公开(公告)号：US20030222218A1

公开(公告)日：2003-12-04

申请号：US10448047

申请日：2003-05-30

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Shinya Nozu

IPC: G01J005/00

CPC classification number: G01J5/06 ,  G01J5/16 ,  H01L2224/48091 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An infrared sensor includes a stem, a thermopile element disposed on a component-mounting surface of the stem, a case for covering the thermopile element, an inner cap that covers the thermopile element in order to shield infrared rays generated by secondary emission from an inside surface of the case, and a thermo-sensing element disposed inside the inner cap. In the infrared sensor, the case includes an infrared ray transmitting window for transmitting infrared rays radiating from an object. The inner cap is thermally coupled to the stem by being disposed on the component-mounting surface of the stem, and includes an opening for passing the infrared rays from the infrared ray transmitting window of the case towards the thermopile element. The thermopile element is disposed inside a recess in the component-mounting surface or so as to be substantially surrounded by a highly thermally conductive substrate disposed on the component-mounting surface.

Abstract translation: 一种红外线传感器，包括：杆，设置在杆的部件安装表面上的热电堆元件，用于覆盖热电堆元件的壳体;覆盖热电堆元件的内盖，以便屏蔽来自内部的二次发射产生的红外线 壳体的表面和设置在内盖内部的热敏元件。 在红外传感器中，壳体包括用于发射从物体辐射的红外线的红外线传输窗口。 内盖通过设置在杆的部件安装表面上而热连接到杆上，并且包括用于将来自壳体的红外线传输窗口的红外线传递到热电堆元件的开口。 热电堆元件设置在部件安装表面中的凹部内，或者被设置在部件安装表面上的高导热性基板基本包围。