Abstract:
A plurality of word drivers are provided corresponding to a plurality of word lines. A switch band is provided between the plurality of word drivers and a plurality of row decoders. Each row decoder is connected to four word drivers through the switch band. The state of connection between each of the row decoders and the word driver can be changed by the switch band. A spare row decoder, four word drivers and four spare word lines are provided. Any of the row decoders can be replaced with the spare row decoder. Consequently, four spare word driver and four spare word lines can be selected instead of the four word drivers and four word lines connected to the row decoder.
Abstract:
In a block access memory, the memory cell array is divided into a plurality of blocks, one word line is selected based on the external address and the access to the memory cells connected thereto is carried out in one block and, simultaneously, one word line is selected based on the internally generated refresh address and the refresh of the memory cells connected to the word line is carried out in the other block.
Abstract:
A semiconductor memory comprises a data bit memory cell array (3), a check bit memory cell array (4), and an address decoder (19) which includes a switching circuit (20) for selectively accessing data from either the memory cell array (3) or (4). Decoding signals d.sub.l to d.sub.m are used for reading out data latched by a column address strobe (CAS) signal. The decoding signals are applied to either the memory cell array (3) or (4) through a group of switching elements selectively rendered conductive by complementary signals .phi. and .phi.. The logical values of the signals .phi. and .phi. change responsive to a change in the CAS signal state.
Abstract:
A semiconductor device formed on a semiconductor chip (1) comprises a plurality of first bonding pads (3a, 3d) for receiving an identical external signal, an internal circuit (8) connected to any one of the plurality of the first bonding pads, a second bonding pad (11) for receiving a control signal from outside the semiconductor chip, and a bonding pad selection switch (19) for selecting a bonding pad out of the plurality of first bonding pads and connecting it to the internal circuit in response to the control signal supplied thereto through the second bonding pad.
Abstract:
A dynamic RAM has dummy capacitors (C6, C7) having the same capacitance as a memory capacitor connected to a pair of bit lines (BL1, BL1), respectively. During an active period, respective dummy capacitors (C6, C7) are charged to the H level and L level, which are signal levels of the bit lines (BL1, BL1) and during precharge period, both dummy capacitors are equalized. Since both dummy capacitors (C6, C7) respectively connected to a pair of bit lines (BL1, BL1) are equalized during precharge period, so that the stored charge values of the dummy capacitors (C6, C7) both become the intermediate value of the ground level and supply potential level.
Abstract:
A semiconductor memory device is operable selectively in a page mode or a nibble mode, depending upon an external mode selection signal. In the page mode of operation a row address is supplied to the memory with subsequently supplied column addresses corresponding on a one-to-one basis with data to be stored into or read from memory. In the nibble mode of operation, the memory sequentially reads from or writes to four adjacent memory cells for each column address supplied.
Abstract:
Main bit lines MBL and ZMBL are disposed at opposite sides of a sense amplifier SA. Main bit lines MBL and ZMBL each are provided for paired sub-bit lines SBL1 and SBL2 (or SBL3 and SBL4). Sub-bit line pair SBL1 and SBL2 is connected to main bit line MBL via a block select switch T1. Sub-bit line pair SBL3 and SBL4 is connected to main bit line ZMBL via a block select switch T2. Since one main bit line is provided for two sub-bit lines, a pitch of the main bit lines is twice as large as a pitch of the sub-bit lines, so that conditions on the pitch of main bit lines are remarkably eased, which facilitates layout of elements.
Abstract:
A semiconductor memory device of folded bit line structure provided with a cross portion in at least one portion of each of bit line pairs so that values of coupling capacitance with adjacent bit line pairs are equal to each other with respect to the paired bit lines.Preferably, the respective bit line pairs are equally divided into 4N and the cross parts are provided at dividing points so that bit line pairs having the cross parts at the same dividing points are arranged on alternate pairs of bit lines.Preferably, the cross parts are provided in regions for forming restore circuits or sense amplifiers.More preferably, a dummy word line for selecting dummy cells for providing reference potential is selected by the position of a selected word line.
Abstract:
A cache DRAM (100) includes a DRAM memory array (11) accessed by a row address signal and a column address signal, an SRAM memory array (21) accessed by the column address signal, and an ECC circuit (30). The DRAM memory array (11) is divided into a plurality of blocks (B1 to B64), each including a plurality of columns. The SRAM memory array (21) includes 4 ways (W1 to W4). In determining a cache hit/cache miss, a column address signal is inputted. Consequently, the SRAM memory array (21) is accessed and data are read from each of the ways. When a cache hit occurs, one way is selected in response to an externally applied way address signal, and data from that way are outputted. When a cache miss occurs, the column address signal is latched and the row address signal is applied. The DRAM array (11) is accessed in accordance with the row address signal and the latched column address signal.
Abstract:
A semiconductor memory device of folded bit line structure provided with a cross portion in at least one portion of each of bit line pairs so that values of coupling capacitance with adjacent bit line pairs are equal to each other with respect to the paired bit lines.Preferably, the respective bit line pairs are equally divided into 4N and the cross parts are provided at dividing points so that bit line pairs having the cross parts at the same dividing points are arranged on alternate pairs of bit lines.Preferably, the cross parts are provided in regions for forming restore circuits or sense amplifiers.More preferably, a dummy word line for selecting dummy cells for providing reference potential is selected by the position of a selected word line.