公开(公告)号：US11901585B2

公开(公告)日：2024-02-13

申请号：US16953656

申请日：2020-11-20

Applicant: Apple Inc.

Inventor： Hoishun Li ,  Herng-Jeng Jou ,  James A. Yurko ,  Wai Man Raymund Kwok ,  Zechariah D. Feinberg ,  Daniel C. Wagman ,  Eric S. Jol ,  Hani Esmaeili

IPC: H01M50/531 ,  H01M10/0525 ,  C22C9/00 ,  C22C5/06 ,  B82Y30/00

CPC classification number: H01M50/531 ,  C22C5/06 ,  C22C9/00 ,  H01M10/0525 ,  B82Y30/00

Abstract: A method of forming a component can include electrochemically depositing a metallic material onto a carrier component to a thickness of greater than 50 microns. The metallic material can include crystal grains and at least 90% of the crystal grains can include nanotwin boundaries. The metallic material can include at least one of copper or silver.

公开(公告)号：US11700035B2

公开(公告)日：2023-07-11

申请号：US16920297

申请日：2020-07-02

Applicant: Apple Inc.

Inventor： Harish Rajagopalan ,  Bilgehan Avser ,  David Garrido Lopez ,  Forhad Hasnat ,  Mattia Pascolini ,  Mikal Askarian Amiri ,  Rodney A. Gomez Angulo ,  Thomas W. Yang ,  Jiechen Wu ,  Eric N. Nyland ,  Simone Paulotto ,  Jennifer M. Edwards ,  Matthew D. Hill ,  Ihtesham H. Chowdhury ,  David A. Hurrell ,  Siwen Yong ,  Jiangfeng Wu ,  Daniel C. Wagman ,  Soroush Akbarzadeh ,  Robert Scritzky ,  Subramanian Ramalingam

IPC: H01Q9/04 ,  H04B3/52 ,  G01R31/28 ,  H01Q1/22 ,  H01Q13/24 ,  H04B3/54

CPC classification number: H04B3/52 ,  G01R31/2822 ,  H01Q1/2283 ,  H01Q13/24 ,  H04B3/54

Abstract: An electronic device may be provided with an antenna module having a substrate. A phased antenna array of dielectric resonator antennas and a radio-frequency integrated circuit for the array may be mounted to one or more surfaces of the substrate. The dielectric resonator antennas may include dielectric columns excited by feed probes. The feed probes may be printed onto sidewalls of the dielectric columns or may be pressed against the sidewalls by biasing structures. A plastic substrate may be molded over each dielectric column and each of the feed probes in the array. The feed probes may cover multiple polarizations. The array may include elements for covering multiple frequency bands. The dielectric columns may be aligned a longitudinal axis and may be rotated at a non-zero and non-perpendicular angle with respect to the longitudinal axis.

公开(公告)号：US20200099166A1

公开(公告)日：2020-03-26

申请号：US16538755

申请日：2019-08-12

Applicant: Apple Inc.

Inventor： Hani Esmaeili ,  Holly M. Ubellacker ,  Daniel C. Wagman ,  Jason S. Sloey ,  Eric S. Jol

IPC: H01R13/533 ,  H01R13/03 ,  H01R13/504 ,  H01R13/66 ,  H01R43/02 ,  H01R43/16 ,  H01B1/02

Abstract: Connectors having contacts that can be highly corrosion resistant, can conserve precious materials, and can be readily manufactured. Examples can provide connector contacts that are highly corrosion resistant. These contacts can be formed of a precious metal or a precious-metal alloy. The precious-metal alloy can be a high-entropy alloy. To conserve the precious materials, a contact can be formed by a stamping a structure that becomes the contact, instead of stamping the contact from a structure. The structure can be a rod. To conserve the precious materials, only contacts that convey high voltages, such as power supplies, might be formed of the precious materials.

公开(公告)号：US10411379B2

公开(公告)日：2019-09-10

申请号：US15464051

申请日：2017-03-20

Applicant: Apple Inc.

Inventor： Daniel C. Wagman ,  Benjamin J. Kallman ,  Hani Esmaeili ,  Stefan A. Kowalski ,  Daniel T. McDonald ,  Eric S. Jol ,  Raymund W. M. Kwok ,  Michael W. Barnstead

IPC: H01R13/02 ,  H01R13/03 ,  H01R13/40 ,  B32B15/00 ,  C22C5/00 ,  C22C5/02 ,  C22C5/04 ,  C22C9/00 ,  C22C9/02 ,  C22C9/04 ,  C22C9/06 ,  H01R24/60

Abstract: Contacts that may be highly corrosion resistant, may be readily manufactured, and may conserve precious materials. One example may provide contacts having a layer of a precious-metal alloy to improve corrosion resistance. The precious-metal-alloy layer may be plated with a hard, durable, wear and corrosion resistant plating stack for further corrosion resistance and wear improvement. The resources consumed by a contact may be reduced by forming a bulk or substrate region of the contact using a more readily available material, such as copper or a material that is primarily copper based.

公开(公告)号：US20190272453A1

公开(公告)日：2019-09-05

申请号：US16123696

申请日：2018-09-06

Applicant: Apple Inc.

Inventor： Brian A. Argyres ,  Sherry Cao ,  Sawyer I. Cohen ,  Ibuki Kamei ,  Kenn I. Peterson ,  Jason S. Sloey ,  Daniel C. Wagman ,  Benjamin J. Pope ,  Tang Y. Tan ,  Richard Hung Minh Dinh

IPC: G06K13/08 ,  G06K7/00 ,  H01R27/00 ,  H01R13/24 ,  H04B1/3816 ,  H04M1/02

Abstract: A dual subscriber identity module (SIM) card connector is provided that includes a lower connector housing portion having a bottom surface and an upper connector housing portion having a top surface. The upper connector housing portion is coupled to the lower connector housing portion to define an opening for a receiving space between the upper and lower connector housing portions. The opening and receiving space are sized and shaped to slidably receive a SIM card tray. The connector includes a first plurality of electrical contacts disposed at the bottom surface of the lower connector housing portion and configured to make contact with a first SIM card disposed on a first side of the SIM card tray when the tray is received within the receiving space. The connector includes a second plurality of electrical contacts disposed at the top surface of the upper connector housing portion and configured to make contact with a second SIM card disposed on a second side of the SIM card tray opposite the first side when the tray is received within the receiving space.

公开(公告)号：US10236683B2

公开(公告)日：2019-03-19

申请号：US15256409

申请日：2016-09-02

Applicant: Apple Inc.

Inventor： Roderick D. Bacon ,  Nagendra Bage Jayaraj ,  Derek J. DiCarlo ,  Chi Kin Ho ,  Xingqun Li ,  Jahan C. Minoo ,  Surya Musunuri ,  Tony Chi Wang Ng ,  Carlos Ribas ,  Ching Yu John Tam ,  Evan J. Thompson ,  Daniel C. Wagman ,  Di Zhao ,  Robert D. Zupke

IPC: H02H9/04 ,  H01R13/66 ,  H01R13/713 ,  H01R24/60 ,  G06F13/40 ,  H04L12/40 ,  H01R107/00

Abstract: A voltage of a first pin that is one of several pins of an external connector of a system is measured, while the first pin is un-driven except for being pulled to ground through a first resistance, and a second pin of the external connector is being used as a power supply rail of the system. The measured voltage is compared to a short circuit threshold and in response to that threshold being exceeded, the power supply voltage on the second pin is reduced. In such an embodiment, no test stimulus needs to be applied to any of the pins of the external connector. Other embodiments are also described and claimed.

公开(公告)号：US10225637B2

公开(公告)日：2019-03-05

申请号：US15273691

申请日：2016-09-22

Applicant: Apple Inc.

Inventor： Lee M. Panecki ,  Marcus Albonico ,  Shannon X. Yang ,  Arun D. Chawan ,  Kurt Stiehl ,  Daniel C. Wagman ,  Rico L. Zörkendörfer ,  Benjamin A. Cousins ,  Daniel Max Strongwater ,  Eric S. Jol

IPC: H04R1/10 ,  H04R1/28 ,  H04R1/34 ,  B65D25/02 ,  B65D43/16 ,  H04R1/02 ,  H04B1/3888 ,  H04B5/00 ,  A45C11/24 ,  A45C13/10 ,  H04R9/02 ,  H04R9/06 ,  H02J7/00 ,  H02J7/02 ,  H01R13/52 ,  A45C11/00 ,  H04R5/033 ,  A45C13/02 ,  A45C13/00 ,  H04B1/3827 ,  H04M1/60 ,  F16B1/00

Abstract: A case for an earbud includes a receiving cavity sized and shaped to accept the earbud within the receiving cavity. The case includes one or more housing magnetic components configured to magnetically attract and secure the earbud within the receiving cavity.

公开(公告)号：US10199784B2

公开(公告)日：2019-02-05

申请号：US15686077

申请日：2017-08-24

Applicant: Apple Inc.

Inventor： Eric T. SooHoo ,  Robert A. Boyd ,  Daniel C. Wagman

IPC: H01R31/00 ,  H01R27/00 ,  H01R29/00 ,  H01R12/70 ,  H01R24/20 ,  H01R24/62 ,  H01R13/405 ,  H01R13/66 ,  H01R107/00

Abstract: A unidirectional cable connector that can be operatively connected between a host device and accessory device in the ecosystem of products. The cable includes first and second plug connectors at opposite ends of a wire where the two plug connectors share a common pinout but the insertion plug of the second connector is shortened in length as compared to the insertion plug of the first connector. The shortened plug prevents the second connector from being fully inserted into the host device that includes a standard depth receptacle connector, and thus prevents the second connector from being operatively coupled to the host device. The shortened plug can, however, be operatively connected with an electronic device having a shortened receptacle connector according to embodiments of the disclosure.

公开(公告)号：US10182282B2

公开(公告)日：2019-01-15

申请号：US15275364

申请日：2016-09-24

Applicant: Apple Inc.

Inventor： James L. McPeak ,  Chandrahas Aralaguppe Chandramohan ,  Rico L. Zörkendörfer ,  Lee M. Panecki ,  Darshan R. Kasar ,  Daniel C. Wagman ,  Zachary C. Rich

IPC: H04R1/10 ,  H02J7/00 ,  H02J7/02

Abstract: A case for a pair of earbuds includes a housing having cavities to receive the pair of earbuds and charging circuitry that is configured to initiate charging of the pair of earbuds when an earbud detector detects that the earbuds are inserted within the cavities.

公开(公告)号：US10097913B2

公开(公告)日：2018-10-09

申请号：US15273671

申请日：2016-09-22

Applicant: Apple Inc.

Inventor： Rico L. Zörkendörfer ,  Lee M. Panecki ,  James L. McPeak ,  Chandrahas Aralaguppe Chandramohan ,  Daniel C. Wagman ,  Zachary C. Rich ,  Darshan R. Kasar

IPC: H04R1/10 ,  H04R1/28 ,  H04R1/34 ,  B65D25/02 ,  B65D43/16 ,  H04R1/02 ,  H04B1/3888 ,  H04B5/00 ,  A45C11/24 ,  A45C13/10 ,  H04R9/02 ,  H04R9/06 ,  H02J7/00 ,  H02J7/02 ,  H01R13/52 ,  A45C11/00 ,  H04R5/033 ,  A45C13/02 ,  H04B1/3827 ,  H04M1/60 ,  F16B1/00

Abstract: A case for a pair of earbuds includes a housing having cavities to receive the pair of earbuds and charging circuitry that is configured to initiate charging of the pair of earbuds when an earbud detector detects that the earbuds are inserted within the cavities.