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公开(公告)号：US08535115B2
公开(公告)日：2013-09-17
申请号：US13016504
申请日：2011-01-28
IPC分类号： B24B1/00
CPC分类号： B24B49/12 , B24B37/013 , B24B37/105
摘要： A polishing apparatus includes a platen to hold a polishing pad having a plurality of optical apertures, a carrier head to hold a substrate against the polishing pad, a motor to generate relative motion between the carrier head and the platen, and an optical monitoring system. The optical monitoring system includes at least one light source, a common detector, and an optical assembly configured to direct light from the at least one light source to each of a plurality of separated positions in the platen, to direct light from each position of the plurality of separated positions to the substrate as the substrate passes over said each position, to receive reflected light from the substrate as the substrate passes over said each position, and to direct the reflected light from each of the plurality of separated positions to the common detector.
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公开(公告)号：US20120196511A1
公开(公告)日：2012-08-02
申请号：US13016504
申请日：2011-01-28
IPC分类号： B24B49/00
CPC分类号： B24B49/12 , B24B37/013 , B24B37/105
摘要： A polishing apparatus includes a platen to hold a polishing pad having a plurality of optical apertures, a carrier head to hold a substrate against the polishing pad, a motor to generate relative motion between the carrier head and the platen, and an optical monitoring system. The optical monitoring system includes at least one light source, a common detector, and an optical assembly configured to direct light from the at least one light source to each of a plurality of separated positions in the platen, to direct light from each position of the plurality of separated positions to the substrate as the substrate passes over said each position, to receive reflected light from the substrate as the substrate passes over said each position, and to direct the reflected light from each of the plurality of separated positions to the common detector.
摘要翻译： 抛光装置包括用于保持具有多个光学孔的抛光垫的压板，用于将衬底保持在抛光垫上的载体头，用于在承载头和压板之间产生相对运动的电动机以及光学监控系统。 所述光学监视系统包括至少一个光源，公共检测器和配置成将来自所述至少一个光源的光引导到所述压板中的多个分离位置中的每一个的光学组件，以引导来自所述至少一个光源的每个位置的光 当衬底越过所述每个位置时，多个分离的位置到衬底，以在衬底经过所述每个位置时接收来自衬底的反射光，并将来自多个分离位置中的每一个的反射光引导到公共检测器 。
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公开(公告)号：US08815109B2
公开(公告)日：2014-08-26
申请号：US13339057
申请日：2011-12-28
IPC分类号： C03C15/00
CPC分类号： B24B49/12 , B24B37/013 , B24B37/205 , B24B49/08 , B24D7/14 , G05B15/02 , H01L21/31053 , H01L21/3212 , H01L22/26
摘要： A computer implemented method of monitoring a polishing process includes, for each sweep of a plurality of sweeps of an optical sensor across a substrate undergoing polishing, obtaining a plurality of current spectra, each current spectrum of the plurality of current spectra being a spectrum resulting from reflection of white light from the substrate, for each sweep of the plurality of sweeps, determining a difference between each current spectrum and each reference spectrum of a plurality of reference spectra to generate a plurality of differences, for each sweep of the plurality of sweeps, determining a smallest difference of the plurality of differences, thus generating a sequence of smallest difference, and determining a polishing endpoint based on the sequence of smallest differences.
摘要翻译： 监测抛光过程的计算机实现的方法包括：对于经历抛光的衬底上的光学传感器的多个扫描的每次扫描，获得多个电流光谱，多个电流光谱的每个电流光谱是由 对于多个扫描的每次扫描，从基板反射白光，确定多个参考光谱的每个当前光谱和每个参考光谱之间的差异，以对于多个扫描的每次扫描产生多个差异， 确定多个差异的最小差异，从而产生最小差异的序列，并且基于最小差异的序列确定抛光端点。
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公开(公告)号：US20090017726A1
公开(公告)日：2009-01-15
申请号：US12182076
申请日：2008-07-29
CPC分类号： B24B49/12 , B24B37/013 , B24B37/205 , B24B49/08 , B24D7/14 , G05B15/02 , H01L21/31053 , H01L21/3212 , H01L22/26
摘要： Methods and apparatus for spectrum-based endpointing. An endpointing method includes selecting two or more reference spectra. Each reference spectrum is a spectrum of white light reflected from a film of interest on a first substrate and has a thickness greater than a target thickness. The reference spectra is selected for particular spectra-based endpoint determination logic so that the target thickness is achieved when endpoint is called by applying the particular spectra-based endpoint logic. The method includes obtaining two or more current spectra. Each current spectrum is a spectrum of white light reflected from a film of interest on a second substrate when the film of interest is being subjected to a polishing step and has a current thickness that is greater than the target thickness. The method includes determining, for the second substrate, when an endpoint of the polishing step has been achieved.
摘要翻译： 用于基于频谱的终点的方法和装置。 一种终点方法包括选择两个或更多个参考光谱。 每个参考光谱是在第一衬底上从感兴趣的膜反射的白光的光谱，并且具有大于目标厚度的厚度。 为特定的基于光谱的端点确定逻辑选择参考光谱，以便通过应用特定的基于光谱的端点逻辑来调用端点时实现目标厚度。 该方法包括获得两个或更多个当前光谱。 每个电流光谱是当感兴趣的膜经受抛光步骤并且具有大于目标厚度的电流厚度时，在第二衬底上从感兴趣的膜反射的白光的光谱。 该方法包括为第二基底确定何时已经实现了抛光步骤的终点。
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公开(公告)号：US08518827B2
公开(公告)日：2013-08-27
申请号：US12843782
申请日：2010-07-26
IPC分类号： H01L21/302
CPC分类号： H01L22/26 , B24B37/013 , B24B37/205 , B24B49/08 , B24B49/12 , B24D7/14 , H01L21/30625 , H01L21/31053 , H01L21/31055 , H01L21/3212 , H01L21/67075 , H01L21/67092 , H01L21/67253
摘要： Methods and apparatus for spectrum-based endpointing. An endpointing method includes selecting a reference spectrum. The reference spectrum is a spectrum of white light reflected from a film of interest on a first substrate and has a thickness greater than a target thickness. The reference spectrum is empirically selected for particular spectrum-based endpoint determination logic so that the target thickness is achieved when endpoint is called by applying the particular spectrum-based endpoint logic. The method includes obtaining a current spectrum. The current spectrum is a spectrum of white light reflected from a film of interest on a second substrate when the film of interest is being subjected to a polishing step and has a current thickness that is greater than the target thickness. The method includes determining, for the second substrate, when an endpoint of the polishing step has been achieved. The determining is based on the reference and current spectra.
摘要翻译： 用于基于频谱的终点的方法和装置。 终点方法包括选择参考频谱。 参考光谱是在第一衬底上从感兴趣的膜反射的白光的光谱，并且具有大于目标厚度的厚度。 对于特定的基于频谱的端点确定逻辑，经验地选择参考频谱，使得当通过应用特定的基于频谱的端点逻辑来调用端点时实现目标厚度。 该方法包括获得当前频谱。 目前的光谱是当感兴趣的薄膜经受抛光步骤并且具有大于目标厚度的电流厚度时，在第二基板上从感兴趣的薄膜反射的白光的光谱。 该方法包括为第二基底确定何时已经实现了抛光步骤的终点。 该确定基于参考和当前光谱。
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公开(公告)号：US07406394B2
公开(公告)日：2008-07-29
申请号：US11261742
申请日：2005-10-28
CPC分类号： B24B49/12 , B24B37/013 , B24B37/205 , B24B49/08 , B24D7/14 , G05B15/02 , H01L21/31053 , H01L21/3212 , H01L22/26
摘要： Methods and apparatus for spectrum-based endpointing. An endpointing method includes selecting two or more reference spectra. Each reference spectrum is a spectrum of white light reflected from a film of interest on a first substrate and has a thickness greater than a target thickness. The reference spectra is selected for particular spectra-based endpoint determination logic so that the target thickness is achieved when endpoint is called by applying the particular spectra-based endpoint logic. The method includes obtaining two or more current spectra. Each current spectrum is a spectrum of white light reflected from a film of interest on a second substrate when the film of interest is being subjected to a polishing step and has a current thickness that is greater than the target thickness. The method includes determining, for the second substrate, when an endpoint of the polishing step has been achieved.
摘要翻译： 用于基于频谱的终点的方法和装置。 一种终点方法包括选择两个或更多个参考光谱。 每个参考光谱是在第一衬底上从感兴趣的膜反射的白光的光谱，并且具有大于目标厚度的厚度。 为特定的基于光谱的端点确定逻辑选择参考光谱，以便通过应用特定的基于光谱的端点逻辑来调用端点时实现目标厚度。 该方法包括获得两个或更多个当前光谱。 每个电流光谱是当感兴趣的膜经受抛光步骤并且具有大于目标厚度的电流厚度时，在第二衬底上从感兴趣的膜反射的白光的光谱。 该方法包括为第二基底确定何时已经实现了抛光步骤的终点。
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57.发明申请METHODS AND APPARATUS FOR MEASURING SUBSTRATE EDGE THICKNESS DURING POLISHING 有权用于在抛光期间测量衬底边缘厚度的方法和装置公开(公告)号：US20090262353A1
公开(公告)日：2009-10-22
申请号：US12425017
申请日：2009-04-16
CPC分类号： G01B11/0683 , B24B37/013 , B24B49/12 , G01B11/0625 , G01N21/55 , H01L22/12 , H01L22/26
摘要： Systems, methods and apparatus are provided for determining a substrate polishing endpoint. The invention includes a light source adapted to transmit light to an edge of a substrate; one or more detectors adapted to detect an arrangement of light reflected from the substrate edge; and a controller adapted to determine a polishing endpoint for the substrate edge based on the arrangement of reflected light. Numerous other aspects are provided.
摘要翻译： 提供了用于确定衬底抛光终点的系统，方法和装置。 本发明包括适于将光透射到衬底的边缘的光源; 一个或多个检测器，适于检测从衬底边缘反射的光的布置; 以及控制器，其适于基于反射光的布置确定衬底边缘的抛光端点。 提供了许多其他方面。
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公开(公告)号：US20170140525A1
公开(公告)日：2017-05-18
申请号：US14942777
申请日：2015-11-16
IPC分类号： G06T7/00 , G06F3/0486 , B24B37/013 , G06T7/40 , G06T5/00 , G06T5/50 , G06F3/0484 , H04N9/04
CPC分类号： G06T7/0006 , B24B37/013 , G06F3/04842 , G06F3/04847 , G06F3/0486 , G06T5/002 , G06T5/50 , G06T7/0004 , G06T2207/10024 , G06T2207/20024 , G06T2207/20216 , G06T2207/30148 , H04N9/04
摘要： A polishing system includes a polishing station including a platen to support a polishing pad, a support to hold a substrate, an in-line metrology station to measure the substrate before or after polishing of a surface of the substrate in the polishing station, and a controller. The in-line metrology station includes a color line-scan camera, a white light source, a frame supporting the light source and the camera, and a motor to cause relative motion between the camera and the support along a second axis perpendicular to the first axis to cause the light source and the camera to scan across the substrate. The controller is configured to receive a color data from the camera, to generate a 2-dimensional color image from the color data, and to control polishing at the polishing station based on the color image.
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59.发明授权Methods and apparatus for measuring substrate edge thickness during polishing 有权研磨过程中测量基材边缘厚度的方法和装置公开(公告)号：US08125654B2
公开(公告)日：2012-02-28
申请号：US12425017
申请日：2009-04-16
IPC分类号： G01B11/28
CPC分类号： G01B11/0683 , B24B37/013 , B24B49/12 , G01B11/0625 , G01N21/55 , H01L22/12 , H01L22/26
摘要： Systems, methods and apparatus are provided for determining a substrate polishing endpoint. The invention includes a light source adapted to transmit light to an edge of a substrate; one or more detectors adapted to detect an arrangement of light reflected from the substrate edge; and a controller adapted to determine a polishing endpoint for the substrate edge based on the arrangement of reflected light. Numerous other aspects are provided.
摘要翻译： 提供了用于确定衬底抛光终点的系统，方法和装置。 本发明包括适于将光透射到衬底的边缘的光源; 一个或多个检测器，适于检测从衬底边缘反射的光的布置; 以及控制器，其适于基于反射光的布置确定衬底边缘的抛光端点。 提供了许多其他方面。
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公开(公告)号：US08393933B2
公开(公告)日：2013-03-12
申请号：US12644972
申请日：2009-12-22
IPC分类号： B24B49/00
CPC分类号： B24B37/013 , B24B37/205 , B24B49/12
摘要： A polishing system includes a polishing pad having a solid light-transmissive window, an optical fiber having an end, and a spacer having a vertical aperture therethrough. A bottom surface of the spacer contacts the end of the optical fiber, a top surface of the spacer contacts the underside of the window, and the vertical aperture is aligned with the optical fiber.
摘要翻译： 抛光系统包括具有固体透光窗的抛光垫，具有一端的光纤和具有穿过其的垂直孔的间隔件。 间隔件的底表面接触光纤的端部，间隔件的顶表面接触窗的下侧，并且垂直孔与光纤对准。
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