EXTERNAL-LEADWIRE CRIMPING APPARATUS
    513.
    发明申请

    公开(公告)号:US20170265341A1

    公开(公告)日:2017-09-14

    申请号:US15233995

    申请日:2016-08-11

    Abstract: An external-leadwire crimping apparatus is provided by embodiments of the present invention, including: a heating base provided with a heating rod and a temperature sensor; a crimping tool tip which is connected with the heating base and supplied with heat from the heating base, the crimping tool tip being configured to to crimp a leadwire of a flexible printed circuit board onto a printed circuit board assembly, by curing a conductive adhesive after receipt of heat, and the crimping tool tip comprising a crimping tool tip body. The crimping tool tip body is provided with at least one heat dissipation slot on an upper surface thereof, the heat dissipation slot being configured to extend in a thickness direction of the crimping tool tip body and to penetrate therethrough at both ends; and/or the crimping tool tip body is provided with at least one heat dissipation hole penetrating the thickness direction thereof. Thereby, aforementioned design with heat dissipation slots and/or heat dissipation holes solve a problem of uneven surface temperatures of the crimping tool tip caused by a transmission of most of the heat generated by the heating rod, directing towards a central position of the crimping tool tip, such that a uniformity of surface temperatures of the crimping tool tip is ensured to control a temperature difference between both left and right ends and a central portion of a lower surface of the crimping tool tip to be constrained within 10° C. so as to offer guarantee for a uniformity of reactions of the conductive adhesive, resulting in an enhanced crimping quality.

    TOUCH SUBSTRATE, MANUFACTURING METHOD THEREOF AND TOUCH DISPLAY PANEL

    公开(公告)号:US20170205911A1

    公开(公告)日:2017-07-20

    申请号:US15326404

    申请日:2016-03-01

    CPC classification number: G06F3/044 G06F3/041 G06F2203/04103

    Abstract: The embodiments of the invention provide a touch substrate, a manufacturing method thereof and a touch display panel. The touch substrate comprises a substrate, a photoresist layer and a touch electrode layer, the photoresist layer is located at the periphery of a first surface of the substrate, and the touch electrode layer is located on a second surface of the substrate. By forming the photoresist layer and the touch electrode layer on different surfaces of the substrate, the touch substrate provided in the embodiments of the invention can avoid the problem of wire breakage caused when the touch electrodes ascend in an edge region of the substrate, thereby improving the yield and the product performance of the touch substrate.

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