Abstract:
An infrared sensor includes a stem, a thermopile element disposed on a component-mounting surface of the stem, a case for covering the thermopile element, an inner cap that covers the thermopile element in order to shield infrared rays generated by secondary emission from an inside surface of the case, and a thermo-sensing element disposed inside the inner cap. In the infrared sensor, the case includes an infrared ray transmitting window for transmitting infrared rays radiating from an object. The inner cap is thermally coupled to the stem by being disposed on the component-mounting surface of the stem, and includes an opening for passing the infrared rays from the infrared ray transmitting window of the case towards the thermopile element. The thermopile element is disposed inside a recess in the component-mounting surface or so as to be substantially surrounded by a highly thermally conductive substrate disposed on the component-mounting surface.
Abstract:
A temperature sensor utilizing optical temperature measuring techniques is constructed to make firm contact with a surface whose temperature is being measured, an example application being the monitoring of semiconductor wafers or flat panel displays while being processed. A cap is mounted near but spaced apart from an end of a lightwave guide, with a resilient element that applies force of the cap against a surface whose temperature is being measured as the cap is urged toward the optical fiber end. An optical temperature sensing element, such as luminescent material or a surface of known emissivity, is carried within the cap. A bellows with a closed end conveniently serves as both the cap and the resilient element. An alternative temperature measuring device installs an optical temperature sensing material within a test substrate behind an optical window, and then views the sensing material through the window.
Abstract:
In a visible/infrared imaging camera comprising lightwave separating means for separating light into visible and infrared light components, and visible and infrared light camera units for capturing visible and infrared light images formed by the visible and infrared light components, respectively, the infrared light camera unit is supported so as to be movable axially of the infrared light component emitted from the lightwave separating means, thereby adjusting the focusing of the infrared light image.
Abstract:
A thermal infrared detector has a substrate having a readout circuit and a plurality of pixels patterned on the substrate at a pitch p in the range of 15nullpnull50 (nullm). Each of the pixels has a photo-sensitive area including a thin film of bolometer and spaced from the substrate, two beams by which the photo-sensitive area is supported on the substrate, and interconnections formed respectively on the beams and connecting the readout circuit and the thin film of bolometer to each other. The length of each of the beams is determined in view of the patterning accuracy of a stepper used to produce the thermal infrared detector, based on the beam length index which is calculated by dividing the length of each of the beams by one-quarter of the peripheral length of the pixel. The beam length index is given by an approximate expression using the pixel pitch as a parameter, determined depending on the thermal conductivity of the interconnection material, etc. based on an equation representing temperature resolution.
Abstract:
Microbolometer circuitry and methods are disclosed to allow an individual microbolometer or groups of microbolometers, such as a microbolometer focal plane array, to operate over a wide temperature range. Temperature compensation is provided, such as through circuitry and/or calibration methods, to reduce non-uniform behavior over the desired operating temperatures. For example, the relative mismatch in the temperature coefficient of resistance of an active microbolometer and a reference microbolometer is compensated by employing a variable resistor in series with the active microbolometer. The variable resistor can be calibrated over the desired temperature range to minimize the affect of the relative mismatch. Various other circuit implementations, calibration methods, and processing of the microbolometer circuit output can be employed to provide further compensation.
Abstract:
A method and apparatus for correction of temperature-induced variations in the analog output characteristics of a microbolometer detector in an infrared detecting focal plane array utilizing electronic means to correct for the temperature variation of the individual microbolometer detector. The electronic circuitry and associated software necessary for implementation is also described.
Abstract:
A method and apparatus for measuring the core temperature of an animal or human. Emissions from the eyeball are detected, at one or more wavelengths selected on the basis of various factors, including the ability of that wavelength to reach the interior of the eyeball. An illumination marker shines a spot of light on the eyeball, such that the spot corresponds to the area from which emissions are being detected.
Abstract:
This invention is a micromachined sensor pixel structure that can be fabricated either as a discrete sensor or in array form with application to thermal sensing of radiation received from various wavelength emitters. The transmissivity of a thermally-isolated microplatform is a sensitive function of temperature. This transmissivity is modulated by incident radiation from sources including infrared sources. The transmissivity of a micromachined structure is interrogated by means of an optical carrier. Readout is obtained by means of conventional silicon optical sensers or imagers. A multiplicity of micromachined pixels can be tailored for specific wavelengths permitting the array to operate as a multispectral imager with windows ranging from ultraviolet to millimeter wavelengths.
Abstract:
A sensor for measuring a temperature by means of a heat-sensitive area applied onto and/or underneath a membrane, the membrane being arranged above a recess. The recess is etched by a reactive ion etching method such that it is fully defined laterally by side walls arranged at an angle between 80null and 100null relative to the membrane, adjoining side walls being arranged at an angle of at least 40null relative to one another.
Abstract:
A Fabry-Perot filter device for selectively transmitting three wavelength bands of infrared radiation, including a reference light band, wherein the filter device comprises a fixed mirror formed on a substrate; a movable mirror arranged opposite to the fixed mirror with a gap formed therebetween so that the movable mirror is displaced with respect to the fixed mirror by applying an external force; a fixed electrode formed on the fixed mirror; and a movable electrode formed on the movable mirror and arranged opposite to the fixed electrode wherein the movable electrode is displaced by applying a potential difference across the fixed and movable electrodes so that the width of the gap is varied in at least three steps, whereby at least three wavelength bands of infrared radiation are selectively transmitted through the filter device.