Abstract:
A power MOS device that has increased channel width comprises a semiconductor substrate and a doped upper layer of a first conduction type disposed on the substrate. The upper layer comprises a plurality of doped well regions of a second, opposite conduction type and a plurality of heavily doped source regions of the first conduction type at an etched upper surface of the upper layer that comprises parallel corrugations disposed transversely to the source regions. A gate that separates one source region from another comprises an insulating layer and a conductive material. The corrugations provide an increase in width of a channel underlying the gate and the well and source regions. In a process for forming a power MOS device with increased channel width on a semiconductor substrate having a doped upper layer of a first conduction type, a stripe mask is formed on an upper surface of the upper layer, and the upper surface is selectively etched to form a corrugated surface comprising a plurality of parallel corrugations. Following removal of the stripe mask, an insulating layer is formed on the corrugated surface, and an overlying conductive layer is formed on the insulating layer, the insulating and conductive layers comprising a corrugated gate region disposed transversely to the parallel corrugations of the upper surface. A dopant of a second, opposite conduction type is implanted to form a doped well region in the upper layer, and a dopant of the first conduction type is implanted into a portion of the corrugated surface adjacent to the gate, thereby forming a heavily doped source region in the upper layer. In an alternative procedure for forming a gate, a gate trench having a floor comprising parallel corrugations that substantially correspond to the corrugations in the upper surface is etched into the upper layer. Following lining of the trench floor and sidewalls with an insulating layer, the trench is substantially filled with a conductive material to form a gate trench. A dopant of the first conduction type is implanted into a portion of the corrugated surface adjacent to the gate region, thereby forming a heavily doped source region in the upper layer.
Abstract:
Systems and methods for color reproduction tolerances are provided. One method according to the present disclosure may involve selecting a printing configuration, printing a color scale sample using the printing configuration, and scoring the printed color scale sample based at least in part on an extent to which transpositions of the color swatches occur over a color range. When the score of the printed color scale sample indicates a print quality is or will be above a threshold level of quality, a print job using colors of the color range may be printed using the printing configuration.
Abstract:
A non-transitory, computer-readable medium has embedded therein instructions executable by a processor. The instructions simulate an operation of a print service provider (PSP) using a model of a printing system with a set of operation parameters for performing the PSP operation. The instructions determine a monitoring strategy based on the simulated PSP operation. The monitoring strategy is for monitoring the PSP operation when performed in the printing system.
Abstract:
An electrostatic liquid-ejection actuation mechanism includes a membrane, a frame, and one or more deformable beams. The frame has two sides and a number of cross members that are non-parallel to the two sides. The two sides and the cross members define one or more areas individually corresponding to one or more liquid chambers. The deformable beams are disposed between the membrane and the frame. The deformable beams individually correspond to the liquid chambers, and define a number of slits. Each slit is adjacent to one of the two sides of the frame. The deformable beams have a width that is less than a width of the liquid chambers, due at least to the slits.
Abstract:
Devices and methods for tracking a print job using an assignable electronic device on a print service provider (PSP) production floor are provided. One such method includes scanning a barcode-enabled job ticket assigned to a print job using a mobile electronic device assigned to a location on a print service provider production floor and sending barcode data from the barcode-enabled job ticket from to a PSP controller. The mobile electronic device may receive workflow instructions associated with the print job from the PSP controller. In addition, the mobile electronic device may display a representation of the workflow instructions.
Abstract:
The present disclosure relates to a compound comprising an oxygen-15 and a process for preparation thereof. It also relates to the use of the compound in positron and/or other nuclide imaging and use of the compound in obtaining a perfusion and/or metabolic image in an animal and/or human body. A process for preparing the compound comprises irradiating a compound comprising oxygen via irradiation energy in the range of 10 MeV to 430 MeV. The oxygen atom in the compound may then be allowed to be converted to an oxygen-15 positron nuclide through a photonuclear reaction. Provided that the molecular structure of the irradiated compound is not disrupted, a compound comprising an oxygen-15 is prepared.
Abstract:
A MOSFET switch which has a low surface electric field at an edge termination area, and also has increased breakdown voltage. The MOSFET switch has a new edge termination structure employing an N-P-N sandwich structure. The MOSFET switch also has a polysilicon field plate configuration operative to enhance any spreading of any depletion layer located at an edge of a main PN junction of the N-P-N sandwich structure.
Abstract:
A MOSFET switch which has a low surface electric field at an edge termination area, and also has increased breakdown voltage. The MOSFET switch has a new edge termination structure employing an N-P-N sandwich structure. The MOSFET switch also has a polysilicon field plate configuration operative to enhance any spreading of any depletion layer located at an edge of a main PN junction of the N-P-N sandwich structure.
Abstract:
A vertical-current-flow device includes a trench which includes an insulated gate and which extends down into first-conductivity-type semiconductor material. A phosphosilicate glass layer is positioned above the insulated gate and a polysilicon layer is positioned above the polysilicate glass layer. Source and body diffusions of opposite conductivity types are positioned adjacent to a sidewall of the trench. A drift region is positioned to receive majority carriers which have been injected by the source, and which have passed through the body diffusion. A drain region is positioned to receive majority carriers which have passed through the drift region. The gate is capacitively coupled to control inversion of a portion of the body region. As an alternative, a dielectric layer may be used in place of the doped glass where permanent charge is positioned in the dielectric layer.