公开(公告)号：US20050243757A1

公开(公告)日：2005-11-03

申请号：US11060443

申请日：2005-02-18

Applicant: Kengo Yagyu ,  Shinji Takeda ,  Hidenori Aoki

Inventor： Kengo Yagyu ,  Shinji Takeda ,  Hidenori Aoki

IPC: H04L12/725 ,  H04L12/751 ,  H04W28/00 ,  H04W40/34 ,  H04W60/04 ,  H04W74/08 ,  H04W84/12 ,  H04W88/08 ,  H04W92/00 ,  H04Q7/00

CPC classification number: H04L45/00 ,  H04L12/4625 ,  H04L45/48 ,  H04W40/02 ,  H04W88/08 ,  Y02D70/142 ,  Y02D70/22 ,  Y02D70/30

Abstract: In a wireless packet transmission system that includes multiple wireless basestations and one or more wireless terminals belonging to one of the wireless basestations, transmission trees extending from two or more wireless basestations as root stations are used. Each of the wireless basestations has a tree table configured to record the root stations in association with the ID information about the transmission trees. When receiving a packet, each of the wireless basestations determines the transmission tree to be used for the packet transmission, and transmits the packet to a next node along the determined transmission tree.

Abstract translation: 在包括多个无线基站的无线分组传输系统和属于无线基站之一的一个或多个无线终端的情况下，使用从两个或多个无线基站作为根站延伸的传输树。 无线基站中的每一个具有树表，其被配置为与关于传输树的ID信息相关联地记录根站。 当接收到分组时，无线基站中的每一个确定要用于分组传输的传输树，并且将分组发送到沿着确定的传输树的下一个节点。

公开(公告)号：US20050237973A1

公开(公告)日：2005-10-27

申请号：US11105429

申请日：2005-04-14

Applicant: Shinji Takeda ,  Kengo Yagyu ,  Atsushi Fujiwara

Inventor： Shinji Takeda ,  Kengo Yagyu ,  Atsushi Fujiwara

IPC: H04L12/28 ,  H04W4/24 ,  H04W28/14 ,  H04W40/00 ,  H04W74/08 ,  H04W84/12 ,  H04W88/08 ,  H04W92/00 ,  H04Q7/00 ,  H04Q7/24 ,  H04Q7/28

CPC classification number: H04W40/12 ,  H04L45/124 ,  H04L45/125 ,  H04L45/127 ,  H04W4/24 ,  H04W28/14

Abstract: A wireless communications apparatus used in a wireless communications network consisting of multiple wireless communications apparatuses mutually connected via wireless links includes (a) a buffer configured to temporarily store information received from an adjacent wireless communications apparatus or a user terminal located under the wireless communications apparatus; (b) a routing control information processing unit that estimates a node cost representing traffic at the wireless communications apparatus and a link cost representing a radio condition of the link to determine a transmission route based on cost information reflecting both the node cost and the link cost; and (c) a routing control unit that designates a next hop to which information accumulated in the buffer is to be transmitted according to the determined transmission route.

Abstract translation: 在由经由无线链路相互连接的多个无线通信装置构成的无线通信网络中使用的无线通信装置包括：（a）缓冲器，被配置为临时存储从相邻无线通信装置或位于无线通信装置下方的用户终端接收的信息; （b）路由控制信息处理单元，其估计表示无线通信装置的业务的节点成本，以及表示链路的无线状态的链路成本，以基于反映节点成本和链路成本的成本信息来确定传输路由 ; 以及（c）路由控制单元，其根据所确定的传输路由指定要发送在缓冲器中的信息的下一跳。

公开(公告)号：US06641792B2

公开(公告)日：2003-11-04

申请号：US10270452

申请日：2002-10-15

Applicant: Shinji Takeda ,  Noriyuki Taguchi ,  Kazumi Kokaji ,  Osamu Hirai

Inventor： Shinji Takeda ,  Noriyuki Taguchi ,  Kazumi Kokaji ,  Osamu Hirai

IPC: D01F912

CPC classification number: B82Y30/00 ,  D01D5/24 ,  D01F9/12 ,  Y10S977/776 ,  Y10S977/788 ,  Y10S977/842 ,  Y10S977/846 ,  Y10T428/249953 ,  Y10T428/249971 ,  Y10T428/2913 ,  Y10T428/2918 ,  Y10T428/30

Abstract: Production of hollow carbon fibers and hollow carbon particles includes baking and carbonization of polymer particles having a specified volume after deformation. A metal-deposited carbon fiber with metal deposited inside and/or outside the hollow carbon fiber is applicable to electron discharge devices. The thickness and crystallinity of the graphite layer can be freely controlled. Since almost no by-product is generated, separation and refining using a solvent is not required. A hollow carbon particle of desired shape can be produced at a high yield rate. The hollow carbon fiber represented by a carbon nano-tube can be controlled in such a way that a low resistance and uniform shape are provided so that there is an increase in the amount of electrons discharged from the hollow carbon fiber. Use of this hollow carbon fiber as an electron discharge source provides an excellent electron discharge device characterized by stable pixels.

公开(公告)号：US5667899A

公开(公告)日：1997-09-16

申请号：US482516

申请日：1995-06-07

Applicant: Masami Yusa ,  Shinji Takeda ,  Takashi Masuko ,  Yasuo Miyadera ,  Mitsuo Yamazaki

Inventor： Masami Yusa ,  Shinji Takeda ,  Takashi Masuko ,  Yasuo Miyadera ,  Mitsuo Yamazaki

IPC: C08J5/18 ,  C08K3/08 ,  C08L79/08 ,  H01B1/22 ,  B32B27/18 ,  C09J7/00

CPC classification number: C08J5/18 ,  C08K3/08 ,  C08L79/08 ,  H01B1/22 ,  C08J2379/08 ,  Y10S428/901 ,  Y10S525/928 ,  Y10T428/24917 ,  Y10T428/25 ,  Y10T428/256 ,  Y10T428/31681 ,  Y10T428/31721

Abstract: An electrically conductive bonding film useful in bonding an IC or LSI with a lead frame. The film comprises (A) a polyimide resin obtained by reacting a tetracarboxylic dianhydride component, in which the content of a tetracarboxylic dianhydride represented by the following formula (I): ##STR1## wherein n stands for an integer of 2-20 amounts to at least 70 mole %, with a diamine; and (B) an electrically conductive filler. Optionally, the film may further comprises a thermosetting resin or an imide compound having at least two thermally-crosslinking imido groups per molecule.

Abstract translation: 用于将IC或LSI与引线框架接合的导电接合膜。 该膜包含（A）通过使四羧酸二酐组分反应得到的聚酰亚胺树脂，其中由下式（I）表示的四羧酸二酐的含量：其中n表示2-20的整数 至少70摩尔％，与二胺; 和（B）导电填料。 任选地，该膜还可以包含每分子具有至少两个热交联的酰亚胺基的热固性树脂或酰亚胺化合物。

公开(公告)号：US4869450A

公开(公告)日：1989-09-26

申请号：US302886

申请日：1989-01-30

Applicant: Shinji Takeda ,  Mitsuharu Hashimoto

Inventor： Shinji Takeda ,  Mitsuharu Hashimoto

IPC: F16K5/06

CPC classification number: F16K5/0678 ,  F16K5/0626 ,  Y10T137/0447 ,  Y10T137/6038 ,  Y10T403/7005

Abstract: A ball valve is provided which comprises a valve body formed from a tubular member with a cylindrical hole extending therethrough, a stem having one end thereof projecting into the hole, and a ball fixed to an end of the stem. The ball has a circular bore extending diametrically therethrough, wherein the ball is spherical in shape with removed chordal segments corresponding to the bore. A seat carrier is inserted in the hole, the seat carrier having one end adjacent the ball, a connecting sleeve contacts the seat carrier at the other end thereof opposite the end adjacent the ball, and a union nut couples the connecting sleeve to the valve body. Diametrically opposed projections are provided on the inner surface of the valve body, the projections extending into the hole, recesses formed on the side of the seat carrier adjacent the one end thereof, and diametrically opposed grooves are formed in the side of the seat carrier adjacent the recesses. The grooves extend in the circumferential direction from the adjacent recesses. When the seat carrier is inserted into the valve body and rotated therein, the projections on the valve body engage the grooves in the seat carrier to thereby hold the seat carrier in the valve body. Further, a flange is formed on the other end of the seat carrier wherein one of the flange and valve body includes at least one projection and the other of the flange and valve body includes at least one cavity. The projection is engaged in the cavity to prevent the rotation of the seat carrier with respect to the valve body.

Abstract translation: 提供一种球阀，其包括由具有延伸穿过其中的圆柱形孔的管状构件形成的阀体，其一端突出到孔中的杆和固定到杆的端部的球。 球具有直径从其中延伸的圆形孔，其中球是球形的，具有对应于孔的去除的弦节。 座位托架被插入孔中，座椅托架的一端靠近球，连接套与另一端相接触座椅托架，靠近球的端部，联管螺母将连接套筒连接到阀体上 。 在阀体的内表面上设置有直径相对的突起，延伸到孔中的突起，邻近其一端形成在座架的侧面上的凹部，并且在座椅支架的相邻侧面形成直径相对的槽 凹槽。 凹槽从相邻的凹部沿圆周方向延伸。 当座椅支架插入阀体并旋转时，阀体上的突起与座椅支架中的槽接合，从而将座椅支架保持在阀体中。 此外，凸缘形成在座架的另一端上，其中凸缘和阀体中的一个包括至少一个凸起，凸缘和阀体中的另一个包括至少一个空腔。 凸起接合在空腔中以防止座架相对于阀体旋转。

公开(公告)号：US4094725A

公开(公告)日：1978-06-13

申请号：US761906

申请日：1977-01-24

Applicant: Shinji Takeda ,  Noriyoshi Mitsui ,  Nobuharu Kato

Inventor： Shinji Takeda ,  Noriyoshi Mitsui ,  Nobuharu Kato

IPC: B29C53/00 ,  B29C65/00 ,  B29C65/10 ,  B29C65/20 ,  B29C65/78 ,  B32B31/00

CPC classification number: B29C66/54 ,  B29C65/103 ,  B29C65/20 ,  B29C66/73921 ,  B29C66/83221 ,  B29C66/9121 ,  B29C66/9141 ,  B29C66/91443 ,  B29C66/91643 ,  B29C66/919 ,  B29C66/91951 ,  B29C65/7847 ,  B29C66/71 ,  B29C66/9241 ,  B29C66/92655 ,  B29C66/94 ,  B29C66/9592 ,  B29C66/961

Abstract: A process for welding a pair of thermoplastic workpieces by hot gas ejecting, which includes the steps of (a) positioning a pair of works to be welded in opposed relation with each other, (b) positioning heat blast nozzles between the works, (c) ejecting heat blast from the nozzles to the opposed surfaces of the works, (d) retracting the nozzles from the position between the works (e) advancing one of the works to be in pressure contact with the other, and (f) pressurizing the two works for firmly combining the two.

Abstract translation: 一种通过热气体喷射焊接一对热塑性工件的方法，包括以下步骤：（a）将一对待焊接的工件彼此相对定位，（b）在工件之间定位热风喷嘴，（c 将喷嘴从喷嘴喷射到工件的相对表面，（d）从工件（e）之间的位置缩回喷嘴（e），使工件中的一个与另一个进行压力接触，以及（f） 两件作品牢牢结合两者。

公开(公告)号：US4094056A

公开(公告)日：1978-06-13

申请号：US773757

申请日：1977-03-02

Applicant: Shinji Takeda ,  Shoji Kobayashi ,  Yutaka Watanabe

Inventor： Shinji Takeda ,  Shoji Kobayashi ,  Yutaka Watanabe

IPC: B60R13/04 ,  B29B7/00 ,  B29C47/00 ,  B29C47/02 ,  B29C47/06 ,  B29C53/04 ,  B29C53/06 ,  B21D5/06 ,  B29F3/00

CPC classification number: B29C53/066 ,  B29C53/04 ,  B29C47/0019 ,  B29C47/0021 ,  B29C47/003 ,  B29C47/0038 ,  B29C47/0059 ,  B29C47/025 ,  B29C47/026 ,  B29C47/043 ,  B29C47/065 ,  Y10S29/033 ,  Y10T29/49982

Abstract: A process for forming a decorative trim strip by extruding a thermoplastic material around a continuous length of metal strip. The thermoplastic material is shaped with longitudinal grooves and when the strip is bent along the groove, the thermoplastic material on opposite sides of the grooves comes into contact. The strip is heated and the thermoplastic material in contact fuses to essentially eliminate the grooves.

Abstract translation: 通过在连续长度的金属条上挤出热塑性材料来形成装饰性饰条的方法。 热塑性材料成型为纵向凹槽，并且当条带沿着凹槽弯曲时，沟槽相对侧上的热塑性材料接触。 条带被加热并且接触的热塑性材料熔化以基本上消除凹槽。

公开(公告)号：US08574716B2

公开(公告)日：2013-11-05

申请号：US12613319

申请日：2009-11-05

Applicant: Yongxian Wu ,  Bun-ichiro Nakajima ,  Shinji Takeda ,  Iwao Fukuchi ,  Naoki Asano ,  Anthony H. Tsai

Inventor： Yongxian Wu ,  Bun-ichiro Nakajima ,  Shinji Takeda ,  Iwao Fukuchi ,  Naoki Asano ,  Anthony H. Tsai

IPC: B32B9/04 ,  B32B7/04 ,  B32B5/16 ,  C08G75/02 ,  B05D5/12

CPC classification number: F03G7/00 ,  C08J5/2256 ,  C08J2381/06 ,  F03G7/005 ,  H01B1/122 ,  H01M8/0289 ,  H01M8/1027 ,  H01M8/1032 ,  H01M8/1051 ,  H01M8/1053 ,  H01M8/1067 ,  H01M8/1081 ,  Y02P70/56 ,  Y10T156/10 ,  Y10T428/25 ,  Y10T428/254 ,  Y10T428/31504 ,  Y10T428/31533

Abstract: An ionic polymer composite device and methods for fabricating the ionic polymer composite device are provided. The ionic polymer composite device includes two extended electrode layers, each extended electrode layer including at least one ionic polymer with a plurality of electrically conductive particles, and a dielectric layer including at least one sulfonated poly ether sulfone polymer or a derivative between the two extended electrode layers.

Abstract translation: 提供一种离子聚合物复合器件和用于制造离子聚合物复合器件的方法。 离子聚合物复合器件包括两个延伸的电极层，每个延伸的电极层包括至少一种具有多个导电颗粒的离子聚合物，以及包含至少一种磺化聚醚砜聚合物或两个延伸电极之间的衍生物的介电层 层。

公开(公告)号：US20120125670A1

公开(公告)日：2012-05-24

申请号：US13388316

申请日：2010-08-02

Applicant: Takahiko Kato ,  Takashi Naito ,  Takuya Aoyagi ,  Hiroki Yamamoto ,  Masato Yoshida ,  Mitsuo Katayose ,  Shinji Takeda ,  Naotaka Tanaka ,  Shuichiro Adachi

Inventor： Takahiko Kato ,  Takashi Naito ,  Takuya Aoyagi ,  Hiroki Yamamoto ,  Masato Yoshida ,  Mitsuo Katayose ,  Shinji Takeda ,  Naotaka Tanaka ,  Shuichiro Adachi

IPC: H01B1/02 ,  B22F9/06 ,  H05K1/09

CPC classification number: H01L23/49883 ,  B22F1/0055 ,  B22F1/0074 ,  B22F1/02 ,  C22C1/0425 ,  C22C1/05 ,  H01B1/026 ,  H01J11/12 ,  H01J11/22 ,  H01J2211/225 ,  H01L21/4867 ,  H01L31/022425 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/092 ,  H05K3/4629 ,  H05K2201/0224 ,  H05K2203/0315 ,  Y02E10/50 ,  H01L2924/00

Abstract: In an electronic component having a wiring and/or an electrode prepared through firing of a paste or in an electronic component having a wiring in contact with a glass or glass ceramic member, provided is an electronic component using a Cu-based wiring material which less suffers from increase in electric resistance due to oxidation, which less causes bubbles in the glass or glass ceramic, and has satisfactory migration resistance. The Cu—Al alloy powder includes a Cu—Al alloy powder including Cu and, preferably, 50 percent by weight or less of Al; and an aluminum oxide film having a thickness of 80 nm or less and being present on the surface of the Cu—Al alloy powder. The powder, when compounded with a glass or glass ceramic material to give a paste, can be used to form wiring (interconnections), electrodes, and/or contact members.

Abstract translation: 在具有布线和/或通过烧制制成的电极的电子部件或具有与玻璃或玻璃陶瓷部件接触的布线的电子部件中的电子部件中，提供了使用Cu基布线材料的电子部件 由于氧化而导致的电阻增加，玻璃或玻璃陶瓷中的气泡较少，具有良好的耐迁移性。 Cu-Al合金粉末包括Cu-Cu合金粉末，优选为50重量％以下的Al; 以及Cu-Al合金粉末的表面上存在厚度为80nm以下的氧化铝膜。 当与玻璃或玻璃陶瓷材料混合以得到糊剂时，该粉末可用于形成布线（互连），电极和/或接触构件。

公开(公告)号：US07781896B2

公开(公告)日：2010-08-24

申请号：US12138637

申请日：2008-06-13

Applicant: Shinji Takeda ,  Takashi Masuko ,  Masami Yusa ,  Tooru Kikuchi ,  Yasuo Miyadera ,  Iwao Maekawa ,  Mitsuo Yamasaki ,  Akira Kageyama ,  Aizou Kaneda

Inventor： Shinji Takeda ,  Takashi Masuko ,  Masami Yusa ,  Tooru Kikuchi ,  Yasuo Miyadera ,  Iwao Maekawa ,  Mitsuo Yamasaki ,  Akira Kageyama ,  Aizou Kaneda

IPC: H01L23/48 ,  H01L21/00

CPC classification number: H01L24/27 ,  H01L23/49513 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/743 ,  H01L24/83 ,  H01L24/97 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/83805 ,  H01L2224/8385 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/181 ,  Y10T428/28 ,  H01L2924/00 ,  H01L2924/01014 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: A semiconductor chip is attached to a lead frame with a filmy organic die-bonding material having a water absorption of 1.5% by volume or less; having a saturation moisture absorption of 1.0% by volume or less, having a residual volatile component in an amount not more than 3.0% by weight, having a modulus of elasticity of 10 MPa or less at a temperature of 250° C. The semiconductor device thus obtained can be free from occurrence of reflow cracks during reflow soldering for the packaging of semiconductor devices.

Abstract translation: 将半导体芯片与吸水率为1.5体积％以下的薄膜状有机芯片接合材料贴合在引线框架上; 具有1.0体积％以下的饱和吸湿性，在250℃的温度下具有不大于3.0重量％的残留挥发组分，弹性模量为10MPa以下。半导体装置 这样获得的半导体器件的封装的回流焊接期间不会发生回流裂纹。