公开(公告)号：US20180184553A1

公开(公告)日：2018-06-28

申请号：US15735217

申请日：2015-06-30

申请人： FUJI MACHINE MFG. CO., LTD.

发明人： Kazuya DEGURA

IPC分类号： H05K13/00 ,  H05K13/08 ,  G06K7/14 ,  G06K7/10

CPC分类号： H05K13/0092 ,  G06K7/10722 ,  G06K7/1417 ,  H05K13/04 ,  H05K13/0473 ,  H05K13/08

摘要： In a cut and clinch device, movable section 122 is slidable with respect to main body section 120. The main body section is configured from main body first section 147, and main body second section 148 that is removably attached to the main body first section, and a first insertion hole is formed in the main body second section. The movable section is configured from movable first section 144, and movable second section 146 that is removably attached to the movable first section, and second insertion hole 136 is formed in the movable second section. A lead is cut by the movable section being slid with the lead inserted into the first insertion hole and the second insertion hole. In a device configured as such, recognition mark 230 is provided on the movable second section and the main body second section, and the types of the movable second section and the main body second section are recognized based on image data of the recognition marks. By this, it is possible to appropriately check the type of the portion that cuts a lead.

公开(公告)号：US20080035368A1

公开(公告)日：2008-02-14

申请号：US11500968

申请日：2006-08-09

申请人： Sen-Sung Lin

发明人： Sen-Sung Lin

IPC分类号： H05K1/03

CPC分类号： H01G13/006 ,  H05K13/0092

摘要： A chip holder board for carrying chips for covering with a silver glue is disclosed to have a metal board, which has arrays of transversely longitudinally aligned through holes cutting through the top and bottom walls thereof, and a flexible polymeric covering material covered over the top and bottom walls and the periphery of the inner diameter of each of the through holes of the metal board.

摘要翻译： 公开了一种用于承载用银胶覆盖的芯片的芯片保持板，具有金属板，该金属板具有穿过其顶壁和底壁切割的横向纵向排列的通孔的阵列，以及覆盖在顶部上的柔性聚合物覆盖材料， 底壁和金属板的每个通孔的内径的周边。

公开(公告)号：US06654658B2

公开(公告)日：2003-11-25

申请号：US09741130

申请日：2000-12-19

申请人： Paul Harris Hasten ,  Lew Wai Hong

发明人： Paul Harris Hasten ,  Lew Wai Hong

IPC分类号： B21F4500

CPC分类号： H05K13/0092

摘要： A system for conditioning a plurality of semiconductor leads of a semiconductor device is provided. The system includes an array of comb blades, where each comb blade terminates at a notch that allows the semiconductor leads to be moved laterally through the notch. A controller connected to the comb blades, such as through an intervening motor and comb blade support, causes the comb blades to move relative to the semiconductor device, such as by holding the semiconductor device stationary, so as to perform lateral and vertical conditioning of the semiconductor leads.

公开(公告)号：US20030192175A1

公开(公告)日：2003-10-16

申请号：US10435701

申请日：2003-05-08

发明人： Morley J. Weyerman

IPC分类号： H01R043/00 ,  B23P019/00

CPC分类号： H05K13/0092 ,  Y10T29/49117 ,  Y10T29/49121 ,  Y10T29/4914 ,  Y10T29/49156 ,  Y10T29/49181 ,  Y10T29/49218 ,  Y10T29/4922 ,  Y10T29/5136 ,  Y10T29/5137 ,  Y10T29/5138 ,  Y10T29/5139 ,  Y10T29/5142 ,  Y10T29/5147 ,  Y10T29/5148 ,  Y10T29/5149 ,  Y10T29/515 ,  Y10T29/5317 ,  Y10T29/53174 ,  Y10T29/53183 ,  Y10T29/53209 ,  Y10T29/53265 ,  Y10T83/04 ,  Y10T83/222

摘要： An apparatus and method are provided that increases the efficiency of material handling apparatus, such as those used to trim and form electrical leads on solid state electrical devices. The apparatus includes a plurality of rotatable pulleys, an endless belt capable of retaining devices to be processed that is disposed around the pulleys such that rotation of the pulleys will cause said belt to travel around said pulleys, and a plurality of paired tooling members, each of said, paired tooling members having first and second tooling members disposed on opposing sides of the belt and directly opposing so as to cooperate and perform a tooling operation on the leads when reciprocated toward each other along a common axis. In a preferred embodiment, two horizontally aligned pulleys with vertical axes of rotation are used to rotate the belt in a horizontal plane. The electrical devices are contained in a lead frame which is retained by pins on the belt which pass through indexing holes in the lead frame and the faces of the electrical devices are vertically oriented. The first and second tooling member are horizontally reciprocated by a common cam to perform the tooling operations on the electrical devices and the rotation of the belt is synchronized with the reciprocation of the tooling members. Alternatively, the first and second members can be driven by different cam drives that are synchronized in conjunction with the rotation of the pulleys and the relative orientation or the pulleys, the belt, and the electrical devices can be varied to accommodate specific tooling or spacing requirements.

摘要翻译： 提供了一种提高材料处理装置的效率的装置和方法，例如用于在固态电气装置上修整和形成电引线的装置和方法。 该设备包括多个可旋转的滑轮，环形带能够保持设置在滑轮周围的待处理装置，使得滑轮的旋转将导致所述皮带绕所述滑轮行进，并且多个成对的工具构件 所述成对的加工构件具有设置在带的相对侧上并且直接相对的第一和第二加工构件，以便沿着共同的轴线彼此往复运动来协作并执行对引线的加工操作。 在优选实施例中，使用具有垂直旋转轴线的两个水平对准的滑轮将水平面旋转。 电气装置包含在引线框架中，引线框架通过引导框架中的分度孔通过带上的引脚保持，并且电气设备的表面垂直定向。 第一和第二加工构件通过公共凸轮水平往复运动，以对电气装置进行加工操作，带的旋转与加工构件的往复运动同步。 或者，第一和第二构件可以由与滑轮的旋转同步的不同的凸轮驱动器驱动，并且可以改变相对方向或皮带轮，皮带和电气装置以适应特定的工具或间隔要求 。

公开(公告)号：US20030037946A1

公开(公告)日：2003-02-27

申请号：US09939115

申请日：2001-08-24

发明人： Patrick D. Boyd ,  Al La Valle ,  Jarett L. Rinaldi

IPC分类号： H02G003/08

CPC分类号： H05K3/301 ,  H05K13/0092

摘要： A component retention socket, which allows through-hole mount electronic components to be attached to a substrate in a stabilized, horizontal orientation, without requiring prior lead preparation (e.g., bending), wherein the component retention socket itself facilitates safe and easy lead bending.

摘要翻译： 部件保持插座，其允许通孔安装电子部件以稳定的水平取向附接到基板，而不需要先前的铅制备（例如弯曲），其中部件保持插座本身有助于安全且容易的引线弯曲。

公开(公告)号：US20020069522A1

公开(公告)日：2002-06-13

申请号：US10067967

申请日：2002-02-06

发明人： Morley J. Weyerman

IPC分类号： H01R043/00

CPC分类号： H05K13/0092 ,  Y10T29/49117 ,  Y10T29/49121 ,  Y10T29/4914 ,  Y10T29/49156 ,  Y10T29/49181 ,  Y10T29/49218 ,  Y10T29/4922 ,  Y10T29/5136 ,  Y10T29/5137 ,  Y10T29/5138 ,  Y10T29/5139 ,  Y10T29/5142 ,  Y10T29/5147 ,  Y10T29/5148 ,  Y10T29/5149 ,  Y10T29/515 ,  Y10T29/5317 ,  Y10T29/53174 ,  Y10T29/53183 ,  Y10T29/53209 ,  Y10T29/53265 ,  Y10T83/04 ,  Y10T83/222

摘要： A method of processing a leadframe strip defining a first row of alignment holes and a second row of alignment holes. One embodiment of the method comprises allowing incremental advancement of said leadframe strip using said first row of alignment holes and refraining from using said second row of alignment holes to allow said advancement.

摘要翻译： 一种处理定义第一排对准孔和第二排对准孔的引线框条的方法。 该方法的一个实施例包括允许使用所述第一排对准孔对所述引线框带进行增量前进，并且避免使用所述第二排对准孔来允许所述前进。

公开(公告)号：US06323544B1

公开(公告)日：2001-11-27

申请号：US09263320

申请日：1999-03-05

申请人： Andrea Giovanni Cigada ,  Fulvio Silvio Tondelli

发明人： Andrea Giovanni Cigada ,  Fulvio Silvio Tondelli

IPC分类号： H01L23495

CPC分类号： H01L21/4842 ,  H01L23/49582 ,  H01L24/97 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/14 ,  H05K3/3426 ,  H05K13/0092 ,  Y02P70/613 ,  H01L2224/45099 ,  H01L2924/00

摘要： A metal frame patterned by die stamping has the outermost end portion of each patterned pin extending freely, without constraints, from a line of metal bridge connections (dam bar). The end face of each pin is also covered, as well as other surfaces of the frame, by a coating layer or multilayer of metals different from the metal of the die stamped frame. The coating layer or multilayer contains at least on its outer surface, a noble metal such as palladium or gold. The tip of the pins are not subject to cutting and/or trimming after plating the die stamped frame. The pins are not even cut or trimmed during separation of the patterned frame from the surrounding metal at the end of the encapsulation process, when the pins are then eventually bent into shape.

摘要翻译： 通过模具冲压图案化的金属框架具有每个图案化的销的最外端部分，无限制地从一条金属桥连接线（坝条）延伸。 每个销的端面也被框架的其它表面以及不同于冲压模具框架的金属的涂层或多层金属覆盖。 涂层或多层至少在其外表面上含有贵金属如钯或金。 在电镀模具冲压框架之后，销的顶端不进行切割和/或修剪。 在封装过程结束时，图案化的框架与周围的金属分离时，这些销钉甚至不会被切割或修剪，然后当销钉最终弯曲成形时。

公开(公告)号：US20010041385A1

公开(公告)日：2001-11-15

申请号：US09899461

申请日：2001-07-05

申请人： STMicroelectronics S.r.I.

发明人： Andrea Giovanni Cigada ,  Fulvio Silvio Tondelli

IPC分类号： H01L021/44 ,  H01L021/48 ,  H01L021/50

CPC分类号： H01L21/4842 ,  H01L23/49582 ,  H01L24/97 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/14 ,  H05K3/3426 ,  H05K13/0092 ,  Y02P70/613 ,  H01L2224/45099 ,  H01L2924/00

摘要： A metal frame patterned by die stamping has the outermost end portion of each patterned pin extending freely, without constraints, from a line of metal bridge connections (dam bar). The end face of each pin is also covered, as well as other surfaces of the frame, by a coating layer or multilayer of metals different from the metal of the die stamped frame. The coating layer or multilayer contains at least on its outer surface, a noble metal such as palladium or gold. The tip of the pins are not subject to cutting and/or trimming after plating the die stamped frame. The pins are not even cut or trimmed during separation of the patterned frame from the surrounding metal at the end of the encapsulation process, when the pins are then eventually bent into shape.

公开(公告)号：US5979510A

公开(公告)日：1999-11-09

申请号：US25170

申请日：1998-02-18

申请人： Ernest J. Hamilton

发明人： Ernest J. Hamilton

IPC分类号： H05K13/00 ,  B21F1/00

CPC分类号： H05K13/0092

摘要： A pivot punch that has no explicit pivot point. In one embodiment, the tool includes a die, a punch holder pressable along a path toward the die and a punch supported by the punch holder. The punch extends through and is pivotable in an opening in the holder to move the lower part of the punch laterally toward the center of the die. In another embodiment, the upper part of the punch is held tightly in the holder. The lower part of the punch is flexible to move laterally toward the center of the die. A pivot punch that has no explicit pivot point. The punch is flexible and the punch pivot is permitted by the flexibility of the punch.

摘要翻译： 没有明确的枢轴点的枢轴冲头。 在一个实施例中，该工具包括模具，可沿着朝向模具的路径压入的冲头架和由冲头保持器支撑的冲头。 冲头延伸穿过并可在保持件的开口中枢转，以使冲头的下部横向朝向模具的中心移动。 在另一个实施例中，冲头的上部紧紧地保持在保持器中。 冲头的下部是柔性的，以朝向模具的中心横向移动。 没有明确的枢轴点的枢轴冲头。 冲头是柔性的，并且冲头枢轴允许冲头的柔性。

公开(公告)号：US5826630A

公开(公告)日：1998-10-27

申请号：US936860

申请日：1997-09-24

申请人： Troy D. Moore ,  Dennis M. Botkin

发明人： Troy D. Moore ,  Dennis M. Botkin

IPC分类号： H05K13/00 ,  B21F1/02

CPC分类号： H05K13/0092

摘要： An electronic device package lead conditioning method and system corrects bowed-in J-leads (36) of an electronic device package (30) by inserting between a bowed-in J-lead (36) and electronic device package (36) a comb-like tooth (42) having a graduating-width edge, the graduating width edge graduating from a minimum width (112) to a maximum width (114). The minimum width permits the graduating width edge (112) to be inserted into a space (110) separating the bowed-in J-lead (36) from electronic device package (30). The maximum width (114) at least equals the width of a desired spacing for the bowed-in J-lead (36) from the electronic device package (30) for correcting for the bowed-in-condition of the bowed-in J-lead (36).

摘要翻译： 电子装置封装引线调节方法和系统通过在弓形J引线（36）和电子器件封装（36）之间插入梳状引线（36）来校正电子器件封装（30）的弓形J引线（36） 具有渐变宽度边缘的类似齿（42），从最小宽度（112）到最大宽度（114）渐变的渐变宽度边缘。 最小宽度允许将渐变宽度边缘（112）插入将弓形J引线（36）与电子设备封装（30）分离的空间（110）中。 最大宽度（114）至少等于来自电子装置封装（30）的弓形J引线（36）的期望间隔的宽度，用于校正弓形J形引线的弯曲状态。 铅（36）。