公开(公告)号：US06654658B2

公开(公告)日：2003-11-25

申请号：US09741130

申请日：2000-12-19

申请人： Paul Harris Hasten ,  Lew Wai Hong

发明人： Paul Harris Hasten ,  Lew Wai Hong

IPC分类号： B21F4500

CPC分类号： H05K13/0092

摘要： A system for conditioning a plurality of semiconductor leads of a semiconductor device is provided. The system includes an array of comb blades, where each comb blade terminates at a notch that allows the semiconductor leads to be moved laterally through the notch. A controller connected to the comb blades, such as through an intervening motor and comb blade support, causes the comb blades to move relative to the semiconductor device, such as by holding the semiconductor device stationary, so as to perform lateral and vertical conditioning of the semiconductor leads.

公开(公告)号：US5956134A

公开(公告)日：1999-09-21

申请号：US69056

申请日：1998-04-28

申请人： Rajiv Roy ,  Michael D. Glucksman ,  Weerakiat Wahawisan ,  Paul Harris Hasten ,  Charles Kenneth Harris ,  George Charles Epp

发明人： Rajiv Roy ,  Michael D. Glucksman ,  Weerakiat Wahawisan ,  Paul Harris Hasten ,  Charles Kenneth Harris ,  George Charles Epp

IPC分类号： G01B11/00 ,  G01B11/24 ,  G01B11/245 ,  G01N21/88 ,  H05K13/08

CPC分类号： G01N21/88 ,  H05K13/08

摘要： A system for transporting and inspecting, seriatim, semiconductor devices with plural prong type or solder ball type leads includes a head for transporting the semiconductor devices from one support structure, such as a tray or tube, to a second support structure, such as a tray or tape, and wherein two dimensional and three dimensional measurements of the positional accuracy of the leads is carried out during the transport process. The inspection apparatus is interposed in the transport path and includes a first optical sensor such as a CCD camera oriented to capture a two dimensional image of the semiconductor device package and compare the image with a predetermined two dimensional image store in a central processing unit (CPU). A high intensity light source, such as a laser, generates a plane of light which is reflected off of the semiconductor device leads to a second optical sensor, also comprising a CCD camera, wherein a so-called three dimensional image is generated to be compared by the CPU with predetermined or calculated positional relationships of the leads to establish coplanarity of the lead tips, or lack thereof. The system includes a sensor located such that the semiconductor device is centered in a field of view of the cameras to capture the respective images. The transport head may be rotated to correct for improper positioning of the device prior to generation of the three dimensional image. The system may interchangeably inspect semiconductor device packages with prong leads extending from one or all sides of a rectangular substrate as well an array of solder ball leads supported on a substrate. A modified arrangement of the inspection system is adapted for inspecting multiple semiconductor devices with solder ball leads and supported on wafer type substrates.

摘要翻译： 用于运输和检查具有多个叉型或焊球型引线的半导体器件的系统包括用于将半导体器件从诸如托盘或管的一个支撑结构传送到诸如托盘的第二支撑结构的头部 或胶带，并且其中在传送过程中执行引线的位置精度的二维和三维测量。 检查装置插入传送路径中，并且包括第一光学传感器，例如CCD照相机，其定向为捕获半导体器件封装的二维图像，并将图像与预定的二维图像存储在中央处理单元（CPU ）。 诸如激光器的高强度光源产生从半导体器件反射的光的平面引导到还包括CCD照相机的第二光学传感器，其中产生所谓的三维图像以进行比较 通过CPU以预定或计算的引线的位置关系来建立引线尖端的共面性，或者缺少引线。 该系统包括传感器，其被定位成使得半导体器件在照相机的视场中居中以捕获相应的图像。 在产生三维图像之前，传送头可被旋转以校正装置的不正确定位。 该系统可以互换地检查半导体器件封装，其具有从矩形衬底的一个或所有侧面延伸的尖头引线以及支撑在衬底上的焊球引线的阵列。 检查系统的改进布置适于用焊球引线检查多个半导体器件并且支撑在晶片型衬底上。