengsheng XI ,  Heng JIANG ,  Zilong DENG

IPC: H04N5/225

CPC classification number: H04N5/2252 ,  H04N5/2253 ,  H04N5/2254 ,  H04N5/2257

Abstract: A camera module and its photosensitive assembly and manufacturing method thereof are provided. The photosensitive assembly includes a photosensitive element, a window circuit board and a packaging body integrally packaged the photosensitive element and the window circuit board to form an integrated body, wherein the window circuit board has at least one window for receiving the photosensitive element therein.

公开(公告)号：US20170245370A1

公开(公告)日：2017-08-24

申请号：US15460221

申请日：2017-03-15

Applicant: NINGBO SUNNY OPOTECH CO., LTD.

Inventor： Mingzhu WANG ,  Bojie ZHAO ,  Zhenyu CHEN ,  Takehiko TANAKA ,  Nan GUO ,  Zhen HUANG ,  Duanliang CHENG ,  Liang DING ,  Feifan CHEN ,  Heng JIANG

IPC: H05K3/00 ,  G02B7/00 ,  G02B7/02 ,  H04N5/225 ,  B29C45/14

CPC classification number: H05K3/0011 ,  B29C45/14418 ,  B29C45/14639 ,  B29C45/14655 ,  B29C2045/14663 ,  B29L2031/3481 ,  G02B7/006 ,  G02B7/021 ,  H04N5/2253 ,  H04N5/2254 ,  H04N5/2257 ,  H04N5/2258 ,  H05K3/284 ,  H05K2201/10121 ,  H05K2203/1316 ,  H05K2203/1327

Abstract: An array imaging module includes at least two optical lenses and a molded photosensitive assembly, wherein the molded photosensitive assembly includes at least two photosensitive units, a circuit board that electrically couples to the photosensitive units, and a molded base having at least two optical windows. The molded base is integrally coupled at the circuit board at a peripheral portion thereof, wherein the photosensitive units are aligned with the optical windows respectively. The optical lenses are located along two photosensitive paths of the photosensitive units respectively, such that each of the optical windows forms a light channel through the corresponding photosensitive unit and the corresponding optical lens.