摘要:
A test socket for testing a packaged semiconductor device. The test socket includes a test substrate, at least one support member, and at least one securing member. Terminals of the test substrate are electrically connectable to a testing device. The terminals may by located within recesses that are configured to receive leads. The shapes of each support member and securing member may be complementary to the respective shapes of the bottom and top surfaces of leads extending from the packaged semiconductor device. Upon placement of a packaged semiconductor device on the test substrate, the leads are aligned with and positioned against their corresponding terminals and the support member. The securing elements are then placed against the leads to bias each lead against its corresponding terminal.
摘要:
A method for storing a temperature threshold in an integrated circuit includes measuring operating parameters of the integrated circuit versus temperature, calculating a maximum temperature at which the integrated circuit performance exceeds predetermined specifications and storing parameters corresponding to the maximum temperature in a comparison circuit in the integrated circuit by selectively blowing fusable devices in the comparison circuit. The fusable devices may be antifuses. As a result, the integrated circuit is able to provide signals to devices external to the integrated circuit to indicate that the integrated circuit may be too hot to operate properly.
摘要:
An antifuse detection circuit is described which uses a latching circuit and two antifuses. The antifuses are coupled between the latch circuit and ground. The latching circuit described is a differential circuit which can detect which one of the two antifuses has been programmed. The circuit accurately detects an antifuse which has a relatively high resistance after being programmed.
摘要:
In a packetized memory device, row and column address paths receive row and column addresses from an address capture circuit. Each of the row and column address paths includes a respective address latch that latches the row or column address from the address capture circuitry, thereby freeing the address capture circuitry to capture a subsequent address. The latched row and column addresses are then provided to a combining circuit. Additionally, redundant row and column circuits receive these latched addresses and indicate to the combining circuit whether or not to substitute a redundant row. The combining circuit, responsive to a strobe then transfers the redundant row address or latched row address to a decoder to activate the array.
摘要:
A test circuit for a memory device having a pair of arrays each of which includes a plurality of memory cells arranged in rows and columns, and a pair of complimentary digit lines being provided for each column of each array. The digit lines are selectively coupled to a pair of I/O lines for each array which are, in turn, coupled to a pair of complimentary data lines. The data lines are coupled to respective inputs of a sense amplifier, one of which is provided for each array. A multiplexer connects the pair of I/O lines for either one of the arrays to the data lines in a normal operating mode. Thus, in the normal operating mode, data is selectively coupled to the inputs of the sense amplifier from the complimentary digit lines for an addressed column. In a test mode, the multiplexer connects an I/O line for one array to one of the data lines and an I/O line for the other array to the other data line. Thus, in the test mode, data is simultaneously coupled to the inputs of the sense amplifier from respective digit lines of two different columns, thereby increasing the rate at which test data that has been written to the arrays can be read from the arrays.
摘要:
A sense amplifier that amplifies data signals in either a normal mode or an altered mode. In the normal mode, the data signals must be complementary of each other while in the altered mode, the data signals may, but need not be, complementary of each other. The sense amplifier includes two sense amplifier stages, the first of which drives the second, and each sense amplifier stage includes two identical sense amplifier circuits. A first input of each sense amplifier in the first stage receives a respective data signal, and a first input of each sense amplifier in the second stage receives an output signal from a respective sense amplifier in the first stage. In the normal mode, a mode control circuit couples each of the other data signals to a respective second input of each sense amplifier in the first stage so that the sense amplifiers receive both of the complimentary data signals at their differential inputs. In the altered mode, the mode control circuit couples a reference voltage to the second inputs of the sense amplifiers in the first stage so that the sense amplifiers compare a respective data signal to the reference voltage. The mode control circuit also alters the operation of the second stage. In the normal mode, the mode control circuit couples an output signal from the other sense amplifier in the first stage to a respective second input of each sense amplifier in the second stage so that the sense amplifiers receive at their differential inputs both of the complimentary output signals from each sense amplifier in the first stage. In the altered mode, the mode control circuit couples a data signal to the respective second input of each sense amplifier in the second stage so that the sense amplifiers compare an output signal from a respective sense amplifier in the first stage to a respective data signal.
摘要:
An apparatus and method for repairing a semiconductor memory device includes a first memory cell array, a first redundant cell array and a repair circuit configured to nonvolatilely store a first address designating at least one defective memory cell in the first memory cell array. A first volatile cache stores a first cached address corresponding to the first address designating the at least one defective memory cell. The repair circuit distributes the first address designating the at least one defective memory cell of the first memory cell array to the first volatile cache. Match circuitry substitutes at least one redundant memory cell from the first redundant cell array for the at least one defective memory cell in the first memory cell array when a first memory access corresponds to the first cached address.
摘要:
Various embodiments include apparatus, systems, and methods having multiple dice arranged in a stack in which a defective cell may be replaced by a spare cell on the same die or a different die.
摘要:
An apparatus and method for repairing a semiconductor memory device includes a first memory cell array, a first redundant cell array and a repair circuit configured to nonvolatilely store a first address designating at least one defective memory cell in the first memory cell array. A first volatile cache stores a first cached address corresponding to the first address designating the at least one defective memory cell. The repair circuit distributes the first address designating the at least one defective memory cell of the first memory cell array to the first volatile cache. Match circuitry substitutes at least one redundant memory cell from the first redundant cell array for the at least one defective memory cell in the first memory cell array when a first memory access corresponds to the first cached address.
摘要:
An apparatus and method for repairing a semiconductor memory device includes a first memory cell array, a first redundant cell array and a repair circuit configured to nonvolatilely store a first address designating at least one defective memory cell in the first memory cell array. A first volatile cache stores a first cached address corresponding to the first address designating the at least one defective memory cell. The repair circuit distributes the first address designating the at least one defective memory cell of the first memory cell array to the first volatile cache. Match circuitry substitutes at least one redundant memory cell from the first redundant cell array for the at least one defective memory cell in the first memory cell array when a first memory access corresponds to the first cached address.