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    Lens and Camera Module with Lens
    1.
    发明公开
    Lens and Camera Module with Lens 审中-公开

    公开(公告)号：US20240061322A1

    公开(公告)日：2024-02-22

    申请号：US18269752

    申请日：2021-12-22

    申请人： NINGBO SUNNY OPOTECH CO., LTD.

    发明人： Lin LIU ,  Takehiko TANAKA ,  Yueguang YIN ,  Haipeng PEI

    IPC分类号： G03B17/12 ,  G02B7/02 ,  G03B17/56

    CPC分类号： G03B17/12 ,  G02B7/025 ,  G03B17/565 ,  G03B2217/002

    摘要： Disclosed are a lens and a camera module with lens. The lens includes a first lens unit, a second lens unit and an adhesive structure, the first lens unit includes a glass lens and an opaque component, the opaque component is covered on an outer periphery of the glass lens, the first lens unit is arranged at a front end of the second lens unit in an optical axis direction, the adhesive structure includes an adhesive layer and an adhesive fixing unit, the glass lens is adhered to the second lens unit by the adhesive layer, and the adhesive fixing unit is located between the first lens unit and the second lens unit, so that a bonding strength between the glass lens and the second lens unit is enhanced by the adhesive fixing unit.

    CAMERA MODULE AND PHOTOSENSITIVE ASSEMBLY THEREOF, ELECTRONIC DEVICE, AND MANUFACTURING METHOD
    4.
    发明申请
    CAMERA MODULE AND PHOTOSENSITIVE ASSEMBLY THEREOF, ELECTRONIC DEVICE, AND MANUFACTURING METHOD 有权

    公开(公告)号：US20220294940A1

    公开(公告)日：2022-09-15

    申请号：US17607947

    申请日：2020-02-28

    申请人： NINGBO SUNNY OPOTECH CO., LTD.

    发明人： Mingzhu WANG ,  Takehiko TANAKA ,  Xiaodi LIU ,  Zhen HUANG ,  Zhenyu CHEN

    IPC分类号： H04N5/225

    摘要： A camera module and a photosensitive assembly thereof, an electronic device, and a manufacturing method are provided. The photosensitive assembly includes a photosensitive chip having a photosensitive area and an electric connection area located around the photosensitive area, at least one resistance-capacitance device, a conducting element, an expanded wiring layer, and a molded base. The expanded wiring layer has a top surface and a bottom surface. The at least one resistance-capacitance device is electrically connected to the bottom surface of the expanded wiring layer. The conducting element extends between the bottom surface of the expanded wiring layer and the electric connection area of the photosensitive chip, so as to electrically connect the photosensitive chip to the expanded wiring layer by means of the conducting element. A light hole is formed in the expanded wiring layer, and the light hole corresponds to at least the photosensitive area of the photosensitive chip. The molded base is integrally combined with the photosensitive chip, the at least one resistance-capacitance device, and the expanded wiring layer.

    CAMERA MODULE, PHOTOSENSITIVE COMPONENT, PHOTOSENSITIVE-COMPONENT JOINED PANEL, AND FORMING DIE THEREOF AND MANUFACTURING METHOD THEREOF
    7.
    发明申请
    CAMERA MODULE, PHOTOSENSITIVE COMPONENT, PHOTOSENSITIVE-COMPONENT JOINED PANEL, AND FORMING DIE THEREOF AND MANUFACTURING METHOD THEREOF 有权

    公开(公告)号：US20220223633A1

    公开(公告)日：2022-07-14

    申请号：US17707051

    申请日：2022-03-29

    申请人： NINGBO SUNNY OPOTECH CO., LTD.

    发明人： Takehiko TANAKA ,  Bojie ZHAO ,  Zhewen MEI ,  Nan GUO

    IPC分类号： H01L27/146 ,  H04N5/225

    摘要： Provided is a camera module and a photosensitive component thereof and a manufacturing method thereof, said photosensitive component comprising: a circuit board, a photosensitive element, and a molding base; the molding base is integrally formed on the circuit board and photosensitive element to form a light window; a first end side corresponding to the molding base adjacent to the flexible region has a first side surface facing the light window; said first side surface comprises a first partial surface arranged adjacent to the photosensitive element and a second partial surface connected to said first portion surface; a first angle between said first partial surface and the optical axis of the camera module is greater than a second angle between the second partial surface and the optical axis; a second end side opposite to and away from the flexible region of the molding base has a second side surface facing the light window; said second side surface comprises a third partial surface arranged adjacent to the photosensitive element and a fourth partial surface connected to said third portion surface; a third angle between the third partial surface and the optical axis is greater than a fourth angle between the fourth partial surface and the optical axis.

    OPTICAL LENS, CAMERA MODULE, AND ASSEMBLY METHOD FOR THE OPTICAL LENS
    8.
    发明申请
    OPTICAL LENS, CAMERA MODULE, AND ASSEMBLY METHOD FOR THE OPTICAL LENS 有权

    公开(公告)号：US20220107480A1

    公开(公告)日：2022-04-07

    申请号：US17426878

    申请日：2020-01-03

    申请人： Ningbo Sunny Opotech Co., Ltd.

    发明人： Liefeng CHEN ,  Zhewen MEI ,  Takehiko TANAKA ,  Xinxiang SUN ,  Lin LIU

    IPC分类号： G02B7/02 ,  G03B17/12 ,  H04N5/225

    摘要： The optical lenses include a first lenses part including a first lens and a second lenses part including a second lens. The second lens and the first lens constitute an imageable optical system. A first adhesive material is located in a first gap between the first and second lenses parts, the first adhesive material supporting and fixing the first and second lenses parts. The first lenses part has a first bottom surface, and the second lenses part has a second top surface. An adhesive applying area for arranging the first adhesive material is provided on the first bottom surface and/or the second top surface. A first adhesive blocking portion is provided on the first bottom surface and/or a third adhesive blocking portion is provided on the second top surface.

    CAMERA MODULE ARRAY AND ASSEMBLY METHOD THEREFOR
    9.
    发明申请
    CAMERA MODULE ARRAY AND ASSEMBLY METHOD THEREFOR 有权

    公开(公告)号：US20210203817A1

    公开(公告)日：2021-07-01

    申请号：US17057606

    申请日：2019-04-26

    申请人： NINGBO SUNNY OPOTECH CO., LTD.

    发明人： Takehiko TANAKA ,  Yinli FANG

    IPC分类号： H04N5/225 ,  G02B27/00 ,  H04M1/02 ,  G02B13/02 ,  G02B13/06

    摘要： The present application provides a camera module array, comprising at least two camera modules, wherein at least one of the camera modules has a free-form lens sheet, and the free-form lens sheet performs active alignment according to an actual imaging result received by a photosensitive chip, so that a difference between an actual reference direction of the free-form lens sheet and a reference direction determined by an optical design is not greater than 0.05 degrees. The present application further provides a corresponding assembly method for camera module array. In the present application, a TTL of the camera modules can be reduced by means of the free-form lens sheet so as to, for example, make a TTL of a wide-angle module equal or approximately equal to a TTL of a telephoto module, so that a dual-camera module composed of the wide-angle module and the telephoto module is easily mounted in a terminal device such as a mobile phone. The present application can also effectively improve the mounting precision of the free-form lens sheet.