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公开(公告)号：US20220367556A1
公开(公告)日：2022-11-17
申请号：US17770744
申请日：2020-10-21
发明人： Zhen HUANG , Zhongyu LUAN , Yinbo ZHANG , Fengsheng XI , Hongfeng GAN
IPC分类号： H01L27/146
摘要： The present application relates to a circuit board assembly, a photosensitive assembly, a camera module, and preparation methods for the circuit board assembly and the photosensitive assembly. The photosensitive assembly includes a circuit board and a photosensitive chip. The circuit board includes a circuit board main body, a through hole formed through the circuit board main body, a set of circuit board electrical connecting terminals disposed on the lower surface of the circuit board main body, a conducting medium disposed on the circuit board electrical connecting terminals, and a non-conducting adhesive covering the conducting medium. The photosensitive chip includes chip electrical connecting terminals disposed in a non-photosensitive area. The chip electrical connecting terminals of the photosensitive chip is in contact with the conducting medium to be electrically connected to the circuit board electrical connecting terminals, and the photosensitive chip is bonded to the lower surface of the circuit board via the non-conducting adhesive, so that the photosensitive chip is electrically connected to the circuit board. In this way, the photosensitive chip is stably electrically connected to the circuit board with relatively low costs and relatively low process difficulty.
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公开(公告)号：US20220357567A1
公开(公告)日：2022-11-10
申请号：US17761351
申请日：2020-08-31
发明人： Bojie ZHAO , Lifeng YAO , Dongli YUAN , Sisi YU , Zhen HUANG
摘要： Provided is a periscopic camera module, which includes a first reflective element mounted on a first base, an optical lens mounted on a second substrate, a second reflective element mounted on a third substrate, and a photosensitive chip mounted on a fourth substrate. Particularly, the first reflective element is used to reflect the incident light to make it longitudinally turned; the optical lens is used to receive the reflected light which is longitudinally turned and output an imageable light beam; the second reflective element is a second prism, which is adapted to laterally turn the imageable light beam at least once and has a reflecting surface located on a side surface of the second prism; and the photosensitive chip is adapted to receive the imageable light beam laterally turned by the second reflective element. Also provided is a corresponding electronic device. The length of the periscopic camera module according to the present application may be reduced to be suitable for mass production on a large scale, thereby facilitating to improve production efficiency and yield.
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3.发明申请公开(公告)号：US20220109018A1
公开(公告)日：2022-04-07
申请号：US17550733
申请日：2021-12-14
发明人： Mingzhu WANG , Nan GUO , Zhenyu CHEN , Takehiko TANAKA , Jingfei HE , Zhen HUANG , Zhongyu LUAN , Feifan CHEN
IPC分类号： H01L27/146 , H04N5/225 , H04M1/02 , H05K1/18
摘要： A camera module and a molded circuit board assembly thereof, a semi-finished product of the molded circuit board assembly, and an array camera module and a molded circuit board assembly thereof, as well as a manufacturing method and an electronic device, wherein the camera module comprises at least one optical lens, at least one back surface molded portion, at least one photosensitive element and a circuit board. The circuit board comprises at least one substrate and at least one electronic component that is conductively connected to the substrate; a part of the non-photosensitive area of the photosensitive element is attached to the substrate back surface of the substrate, and the photosensitive area and another part of the non-photosensitive area of the photosensitive element correspond to a substrate channel of the substrate; the back surface molded portion is integrally bonded to at least one part of the area of the substrate back surface of the substrate; and the optical lens is held in the photosensitive path of the photosensitive element.
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公开(公告)号：US20210250477A1
公开(公告)日：2021-08-12
申请号：US17195785
申请日：2021-03-09
发明人： Zhen HUANG , Qimin MEI , Bojie ZHAO , Zhewen MEI , Li LIU , Jiawei CHEN , Zongchun YANG , Chenxiang XU
IPC分类号： H04N5/225
摘要： A camera module includes an optical assembly, a filter and a molded photosensitive assembly mounted under the optical assembly and the filter, wherein the molded photosensitive assembly comprises a main body, a plurality of electronic components, a photosensitive chip, and a circuit board electrically connected with the electronic components and the photosensitive chip, wherein the electronic components, the photosensitive chip and the circuit board are positionally fixed with each other by the main body, wherein the photosensitive chip is fixed and surrounded by the bottom of the main body to keep distance with the filter, wherein the main body comprises a container body supporting the optical assembly thereon and a lower body supporting the filter thereon, wherein the lower body is extended from the inner side of the container body.
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5.发明申请公开(公告)号：US20200244852A1
公开(公告)日：2020-07-30
申请号：US16483150
申请日：2018-02-05
发明人： Mingzhu WANG , Duanliang CHENG , Fengsheng XI , Bojie ZHAO , Takehiko TANAKA , Zhen HUANG , Zhenyu CHEN , Nan GUO
摘要： The present invention provides a camera module and a molding circuit board assembly, circuit board and application thereof, the circuit board comprising a digital circuit unit, an analog circuit unit and a substrate. The digital circuit nit and the analog circuit unit are respectively formed on the substrate, and the digital circuit unit and the analog circuit unit are conductively connected to each other, wherein at least one part of the analog circuit unit has a safe distance from the digital circuit unit, so as to prevent an electromagnetic wave generated by a circuit of the digital circuit unit from interfering with an electrical signal transmitted and processed by the analog circuit unit, thereby improving the stability and reliability of the transmission and the processing of the electrical signal by the circuit board.
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6.发明申请公开(公告)号：US20200007726A1
公开(公告)日：2020-01-02
申请号：US16484292
申请日：2018-02-08
发明人： Mingzhu WANG , Zhongyu LUAN , Liefeng CHEN , Duanliang CHENG , Bojie ZHAO , Takehiko TANAKA , Zhen HUANG
IPC分类号： H04N5/225
摘要： The present invention provides a camera module, a molding photosensitive assembly thereof, a manufacturing method, and an electronic device, the molding photosensitive assembly comprises a lens, a photosensitive element, a circuit board, a molding base, and a supporting element, the photosensitive element being arranged on the circuit board, the molding base being formed into an integral structure with the lens, the supporting element, the photosensitive element, and the circuit board by means of a molding process, and the camera module and the molding photosensitive assembly thereof being capable of reducing stain sensitivity and shortening the distance of the lens plane above a light through hole of the lens to the photosensitive plane of the photosensitive element.
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公开(公告)号：US20190364183A1
公开(公告)日：2019-11-28
申请号：US16427370
申请日：2019-05-31
发明人： Mingzhu WANG , Nan GUO , Feifan CHEN , Bojie ZHAO , Bo PENG , Zhen HUANG
IPC分类号： H04N5/225
摘要： A camera module includes a lens, a photosensitive chip and an electrical holder. The electrical holder has an integrated circuit that the electrical holder serves as an integration of a base and a PCB in a conventional camera module, wherein the electrical holder not only forms an assembling unit for connecting a motor and an optical lens but also forms an electrical connection unit for electrically connecting to the motor, a photosensitive chip and a flexible circuit board with each other, so as to minimize an overall size of the camera module.
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8.发明申请公开(公告)号：US20190134866A1
公开(公告)日：2019-05-09
申请号：US16307151
申请日：2017-06-06
发明人： Mingzhu WANG , Bojie ZHAO , Takehiko TANAKA , Zhen HUANG
IPC分类号： B29C45/14
摘要： A manufacturing equipment, for manufacturing a molded circuit board assembly of a camera module, includes an upper mould, a lower mould, a mould fixing arrangement, and a temperature controlling arrangement, wherein the mould fixing arrangement controls opening and closing of the upper mould and the lower mound. When a substrate board is placed between the upper mould and the lower mound, a molding cavity is further formed between the upper mould and the lower mound, wherein in the molding cavity, a supporting frame forming groove is formed for forming the module support, and a light window forming element is used for forming a light window. The temperature controlling arrangement provides a molding temperature, the module supporting frame is integrally molded on the substrate board to form the molded circuit board assembly.
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公开(公告)号：US20170142305A1
公开(公告)日：2017-05-18
申请号：US15057068
申请日：2016-02-29
发明人： Mingzhu WANG , Nan GUO , Feifan CHEN , Bojie ZHAO , Bo PENG , Zhen HUANG
IPC分类号： H04N5/225
CPC分类号： H04N5/2257 , H04N5/2253 , H04N5/2254
摘要： A camera module includes a lens, a photosensitive chip and an electrical holder. The electrical holder has an integrated circuit that the electrical holder serves as an integration of a base and a PCB in a conventional camera module, wherein the electrical holder not only forms an assembling unit for connecting a driver and an optical lens but also forms an electrical connection unit for electrically connecting to the driver, a photosensitive chip and a flexible circuit board with each other, so as to minimize an overall size of the camera module.
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10.发明公开公开(公告)号：US20230328350A1
公开(公告)日：2023-10-12
申请号：US18203731
申请日：2023-05-31
发明人： Zhen HUANG , Qimin MEI , Bojie ZHAO , Zhewen MEI , Li LIU , Jiawei CHEN , Chenxiang XU
CPC分类号： H04N23/55 , B29C43/18 , H04N23/54 , H04N23/57 , B29L2011/00
摘要： A camera module and a molded photosensitive assembly and manufacturing methods thereof, and an electronic device are disclosed. The molded photosensitive assembly includes an imaging assembly, a molded base and a filter assembly. The imaging assembly includes a circuit board and at least one photosensitive element, and each photosensitive element is conductively connected to the circuit board. The molded base has at least one stepped peripheral groove to define a light window through each stepped peripheral groove, the molded base embeds a part of the imaging assembly, and a photosensitive region of each photosensitive element respectively corresponds to each light window of the molded base. The filter assembly includes at least one filter element, and each filter element is correspondingly arranged in each stepped peripheral groove of the molded base, so that each filter element respectively corresponds to each light window of the molded base.
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